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Yoshinori Endou
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Ibaraki, JP
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Patents Grants
last 30 patents
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Patent Grant
Sealant epoxy-resin molding material, and electronic component device
Patent number
7,846,998
Issue date
Dec 7, 2010
Hitachi Chemical Co., Ltd.
Seiichi Akagi
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
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Patent Grant
Epoxy resin molding material for sealing use and semiconductor device
Patent number
7,397,139
Issue date
Jul 8, 2008
Hitachi Chemical Co., Ltd.
Ryoichi Ikezawa
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Sealant Epoxy-Resin Molding Material, and Electronic Component Device
Publication number
20080234409
Publication date
Sep 25, 2008
Hitachi Chemical Co., Ltd.
Seiichi Akagi
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Epoxy resin molding material for sealing use and semiconductor device
Publication number
20060214153
Publication date
Sep 28, 2006
Ryoichi Ikezawa
H01 - BASIC ELECTRIC ELEMENTS