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Yoshinori KONDO
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Kawasaki-shi, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Manufacturing method of semiconductor device
Patent number
9,589,787
Issue date
Mar 7, 2017
Renesas Electronics Corporation
Toru Shinaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor device and semiconductor device
Patent number
9,443,817
Issue date
Sep 13, 2016
Renesas Electronics Corporation
Ayaka Okumura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor integrated circuit device and a method for manufactur...
Patent number
8,017,464
Issue date
Sep 13, 2011
Renesas Electronics Corporation
Masao Sugiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Resin composition and prepreg for laminate and metal-clad laminate
Patent number
7,192,651
Issue date
Mar 20, 2007
Mitsubishi Gas Chemical Company, Inc.
Daisuke Ohno
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Al alloy composite tube for refrigerant passages and method for pro...
Patent number
6,050,301
Issue date
Apr 18, 2000
The Furukawa Electric Co., Ltd.
Akinori Yoshida
B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information
Patent Grant
Process for the production of copper-clad laminate
Patent number
5,435,877
Issue date
Jul 25, 1995
Mitsubishi Gas Chemical Company, Inc.
Kenji Ishii
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Base board for printed circuit board
Patent number
5,314,740
Issue date
May 24, 1994
Mitsubishi Gas Chemical Company, Inc.
Kenji Ishii
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Printed circuit comprising novel compounds as fluorescence means to...
Patent number
5,266,385
Issue date
Nov 30, 1993
Mitsubishi Gas Chemical Company, Inc.
Kenji Ishii
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Solvent-resistant polyphenylene ether resin composition
Patent number
5,086,112
Issue date
Feb 4, 1992
Mitsubishi Gas Chemical Company, Inc.
Shizuo Togo
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Solvent-resistant polyphenylene ether resin composition
Patent number
4,914,153
Issue date
Apr 3, 1990
Mitsubishi Gas Chemical Company, Inc.
Shizuo Togo
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR INSPECTION METHOD AND MANAGEMENT METHOD OF SEMICONDUC...
Publication number
20180113081
Publication date
Apr 26, 2018
RENESAS ELECTRONICS CORPORATION
Toru SHINAKI
G01 - MEASURING TESTING
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
Publication number
20160358853
Publication date
Dec 8, 2016
RENESAS ELECTRONICS CORPORATION
Ayaka OKUMURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20150214106
Publication date
Jul 30, 2015
RENESAS ELECTRONICS CORPORATION
Toru SHINAKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Manufacturing Semiconductor Device and Semiconductor Device
Publication number
20150200158
Publication date
Jul 16, 2015
RENESAS ELECTRONICS CORPORATION
Ayaka OKUMURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND A METHOD FOR MANUFACTUR...
Publication number
20120061769
Publication date
Mar 15, 2012
Renesas Electronics Corporation
MASAO SUGIYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND A METHOD FOR MANUFACTUR...
Publication number
20100078690
Publication date
Apr 1, 2010
RENESAS TECHNOLOGY CORP.
Masao SUGIYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20090179247
Publication date
Jul 16, 2009
RENESAS TECHNOLOGY CORP.
Masako FUJII
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Resin composition and prepreg for laminate and metal-clad laminate
Publication number
20050042466
Publication date
Feb 24, 2005
Daisuke Ohno
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...