Yoshinori EJIRI

Person

Chikusei-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Solder particles
- Patent number 12,172,240
- Issue date Dec 24, 2024
- Resonac Corporation
- Kunihiko Akai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Connection structure and manufacturing method therefor
- Patent number 12,100,923
- Issue date Sep 24, 2024
- Resonac Corporation
- Kunihiko Akai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and method for manufacturing electronic component
- Patent number 12,070,800
- Issue date Aug 27, 2024
- Resonac Corporation
- Yoshinori Ejiri
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Substrate and method for manufacturing the same
- Patent number 11,990,396
- Issue date May 21, 2024
- Resonac Corporation
- Kazuyuki Mitsukura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing bonded object and semiconductor device and cop...
- Patent number 11,890,681
- Issue date Feb 6, 2024
- Resonac Corporation
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Member connection method
- Patent number 11,887,960
- Issue date Jan 30, 2024
- Resonac Corporation
- Motohiro Negishi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for manufacturing thermoelectric conversion module, thermoel...
- Patent number 11,575,076
- Issue date Feb 7, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Motohiro Negishi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Organic interposer and method for manufacturing organic interposer
- Patent number 11,562,951
- Issue date Jan 24, 2023
- SHOWA DENKO MATERIALS CO., LTD.
- Kazuyuki Mitsukura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper paste for pressureless bonding, bonded body and semiconducto...
- Patent number 11,532,588
- Issue date Dec 20, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Hideo Nakako
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composition containing organic solvents with different vapor pressu...
- Patent number 11,512,214
- Issue date Nov 29, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Kohsuke Urashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing joined body, and joining material
- Patent number 11,483,936
- Issue date Oct 25, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Hideo Nakako
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal paste for joints, assembly, production method for assembly, s...
- Patent number 11,462,502
- Issue date Oct 4, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Metal paste for joints, assembly, production method for assembly, s...
- Patent number 11,370,066
- Issue date Jun 28, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Copper paste for joining, method for manufacturing joined body, and...
- Patent number 11,040,416
- Issue date Jun 22, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Dai Ishikawa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Copper paste for pressureless bonding, bonded body and semiconducto...
- Patent number 10,930,612
- Issue date Feb 23, 2021
- SHOWA DENKO MATERIALS CO., LTD.
- Hideo Nakako
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Organic interposer and method for manufacturing organic interposer
- Patent number 10,756,008
- Issue date Aug 25, 2020
- Hitachi Chemical Company, Ltd.
- Kazuyuki Mitsukura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper paste for joining, method for manufacturing joined body, and...
- Patent number 10,748,865
- Issue date Aug 18, 2020
- Hitachi Chemical Company, Ltd.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Assembly and semiconductor device
- Patent number 10,566,304
- Issue date Feb 18, 2020
- Hitachi Chemical Company, Ltd.
- Hideo Nakako
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Copper paste for joining, method for producing joined body, and met...
- Patent number 10,363,608
- Issue date Jul 30, 2019
- Hitachi Chemical Company, Ltd.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Copper metal film, method for producing same, copper metal pattern,...
- Patent number 9,457,406
- Issue date Oct 4, 2016
- Hitachi Chemical Company, Ltd.
- Hideo Nakako
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Substrate for mounting semiconductor chip and method for producing...
- Patent number 8,997,341
- Issue date Apr 7, 2015
- Hitachi Chemical Company, Ltd.
- Yoshinori Ejiri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper conductor film and manufacturing method thereof, conductive...
- Patent number 8,801,971
- Issue date Aug 12, 2014
- Hitachi Chemical Company, Ltd.
- Hideo Nakako
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Connecting terminal, semiconductor package using connecting termina...
- Patent number 8,426,742
- Issue date Apr 23, 2013
- Hitachi Chemical Company, Ltd.
- Yoshinori Ejiri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20240383035
- Publication date Nov 21, 2024
- Resonac Corporation
- Yoshinori EJIRI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METAL PASTE FOR JOINING, JOINT, AND MANUFACTURING METHOD THEREFOR
- Publication number 20240300055
- Publication date Sep 12, 2024
- Resonac Corporation
- Hideo NAKAKO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SOLDER PASTE, METHOD FOR FORMING SOLDER BUMPS, AND METHOD FOR MANUF...
- Publication number 20240297135
- Publication date Sep 5, 2024
- Resonac Corporation
- Yoshinori EJIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240282684
- Publication date Aug 22, 2024
- Resonac Corporation
- Kazuyuki MITSUKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER PASTE, METHOD FOR FORMING SOLDER BUMPS, AND METHOD FOR PRODU...
- Publication number 20240105653
- Publication date Mar 28, 2024
- Resonac Corporation
- Yoshinori EJIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PASTE, WICK FORMATION METHOD, AND HEAT PIPE
- Publication number 20230356294
- Publication date Nov 9, 2023
- Resonac Corporation
- Hideo NAKAKO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230118368
- Publication date Apr 20, 2023
- Showa Denko Materials Co., Ltd.
- Kazuyuki MITSUKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230060577
- Publication date Mar 2, 2023
- Showa Denko Materials Co., Ltd.
- Kunihiko AKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP FORMING MEMBER, METHOD FOR MANUFACTURING SOLDER BUMP FO...
- Publication number 20230042727
- Publication date Feb 9, 2023
- Showa Denko Materials Co., Ltd.
- Kunihiko AKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING SUBSTRATE HAVING THROUGH-SILICON VIAS, SUBSTRA...
- Publication number 20220230918
- Publication date Jul 21, 2022
- Showa Denko Materials Co., Ltd.
- Yoshinori EJIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20220053647
- Publication date Feb 17, 2022
- Showa Denko Materials Co., Ltd.
- Yoshinori EJIRI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING BONDED OBJECT AND SEMICONDUCTOR DEVICE AND COP...
- Publication number 20220028824
- Publication date Jan 27, 2022
- Showa Denko Materials Co., Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
MEMBER CONNECTION METHOD
- Publication number 20210351157
- Publication date Nov 11, 2021
- Hitachi Chemical Company, Ltd.
- Motohiro NEGISHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SOLDER PARTICLES AND METHOD FOR PRODUCING SOLDER PARTICLES
- Publication number 20210229222
- Publication date Jul 29, 2021
- Showa Denko Materials Co., Ltd.
- Kunihiko AKAI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COPPER PASTE FOR PRESSURELESS BONDING, BONDED BODY AND SEMICONDUCTO...
- Publication number 20210143121
- Publication date May 13, 2021
- Hideo NAKAKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING SAME, AND METHOD...
- Publication number 20210114147
- Publication date Apr 22, 2021
- Showa Denko Materials Co., Ltd.
- Kunihiko AKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER PARTICLES
- Publication number 20210114145
- Publication date Apr 22, 2021
- Showa Denko Materials Co., Ltd.
- Kunihiko AKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITION, CONDUCTOR, METHOD FOR MANUFACTURING SAME, AND STRUCTURE
- Publication number 20200399493
- Publication date Dec 24, 2020
- Hitachi Chemical Company, Ltd.
- Kohsuke URASHIMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ORGANIC INTERPOSER AND METHOD FOR MANUFACTURING ORGANIC INTERPOSER
- Publication number 20200365501
- Publication date Nov 19, 2020
- Hitachi Chemical Company, Ltd.
- Kazuyuki MITSUKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING JOINED BODY, AND JOINING MATERIAL
- Publication number 20200344893
- Publication date Oct 29, 2020
- Hitachi Chemical Company, Ltd.
- Hideo NAKAKO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR MANUFACTURING THERMOELECTRIC CONVERSION MODULE, THERMOEL...
- Publication number 20200295248
- Publication date Sep 17, 2020
- Hitachi Chemical Company, Ltd.
- Motohiro NEGISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...
- Publication number 20200130109
- Publication date Apr 30, 2020
- Hitachi Chemical Company, Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...
- Publication number 20200108471
- Publication date Apr 9, 2020
- Hitachi Chemical Company, Ltd.
- Dai ISHIKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...
- Publication number 20200075528
- Publication date Mar 5, 2020
- Hitachi Chemical Company, Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COPPER PASTE FOR PRESSURELESS BONDING, BONDED BODY AND SEMICONDUCTO...
- Publication number 20190355690
- Publication date Nov 21, 2019
- Hitachi Chemical Company, Ltd.
- Hideo NAKAKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC INTERPOSER AND METHOD FOR MANUFACTURING ORGANIC INTERPOSER
- Publication number 20190109082
- Publication date Apr 11, 2019
- Hitachi Chemical Company, Ltd.
- Kazuyuki MITSUKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY AND SEMICONDUCTOR DEVICE
- Publication number 20180342478
- Publication date Nov 29, 2018
- Hitachi Chemical Company, Ltd.
- Hideo NAKAKO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COPPER PASTE FOR JOINING, METHOD FOR PRODUCING JOINED BODY, AND MET...
- Publication number 20180250751
- Publication date Sep 6, 2018
- Hitachi Chemical Company, Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BIOMOLECULE CAPTURING FILTER
- Publication number 20180021708
- Publication date Jan 25, 2018
- Hitachi Chemical Company, Ltd.
- Kenji TAKAI
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
BIOMOLECULE CAPTURING FILTER
- Publication number 20140299539
- Publication date Oct 9, 2014
- Hitachi Chemical Company, Ltd.
- Kenji TAKAI
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL

Yoshinori EJIRI

Person

Patents Grantslast 30 patents

Solder particles

Connection structure and manufacturing method therefor

Electronic component and method for manufacturing electronic component

Substrate and method for manufacturing the same

Method for producing bonded object and semiconductor device and cop...

Member connection method

Method for manufacturing thermoelectric conversion module, thermoel...

Organic interposer and method for manufacturing organic interposer

Copper paste for pressureless bonding, bonded body and semiconducto...

Composition containing organic solvents with different vapor pressu...

Method for producing joined body, and joining material

Metal paste for joints, assembly, production method for assembly, s...

Metal paste for joints, assembly, production method for assembly, s...

Copper paste for joining, method for manufacturing joined body, and...

Copper paste for pressureless bonding, bonded body and semiconducto...

Organic interposer and method for manufacturing organic interposer

Copper paste for joining, method for manufacturing joined body, and...

Assembly and semiconductor device

Copper paste for joining, method for producing joined body, and met...

Copper metal film, method for producing same, copper metal pattern,...

Substrate for mounting semiconductor chip and method for producing...

Copper conductor film and manufacturing method thereof, conductive...

Connecting terminal, semiconductor package using connecting termina...

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

METAL PASTE FOR JOINING, JOINT, AND MANUFACTURING METHOD THEREFOR

SOLDER PASTE, METHOD FOR FORMING SOLDER BUMPS, AND METHOD FOR MANUF...

SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

SOLDER PASTE, METHOD FOR FORMING SOLDER BUMPS, AND METHOD FOR PRODU...

COPPER PASTE, WICK FORMATION METHOD, AND HEAT PIPE

SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR

SOLDER BUMP FORMING MEMBER, METHOD FOR MANUFACTURING SOLDER BUMP FO...

METHOD FOR PRODUCING SUBSTRATE HAVING THROUGH-SILICON VIAS, SUBSTRA...

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

METHOD FOR PRODUCING BONDED OBJECT AND SEMICONDUCTOR DEVICE AND COP...

MEMBER CONNECTION METHOD

SOLDER PARTICLES AND METHOD FOR PRODUCING SOLDER PARTICLES

COPPER PASTE FOR PRESSURELESS BONDING, BONDED BODY AND SEMICONDUCTO...

ANISOTROPIC CONDUCTIVE FILM, METHOD FOR PRODUCING SAME, AND METHOD...

SOLDER PARTICLES

COMPOSITION, CONDUCTOR, METHOD FOR MANUFACTURING SAME, AND STRUCTURE

ORGANIC INTERPOSER AND METHOD FOR MANUFACTURING ORGANIC INTERPOSER

METHOD FOR PRODUCING JOINED BODY, AND JOINING MATERIAL

METHOD FOR MANUFACTURING THERMOELECTRIC CONVERSION MODULE, THERMOEL...

METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...

COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...

METAL PASTE FOR JOINTS, ASSEMBLY, PRODUCTION METHOD FOR ASSEMBLY, S...

COPPER PASTE FOR PRESSURELESS BONDING, BONDED BODY AND SEMICONDUCTO...

ORGANIC INTERPOSER AND METHOD FOR MANUFACTURING ORGANIC INTERPOSER

ASSEMBLY AND SEMICONDUCTOR DEVICE

COPPER PASTE FOR JOINING, METHOD FOR PRODUCING JOINED BODY, AND MET...

BIOMOLECULE CAPTURING FILTER

BIOMOLECULE CAPTURING FILTER