Yoshinobu Takeshita

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Kagoshima, JP

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Patents Grantslast 30 patents

Information Patent Grant
Bonding apparatus
- Patent number 5,316,610
- Issue date May 31, 1994
- Matsushita Electric Industrial Co., Ltd.
- Tomohiro Tamaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for connecting semiconductor devices to wiring boards
- Patent number 5,115,545
- Issue date May 26, 1992
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for attaching semiconductors to a transparent substrate usin...
- Patent number 5,037,780
- Issue date Aug 6, 1991
- Matsushita Electric Industrial Co., Ltd.
- Hiroaki Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS