Yoshimichi Ishii

Person

  • Neyagawa, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Component assembling method and component assembling apparatus

    • Patent number 6,389,672
    • Issue date May 21, 2002
    • Matsushita Electric Industrial Co., Ltd.
    • Yoshimichi Ishii
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Parts arranger

    • Patent number 5,826,697
    • Issue date Oct 27, 1998
    • Matsushita Electric Industrial Co., Ltd.
    • Hiroyuki Mochizuki
    • B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
  • Information Patent Grant

    Component holder body

    • Patent number 5,727,688
    • Issue date Mar 17, 1998
    • Matsushita Electric Industrial Co., Ltd.
    • Yoshimichi Ishii
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR