Yoshinori Deguchi

Person

Hyogo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 11,456,264
- Issue date Sep 27, 2022
- Renesas Electronics Corporation
- Yoshiaki Sato
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 11,387,172
- Issue date Jul 12, 2022
- Renesas Electronics Corporation
- Yoshinori Deguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 10,818,601
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Yoshinori Deguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a pad and a wiring line arranged for...
- Patent number 10,777,507
- Issue date Sep 15, 2020
- Renesas Electronics Corporation
- Yoshinori Deguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 10,141,295
- Issue date Nov 27, 2018
- Renesas Electronics Corporation
- Bunji Yasumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 9,825,017
- Issue date Nov 21, 2017
- Renesas Electronics Corporation
- Bunji Yasumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 9,490,218
- Issue date Nov 8, 2016
- Renesas Electronics Corporation
- Bunji Yasumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,230,938
- Issue date Jan 5, 2016
- Renesas Electronics Corporation
- Akio Hasebe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for the same
- Patent number 9,171,767
- Issue date Oct 27, 2015
- Renesas Electronics Corporation
- Ryo Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 9,053,954
- Issue date Jun 9, 2015
- Renesas Electronics Corporation
- Bunji Yasumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,945,953
- Issue date Feb 3, 2015
- Renesas Electronics Corporation
- Akio Hasebe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method for the same
- Patent number 8,896,129
- Issue date Nov 25, 2014
- Renesas Electronics Corporation
- Ryo Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,178,981
- Issue date May 15, 2012
- Renesas Electronics Corporation
- Teruaki Kanzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,701,063
- Issue date Apr 20, 2010
- Renesas Technology Corp.
- Teruaki Kanzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor integrated circuit device
- Patent number 7,534,629
- Issue date May 19, 2009
- Renesas Technology Corp.
- Teruo Shoji
- G01 - MEASURING TESTING
Information Patent Grant
Probe sheet adhesion holder, probe card, semiconductor test device,...
- Patent number 7,423,439
- Issue date Sep 9, 2008
- Renesas Technology Corp.
- Susumu Kasukabe
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device test probe
- Patent number 7,276,923
- Issue date Oct 2, 2007
- Mitsubishi Denki Kabushiki Kaisha
- Megumi Takemoto
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device test probe
- Patent number 7,274,195
- Issue date Sep 25, 2007
- Mitsubishi Denki Kabushiki Kaisha
- Megumi Takemoto
- G01 - MEASURING TESTING
Information Patent Grant
Probe card
- Patent number 6,727,714
- Issue date Apr 27, 2004
- Renesas Technology Corp.
- Yoshinori Deguchi
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device test probe having improved tip portion and man...
- Patent number 6,633,176
- Issue date Oct 14, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Megumi Takemoto
- G01 - MEASURING TESTING
Information Patent Grant
Probe card for testing semiconductor integrated circuit and method...
- Patent number 6,628,127
- Issue date Sep 30, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Megumi Takemoto
- G01 - MEASURING TESTING
Information Patent Grant
Test board for testing a semiconductor device utilizing first and s...
- Patent number 6,356,096
- Issue date Mar 12, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Ryoichi Takagi
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20210272917
- Publication date Sep 2, 2021
- RENESAS ELECTRONICS CORPORATION
- Yoshiaki SATO
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200328157
- Publication date Oct 15, 2020
- Renesas Electronics Corporation
- Yoshinori DEGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200043877
- Publication date Feb 6, 2020
- RENESAS ELECTRONICS CORPORATION
- Kentaro SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190295930
- Publication date Sep 26, 2019
- RENESAS ELECTRONICS CORPORATION
- Yoshinori DEGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180374795
- Publication date Dec 27, 2018
- RENESAS ELECTRONICS CORPORATION
- Yoshinori DEGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180040598
- Publication date Feb 8, 2018
- Renesas Electronics Corporation
- Bunji Yasumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20170005080
- Publication date Jan 5, 2017
- RENESAS ELECTRONICS CORPORATION
- Bunji Yasumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20160027731
- Publication date Jan 28, 2016
- RENESAS ELECTRONICS CORPORATION
- Ryo Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150243605
- Publication date Aug 27, 2015
- RENESAS ELECTRONICS CORPORATION
- Bunji Yasumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150111317
- Publication date Apr 23, 2015
- Renesas Electronics Corporation
- Akio Hasebe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20150076709
- Publication date Mar 19, 2015
- Renesas Electronics Corporation
- Ryo Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE
- Publication number 20140287541
- Publication date Sep 25, 2014
- RENESAS ELECTRONICS CORPORATION
- Bunji Yasumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140179032
- Publication date Jun 26, 2014
- RENESAS ELECTRONICS CORPORATION
- Akio Hasebe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20130256906
- Publication date Oct 3, 2013
- RENESAS ELECTRONICS CORPORATION
- Ryo Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100155960
- Publication date Jun 24, 2010
- Renesas Technology Corporation
- Teruaki KANZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20070182001
- Publication date Aug 9, 2007
- Renesas Technology Corp.
- Teruaki Kanzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Probe sheet adhesion holder, probe card, semiconductor test device,...
- Publication number 20070103178
- Publication date May 10, 2007
- Susumu Kasukabe
- G01 - MEASURING TESTING
Information Patent Application
Manufacturing method of semiconductor integrated circuit device
- Publication number 20060281222
- Publication date Dec 14, 2006
- Teruo Shoji
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor device test probe
- Publication number 20060038575
- Publication date Feb 23, 2006
- Mitsubishi Denki Kabushiki Kaisha
- Megumi Takemoto
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE TEST PROBE HAVING IMPROVED TIP PORTION
- Publication number 20050189955
- Publication date Sep 1, 2005
- Mitsubishi Denki Kabushiki Kaisha
- Megumi Takemoto
- G01 - MEASURING TESTING
Information Patent Application
Probe card
- Publication number 20050007134
- Publication date Jan 13, 2005
- RENESAS TECHNOLOGY CORP.
- Yoshinori Deguchi
- G01 - MEASURING TESTING
Information Patent Application
Probe card
- Publication number 20030057976
- Publication date Mar 27, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Yoshinori Deguchi
- G01 - MEASURING TESTING
Information Patent Application
A TEST BOARD FOR TESTING A SEMICONDUCTOR DEVICE UTILIZING FIRST AND...
- Publication number 20020011865
- Publication date Jan 31, 2002
- RYOICHI TAKAGI
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor device test probe, manufacturing method therefor and...
- Publication number 20010046715
- Publication date Nov 29, 2001
- Megumi Takemoto
- G01 - MEASURING TESTING
Information Patent Application
Probe card for testing semiconductor integrated circuit and method...
- Publication number 20010015650
- Publication date Aug 23, 2001
- Megumi Takemoto
- G01 - MEASURING TESTING

Yoshinori Deguchi

Person

Patents Grantslast 30 patents

Method of manufacturing semiconductor device

Semiconductor device and method for manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device including a pad and a wiring line arranged for...

Method for manufacturing semiconductor device

Method for manufacturing semiconductor device

Method for manufacturing semiconductor device

Method of manufacturing semiconductor device

Semiconductor device and manufacturing method for the same

Method for manufacturing semiconductor device

Method of manufacturing semiconductor device

Semiconductor device and manufacturing method for the same

Semiconductor device

Semiconductor device

Manufacturing method of semiconductor integrated circuit device

Probe sheet adhesion holder, probe card, semiconductor test device,...

Semiconductor device test probe

Semiconductor device test probe

Probe card

Semiconductor device test probe having improved tip portion and man...

Probe card for testing semiconductor integrated circuit and method...

Test board for testing a semiconductor device utilizing first and s...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME

SEMICONDUCTOR DEVICE

Semiconductor device

Probe sheet adhesion holder, probe card, semiconductor test device,...

Manufacturing method of semiconductor integrated circuit device

Semiconductor device test probe

SEMICONDUCTOR DEVICE TEST PROBE HAVING IMPROVED TIP PORTION

Probe card

Probe card

A TEST BOARD FOR TESTING A SEMICONDUCTOR DEVICE UTILIZING FIRST AND...

Semiconductor device test probe, manufacturing method therefor and...

Probe card for testing semiconductor integrated circuit and method...