TREA

Yoshimitsu Terakado

Follow

Person

  • Hachioji, JP
People

Patents Grantslast 30 patents

  • Information Patent Grant

    Workpiece holding device for a bonding apparatus
    • Patent number 6,645,346
    • Issue date Nov 11, 2003
    • Kabushiki Kaisha Shinkawa
    • Tatsunari Mii
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wire bonding apparatus
    • Patent number 6,595,400
    • Issue date Jul 22, 2003
    • Kabushiki Kaisha Shinkawa
    • Yoshimitsu Terakado
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding apparatus
    • Patent number 6,502,738
    • Issue date Jan 7, 2003
    • Kabushiki Kaisha Shinkawa
    • Tooru Mochida
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding apparatus
    • Patent number 6,491,203
    • Issue date Dec 10, 2002
    • Kabushiki Kaisha Shinkawa
    • Yoshimitsu Terakado
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Spool holder structure for a wire bonder
    • Patent number 6,439,496
    • Issue date Aug 27, 2002
    • Kabushiki Kaisha Shinkawa
    • Yoshimitsu Terakado
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method for setting conveying data for a lead frame
    • Patent number 6,141,599
    • Issue date Oct 31, 2000
    • Kabushiki Kaisha Shinkawa
    • Toru Mochida
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wire bonding apparatus
    • Patent number 6,129,255
    • Issue date Oct 10, 2000
    • Kabushiki Kaisha Shinkawa
    • Yoshimitsu Terakado
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Discharge abnormality detection device and method for use in wire b...
    • Patent number 5,988,482
    • Issue date Nov 23, 1999
    • Kabushiki Kaisha Shinkawa
    • Kazumasa Sasakura
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead frame conveying method and conveying apparatus
    • Patent number 5,975,835
    • Issue date Nov 2, 1999
    • Kabushiki Kaisha Shinkawa
    • Toru Mochida
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Raising-and-lowering data setting method for magazine elevator device
    • Patent number 5,903,463
    • Issue date May 11, 1999
    • Kabushiki Kaisha Shinkawa
    • Masayuki Seguro
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wire bonding method
    • Patent number 5,524,811
    • Issue date Jun 11, 1996
    • Kabushiki Kaisha Shinkawa
    • Yoshimitsu Terakado
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Motor control circuit for a wire bonding apparatus
    • Patent number 5,485,063
    • Issue date Jan 16, 1996
    • Kabushiki Kaisha Shinkawa
    • Tooru Mochida
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding apparatus
    • Patent number 5,468,927
    • Issue date Nov 21, 1995
    • Kabushiki Kaisha Shinkawa
    • Yoshimitsu Terakado
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding method
    • Patent number 5,386,936
    • Issue date Feb 7, 1995
    • Kabushiki Kaisha Shinkawa
    • Tooru Mochida
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Bonding point polarity determining apparatus
    • Patent number 5,287,064
    • Issue date Feb 15, 1994
    • Kabushiki Kaisha Shinkawa
    • Tooru Mochida
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Wire bonding method and apparatus
    • Patent number 5,221,037
    • Issue date Jun 22, 1993
    • Kabushiki Kaisha Shinkawa
    • Yoshimitsu Terakado
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wire bonding apparatus
    • Patent number 5,219,112
    • Issue date Jun 15, 1993
    • Kabushiki Kaisha Shinkawa
    • Tooru Mochida
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method and apparatus for forming a ball at a bonding wire end
    • Patent number 5,214,259
    • Issue date May 25, 1993
    • Kabushiki Kaisha Shinkawa
    • Yoshimitsu Terakado
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding method and apparatus
    • Patent number 5,207,370
    • Issue date May 4, 1993
    • Kabushiki Kaisha Shinkawa
    • Tooru Mochida
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wire bonding method
    • Patent number 5,192,018
    • Issue date Mar 9, 1993
    • Kabushiki Kaisha Shinkawa
    • Yoshimitsu Terakado
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding method
    • Patent number 5,123,585
    • Issue date Jun 23, 1992
    • Kabushiki Kaisha Shinkawa
    • Yoshimitsu Terakado
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Detection method for wire bonding failures
    • Patent number 5,058,797
    • Issue date Oct 22, 1991
    • Kabushiki Kaisha Shinkawa
    • Yoshimitsu Terakado
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Device for detecting height of bonding surface
    • Patent number 5,046,655
    • Issue date Sep 10, 1991
    • Kabushiki Kaisha Shinkawa
    • Yuji Ohashi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Ultrasonic wire bonding apparatus
    • Patent number 5,046,654
    • Issue date Sep 10, 1991
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding method
    • Patent number 5,024,367
    • Issue date Jun 18, 1991
    • Kabushiki Kaisha Shinkawa
    • Yoshimitsu Terakado
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Wire bonding apparatus
    • Patent number 5,016,803
    • Issue date May 21, 1991
    • Kabushiki Kaisha Shinkawa
    • Yuji Ohashi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of wire bonding
    • Patent number 4,932,584
    • Issue date Jun 12, 1990
    • Kabushiki Kaisha Shinkawa
    • Nobuto Yamazaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    Workpiece holding device for a bonding apparatus
    • Publication number 20020105130
    • Publication date Aug 8, 2002
    • KABUSHIKI KAISHA SHINKAWA
    • Tatsunari Mii
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Wire bonding apparatus
    • Publication number 20020023942
    • Publication date Feb 28, 2002
    • KABUSHIKI KAISHA SHINKAWA
    • Yoshimitsu Terakado
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Wire bonding apparatus
    • Publication number 20010002032
    • Publication date May 31, 2001
    • KABUSHIKI KAISHA SHINKAWA
    • Yoshimitsu Terakado
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Spool holder structure for a wire bonder
    • Publication number 20010002038
    • Publication date May 31, 2001
    • KABUSHIKI KAISHA SHINKAWA
    • Yoshimitsu Terakado
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Wire bonding apparatus
    • Publication number 20010002031
    • Publication date May 31, 2001
    • KABUSHIKI KAISHA SHINKAWA
    • Tooru Mochida
    • G05 - CONTROLLING REGULATING