Yoshimi Nakase

Person

Anjo-city, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Molded semiconductor device with heat conducting members
- Patent number 7,247,929
- Issue date Jul 24, 2007
- Denso Corporation
- Shoji Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having heat radiation plate and bonding member
- Patent number 7,239,016
- Issue date Jul 3, 2007
- Denso Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having metal plates and semiconductor chip
- Patent number 7,215,020
- Issue date May 8, 2007
- Denso Corporation
- Yoshimi Nakase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer-molded power device and method for manufacturing transfer-...
- Patent number 7,145,254
- Issue date Dec 5, 2006
- Denso Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,091,603
- Issue date Aug 15, 2006
- Denso Corporation
- Kuniaki Mamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus with heat radiation structure for removing...
- Patent number 7,009,284
- Issue date Mar 7, 2006
- Denso Corporation
- Yoshimi Nakase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package type semiconductor device
- Patent number 7,009,292
- Issue date Mar 7, 2006
- Denso Corporation
- Shoji Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having radiation structure
- Patent number 6,998,707
- Issue date Feb 14, 2006
- Denso Corporation
- Yutaka Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stick-type ignition coil having improved structure against crack or...
- Patent number 6,995,644
- Issue date Feb 7, 2006
- Denso Corporation
- Kazuhide Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stick-type ignition coil having improved structure against crack or...
- Patent number 6,930,583
- Issue date Aug 16, 2005
- Denso Corporation
- Kazuhide Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor power device having heat sinks exposed on one...
- Patent number 6,917,103
- Issue date Jul 12, 2005
- Denso Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor power device having heat sinks exposed on one...
- Patent number 6,787,898
- Issue date Sep 7, 2004
- Denso Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having radiation structure
- Patent number 6,703,707
- Issue date Mar 9, 2004
- Denso Corporation
- Kuniaki Mamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having radiation structure and method for manu...
- Patent number 6,693,350
- Issue date Feb 17, 2004
- Denso Corporation
- Takanori Teshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus with heat radiation structure for removing...
- Patent number 6,538,308
- Issue date Mar 25, 2003
- Denso Corporation
- Yoshimi Nakase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stick-type ignition coil having improved structure against crack or...
- Patent number 6,208,231
- Issue date Mar 27, 2001
- Denso Corporation
- Kazutoyo Oosuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ignition coil for internal combustion engine
- Patent number 5,170,767
- Issue date Dec 15, 1992
- Nippondenso Co., Ltd.
- Jyun-ichi Wada
- F02 - COMBUSTION ENGINES HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor equipment having a pair of heat radiation plates
- Publication number 20060055056
- Publication date Mar 16, 2006
- DENSO Corporation
- Shoji Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stick-type ignition coil having improved structure against crack or...
- Publication number 20050212636
- Publication date Sep 29, 2005
- DENSO CORPORATION
- Kazuhide Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing connection construction
- Publication number 20050156324
- Publication date Jul 21, 2005
- DENSO CORPORATION & TOYOTA JIDOSHA KABUSHIKI KAISHA
- Yoshimi Nakase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20050145999
- Publication date Jul 7, 2005
- DENSO Corporation
- Kuniaki Mamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having metal plates and semiconductor chip
- Publication number 20050093131
- Publication date May 5, 2005
- Yoshimi Nakase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having heat radiation plate and bonding member
- Publication number 20050077617
- Publication date Apr 14, 2005
- DENSO Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stick-type ignition coil having improved structure against crack or...
- Publication number 20050077990
- Publication date Apr 14, 2005
- DENSO Corporation
- Kazuhide Kawai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package type semiconductor device
- Publication number 20050077599
- Publication date Apr 14, 2005
- DENSO Corporation
- Shoji Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20040195649
- Publication date Oct 7, 2004
- DENSO Corporation
- Shoji Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having radiation structure
- Publication number 20040097082
- Publication date May 20, 2004
- Kuniaki Mamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having radiation structure
- Publication number 20040089925
- Publication date May 13, 2004
- Yutaka Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having radiation structure
- Publication number 20040089941
- Publication date May 13, 2004
- Kuniaki Mamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having radiation structure and method for manu...
- Publication number 20030132530
- Publication date Jul 17, 2003
- Takanori Teshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor power device
- Publication number 20030122232
- Publication date Jul 3, 2003
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor apparatus with heat radiation structure for removing...
- Publication number 20030075784
- Publication date Apr 24, 2003
- Yoshimi Nakase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transfer-molded power device and method for manufacturing transfer-...
- Publication number 20030022464
- Publication date Jan 30, 2003
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS

Yoshimi Nakase

Person

Patents Grantslast 30 patents

Molded semiconductor device with heat conducting members

Semiconductor device having heat radiation plate and bonding member

Semiconductor device having metal plates and semiconductor chip

Transfer-molded power device and method for manufacturing transfer-...

Semiconductor device

Semiconductor apparatus with heat radiation structure for removing...

Package type semiconductor device

Semiconductor device having radiation structure

Stick-type ignition coil having improved structure against crack or...

Stick-type ignition coil having improved structure against crack or...

Molded semiconductor power device having heat sinks exposed on one...

Molded semiconductor power device having heat sinks exposed on one...

Semiconductor device having radiation structure

Semiconductor device having radiation structure and method for manu...

Semiconductor apparatus with heat radiation structure for removing...

Stick-type ignition coil having improved structure against crack or...

Ignition coil for internal combustion engine

Patents Applicationslast 30 patents

Semiconductor equipment having a pair of heat radiation plates

Stick-type ignition coil having improved structure against crack or...

Method for manufacturing connection construction

Semiconductor device

Semiconductor device having metal plates and semiconductor chip

Semiconductor device having heat radiation plate and bonding member

Stick-type ignition coil having improved structure against crack or...

Package type semiconductor device

Semiconductor device

Semiconductor device having radiation structure

Semiconductor device having radiation structure

Semiconductor device having radiation structure

Semiconductor device having radiation structure and method for manu...

Semiconductor power device

Semiconductor apparatus with heat radiation structure for removing...

Transfer-molded power device and method for manufacturing transfer-...