TREA

Yoshinobu SAITO

Follow

Person

  • Tokyo, JP
People

Patents Grantslast 30 patents

  • Information Patent Grant

    Tape affixing apparatus
    • Patent number 12,208,984
    • Issue date Jan 28, 2025
    • Disco Corporation
    • Takashi Uchiho
    • B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
  • Information Patent Grant

    Grinding wheel and wafer grinding method
    • Patent number 12,151,339
    • Issue date Nov 26, 2024
    • Disco Corporation
    • Yoshinobu Saito
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Wafer processing method and machine
    • Patent number 12,100,620
    • Issue date Sep 24, 2024
    • Disco Corporation
    • Yoshinobu Saito
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Processing apparatus
    • Patent number 12,094,742
    • Issue date Sep 17, 2024
    • Disco Corporation
    • Yoshinobu Saito
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Holding mechanism including Bernoulli pad
    • Patent number 11,935,778
    • Issue date Mar 19, 2024
    • Disco Corporation
    • Yoshinori Kakinuma
    • B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
  • Information Patent Grant

    Apparatus and method for detecting a wafer in a cassette
    • Patent number 11,923,223
    • Issue date Mar 5, 2024
    • Disco Corporation
    • Yoshinobu Saito
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Processing apparatus
    • Patent number 11,862,505
    • Issue date Jan 2, 2024
    • Disco Corporation
    • Yoshinori Kakinuma
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Processing apparatus
    • Patent number 11,764,085
    • Issue date Sep 19, 2023
    • Disco Corporation
    • Yukiyasu Masuda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Tape attaching apparatus
    • Patent number 11,756,809
    • Issue date Sep 12, 2023
    • Disco Corporation
    • Yoshinobu Saito
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Holding mechanism
    • Patent number 11,715,664
    • Issue date Aug 1, 2023
    • Disco Corporation
    • Yoshinobu Saito
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Resin sheet fixing apparatus
    • Patent number 11,664,248
    • Issue date May 30, 2023
    • Disco Corporation
    • Yoshinobu Saito
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Processing apparatus
    • Patent number 11,651,988
    • Issue date May 16, 2023
    • Disco Corporation
    • Yoshinobu Saito
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Processing apparatus
    • Patent number 11,554,455
    • Issue date Jan 17, 2023
    • Disco Corporation
    • Yoshinobu Saito
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Workpiece unit
    • Patent number 11,545,386
    • Issue date Jan 3, 2023
    • Disco Corporation
    • Yoshinobu Saito
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Testing apparatus
    • Patent number 11,474,143
    • Issue date Oct 18, 2022
    • Disco Corporation
    • Makoto Kobayashi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Table
    • Patent number 11,460,354
    • Issue date Oct 4, 2022
    • Disco Corporation
    • Yoshinobu Saito
    • B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
  • Information Patent Grant

    Method of processing workpiece
    • Patent number 11,456,214
    • Issue date Sep 27, 2022
    • Disco Corporation
    • Yoshinobu Saito
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Resin protection member forming apparatus
    • Patent number 11,443,951
    • Issue date Sep 13, 2022
    • Disco Corporation
    • Yoshinobu Saito
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Workpiece unit including adhesive tape with color change layer
    • Patent number 11,437,267
    • Issue date Sep 6, 2022
    • Disco Corporation
    • Yoshinobu Saito
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Measuring apparatus for measuring a flexural strength of a test piece
    • Patent number 11,402,310
    • Issue date Aug 2, 2022
    • Disco Corporation
    • Yoshinobu Saito
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Protective member forming method
    • Patent number 11,325,284
    • Issue date May 10, 2022
    • Disco Corporation
    • Yoshinobu Saito
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Tape, tape attaching method, and tape expanding method
    • Patent number 11,222,806
    • Issue date Jan 11, 2022
    • Disco Corporation
    • Yoshinobu Saito
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Test apparatus
    • Patent number 11,162,881
    • Issue date Nov 2, 2021
    • Disco Corporation
    • Yoshinobu Saito
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Peeling method of resin sheet
    • Patent number 11,090,921
    • Issue date Aug 17, 2021
    • Disco Corporation
    • Yoshinobu Saito
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    EXPANDING MACHINE AND EXPANDING METHOD
    • Publication number 20230411202
    • Publication date Dec 21, 2023
    • Disco Corporation
    • Kaoru AMANO
    • B26 - HAND CUTTING TOOLS CUTTING SEVERING
  • Information Patent Application

    WAFER MANUFACTURING METHOD
    • Publication number 20230330781
    • Publication date Oct 19, 2023
    • Disco Corporation
    • Yoshinobu SAITO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    DRYNESS DETECTION METHOD AND DRYNESS DETECTION APPARATUS
    • Publication number 20230296498
    • Publication date Sep 21, 2023
    • Disco Corporation
    • Yoshinobu SAITO
    • G01 - MEASURING TESTING
  • Information Patent Application

    PROCESSING METHOD OF WORKPIECE
    • Publication number 20230191537
    • Publication date Jun 22, 2023
    • Disco Corporation
    • Yoshinobu SAITO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    TAPE PRESSURE BONDING APPARATUS
    • Publication number 20230154782
    • Publication date May 18, 2023
    • Disco Corporation
    • Takashi UCHIHO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER DETECTING APPARATUS AND WAFER DELIVERY APPARATUS
    • Publication number 20230147310
    • Publication date May 11, 2023
    • Disco Corporation
    • Yoshinobu SAITO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROCESSING WAFER REGENERATION EQUIPMENT
    • Publication number 20230127689
    • Publication date Apr 27, 2023
    • Disco Corporation
    • Yoshinobu SAITO
    • C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
  • Information Patent Application

    PROCESSING APPARATUS
    • Publication number 20230121008
    • Publication date Apr 20, 2023
    • Disco Corporation
    • Takashi MORI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    TAPE AFFIXING APPARATUS
    • Publication number 20230093583
    • Publication date Mar 23, 2023
    • Disco Corporation
    • Takashi UCHIHO
    • B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
  • Information Patent Application

    PROCESSING APPARATUS
    • Publication number 20230046388
    • Publication date Feb 16, 2023
    • Disco Corporation
    • Yoshinobu SAITO
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    OPERATION ACCURACY MEASURING METHOD
    • Publication number 20220397387
    • Publication date Dec 15, 2022
    • Disco Corporation
    • Atsushi ODA
    • G01 - MEASURING TESTING
  • Information Patent Application

    METHOD OF AND APPARATUS FOR PROCESSING WAFER
    • Publication number 20220384175
    • Publication date Dec 1, 2022
    • Disco Corporation
    • Yoshinobu SAITO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROCESSING APPARATUS
    • Publication number 20220384237
    • Publication date Dec 1, 2022
    • Disco Corporation
    • Yoshinobu SAITO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PROCESSING APPARATUS
    • Publication number 20220270911
    • Publication date Aug 25, 2022
    • Disco Corporation
    • Yoshinori KAKINUMA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PROCESSING APPARATUS
    • Publication number 20220270910
    • Publication date Aug 25, 2022
    • Disco Corporation
    • Yoshinori KAKINUMA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PROCESSING APPARATUS
    • Publication number 20220115250
    • Publication date Apr 14, 2022
    • Disco Corporation
    • Yoshinobu SAITO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    HOLDING MECHANISM
    • Publication number 20220108910
    • Publication date Apr 7, 2022
    • Disco Corporation
    • Yoshinobu SAITO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROCESSING APPARATUS
    • Publication number 20220108903
    • Publication date Apr 7, 2022
    • Disco Corporation
    • Yoshinobu SAITO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    GRINDING WHEEL AND WAFER GRINDING METHOD
    • Publication number 20220063059
    • Publication date Mar 3, 2022
    • Disco Corporation
    • Yoshinobu SAITO
    • B24 - GRINDING POLISHING
  • Information Patent Application

    WORKPIECE MANAGEMENT METHOD AND SHEET CUTTING MACHINE
    • Publication number 20220020696
    • Publication date Jan 20, 2022
    • Disco Corporation
    • Yoshinobu SAITO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PROCESSING APPARATUS
    • Publication number 20220020614
    • Publication date Jan 20, 2022
    • Disco Corporation
    • Yukiyasu MASUDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER PROCESSING METHOD AND MACHINE
    • Publication number 20210384076
    • Publication date Dec 9, 2021
    • Disco Corporation
    • Yoshinobu SAITO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HOLDING MECHANISM INCLUDING BERNOULLI PAD
    • Publication number 20210358796
    • Publication date Nov 18, 2021
    • Disco Corporation
    • Yoshinori KAKINUMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROCESSING APPARATUS
    • Publication number 20210260711
    • Publication date Aug 26, 2021
    • Disco Corporation
    • Yoshinobu SAITO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    TAPE ATTACHING APPARATUS
    • Publication number 20210257232
    • Publication date Aug 19, 2021
    • Disco Corporation
    • Yoshinobu SAITO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    RESIN SHEET FIXING APPARATUS
    • Publication number 20210134623
    • Publication date May 6, 2021
    • Disco Corporation
    • Yoshinobu SAITO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    RESIN PROTECTION MEMBER FORMING APPARATUS
    • Publication number 20210134598
    • Publication date May 6, 2021
    • Disco Corporation
    • Yoshinobu SAITO
    • B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
  • Information Patent Application

    PROTECTIVE MEMBER FORMING METHOD
    • Publication number 20210129394
    • Publication date May 6, 2021
    • Disco Corporation
    • Yoshinobu SAITO
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    METHOD OF PROCESSING WORKPIECE
    • Publication number 20210082764
    • Publication date Mar 18, 2021
    • Disco Corporation
    • Yoshinobu SAITO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PEELING METHOD OF RESIN SHEET
    • Publication number 20210039377
    • Publication date Feb 11, 2021
    • Disco Corporation
    • Yoshinobu SAITO
    • B32 - LAYERED PRODUCTS