Yoshinori Matsuura

Person

Ageo-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayer body
- Patent number 12,193,153
- Issue date Jan 7, 2025
- Mitsui Mining & Smelting Co., Ltd.
- Rintaro Ishii
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multilayer body
- Patent number 12,058,819
- Issue date Aug 6, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Rintaro Ishii
- B32 - LAYERED PRODUCTS
Information Patent Grant
Laminate sheet and method of use thereof
- Patent number 11,961,771
- Issue date Apr 16, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper foil with carrier
- Patent number 11,765,840
- Issue date Sep 19, 2023
- Mitsui Mining & Smelting Co., Ltd.
- Rintaro Ishii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper foil with glass carrier and production method therefor
- Patent number 11,756,845
- Issue date Sep 12, 2023
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Carrier-containing metal foil and method for manufacturing millimet...
- Patent number 11,637,358
- Issue date Apr 25, 2023
- Mitsui Mining & Smelting Co., Ltd.
- Mikiko Komiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin copper foil, ultra-thin copper foil with carrier, and me...
- Patent number 11,576,267
- Issue date Feb 7, 2023
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer circuit board manufacturing method
- Patent number 11,527,415
- Issue date Dec 13, 2022
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer circuit board manufacturing method
- Patent number 11,525,073
- Issue date Dec 13, 2022
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board manufacturing method
- Patent number 11,317,522
- Issue date Apr 26, 2022
- Mitsui Mining & Smelting Co., Ltd.
- Toshimi Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing multilayer wiring board
- Patent number 11,071,214
- Issue date Jul 20, 2021
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper foil with carrier, production method for same, production me...
- Patent number 10,886,146
- Issue date Jan 5, 2021
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- B32 - LAYERED PRODUCTS
Information Patent Grant
Copper foil with carrier, coreless support with wiring layer, and m...
- Patent number 10,888,003
- Issue date Jan 5, 2021
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- B32 - LAYERED PRODUCTS
Information Patent Grant
Production method for multilayer wiring board
- Patent number 10,840,180
- Issue date Nov 17, 2020
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper foil with carrier, copper foil with resin and method for man...
- Patent number 10,772,219
- Issue date Sep 8, 2020
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface-treated copper foil, manufacturing method therefor, printed...
- Patent number 10,763,002
- Issue date Sep 1, 2020
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-treated copper foil, method for producing same, copper-clad...
- Patent number 10,645,809
- Issue date May 5, 2020
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper foil with carrier, coreless support with wiring layer, and m...
- Patent number 10,492,308
- Issue date Nov 26, 2019
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper foil with carrier, coreless support with wiring layer, and m...
- Patent number 10,356,915
- Issue date Jul 16, 2019
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrolytic copper foil and manufacturing method therefor
- Patent number 10,283,728
- Issue date May 7, 2019
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrolytic copper foil and electronic device
- Patent number 9,985,238
- Issue date May 29, 2018
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Metal foil and electronic device
- Patent number 9,786,404
- Issue date Oct 10, 2017
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrode foil and organic light-emitting device
- Patent number 9,508,951
- Issue date Nov 29, 2016
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode foil and organic device
- Patent number 9,490,440
- Issue date Nov 8, 2016
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode foil and electronic device
- Patent number 9,029,885
- Issue date May 12, 2015
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrode foil and organic device
- Patent number 8,816,338
- Issue date Aug 26, 2014
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrode foil and organic device
- Patent number 8,803,135
- Issue date Aug 12, 2014
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrode foil and organic device
- Patent number 8,791,565
- Issue date Jul 29, 2014
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Electrode foil and organic device
- Patent number 8,586,976
- Issue date Nov 19, 2013
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Anode structure for use in organic EL device, production method the...
- Patent number 8,258,508
- Issue date Sep 4, 2012
- Mitsui Mining & Smelting Co., Ltd.
- Yoshinori Matsuura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD MANUFACTURING METHOD
- Publication number 20240297064
- Publication date Sep 5, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Yukiko KITABATAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER SUBSTRATE MANUFACTURING METHOD AND WIRING SUBSTRATE
- Publication number 20240196530
- Publication date Jun 13, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Yukiko KITABATAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE, METHOD OF TRIMMING SAME, AND MULTI-LAYERED WIRING...
- Publication number 20240080990
- Publication date Mar 7, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Toshimi NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARRIER-ATTACHED METAL FOIL AND METHOD FOR PRODUCING SAME
- Publication number 20240034670
- Publication date Feb 1, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Toshimi NAKAMURA
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
METHOD FOR PRODUCING WIRING BOARD
- Publication number 20230420270
- Publication date Dec 28, 2023
- Mitsui Mining and Smelting Co., Ltd.
- Yukiko KITABATAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FOIL WITH CARRIER
- Publication number 20230072120
- Publication date Mar 9, 2023
- Mitsui Mining and Smelting Co., Ltd.
- Yukiko KITABATAKE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METAL FOIL WITH CARRIER AND USE METHOD AND MANUFACTURING METHOD THE...
- Publication number 20220223456
- Publication date Jul 14, 2022
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER BODY
- Publication number 20220022326
- Publication date Jan 20, 2022
- Mitsui Mining and Smelting Co., Ltd.
- Rintaro ISHII
- B32 - LAYERED PRODUCTS
Information Patent Application
CARRIER-CONTAINING METAL FOIL AND METHOD FOR MANUFACTURING MILLIMET...
- Publication number 20210328325
- Publication date Oct 21, 2021
- Mitsui Mining and Smelting Co., Ltd.
- Mikiko KOMIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE SHEET AND METHOD OF USE THEREOF
- Publication number 20210313237
- Publication date Oct 7, 2021
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER BODY
- Publication number 20210274650
- Publication date Sep 2, 2021
- Mitsui Mining and Smelting Co., Ltd.
- Rintaro ISHII
- B32 - LAYERED PRODUCTS
Information Patent Application
ULTRA-THIN COPPER FOIL, ULTRA-THIN COPPER FOIL WITH CARRIER, AND ME...
- Publication number 20210127503
- Publication date Apr 29, 2021
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori Matsuura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER FOIL WITH CARRIER
- Publication number 20210059057
- Publication date Feb 25, 2021
- Mitsui Mining and Smelting Co., Ltd.
- Rintaro ISHII
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COPPER FOIL WITH GLASS CARRIER AND PRODUCTION METHOD THEREFOR
- Publication number 20200411396
- Publication date Dec 31, 2020
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD MANUFACTURING METHOD
- Publication number 20200113066
- Publication date Apr 9, 2020
- Mitsui Mining and Smelting Co., Ltd.
- Toshimi NAKAMURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER FOIL WITH CARRIER, CORELESS SUPPORT WITH WIRING LAYER, AND M...
- Publication number 20200053885
- Publication date Feb 13, 2020
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRODUCTION METHOD FOR MULTILAYER WIRING BOARD
- Publication number 20200045830
- Publication date Feb 6, 2020
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRODUCTION METHOD FOR MULTILAYER WIRING BOARD
- Publication number 20200045829
- Publication date Feb 6, 2020
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CIRCUIT BOARD MANUFACTURING METHOD
- Publication number 20190378728
- Publication date Dec 12, 2019
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CIRCUIT BOARD MANUFACTURING METHOD
- Publication number 20190378727
- Publication date Dec 12, 2019
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD
- Publication number 20190335594
- Publication date Oct 31, 2019
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER FOIL WITH CARRIER, CORELESS SUPPORT WITH WIRING LAYER, AND M...
- Publication number 20190261518
- Publication date Aug 22, 2019
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COPPER FOIL WITH CARRIER, CORELESS SUPPORT WITH WIRING LAYER, AND M...
- Publication number 20190029125
- Publication date Jan 24, 2019
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER FOIL WITH CARRIER, PRODUCTION METHOD FOR SAME, PRODUCTION ME...
- Publication number 20190013212
- Publication date Jan 10, 2019
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER FOIL WITH CARRIER, COPPER FOIL WITH RESIN AND METHOD FOR MAN...
- Publication number 20180376602
- Publication date Dec 27, 2018
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SURFACE-TREATED COPPER FOIL, MANUFACTURING METHOD THEREFOR, PRINTED...
- Publication number 20180151268
- Publication date May 31, 2018
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- B32 - LAYERED PRODUCTS
Information Patent Application
SURFACE-TREATED COPPER FOIL, METHOD FOR PRODUCING SAME, COPPER-CLAD...
- Publication number 20170188457
- Publication date Jun 29, 2017
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROLYTIC COPPER FOIL AND MANUFACTURING METHOD THEREFOR
- Publication number 20160285030
- Publication date Sep 29, 2016
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori MATSUURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrolytic Copper Foil and Electronic Device
- Publication number 20150340639
- Publication date Nov 26, 2015
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori Matsuura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrode Foil and Organic Light-Emitting Device
- Publication number 20150207096
- Publication date Jul 23, 2015
- Mitsui Mining and Smelting Co., Ltd.
- Yoshinori Matsuura
- H01 - BASIC ELECTRIC ELEMENTS

Yoshinori Matsuura

Person

Patents Grantslast 30 patents

Multilayer body

Multilayer body

Laminate sheet and method of use thereof

Copper foil with carrier

Copper foil with glass carrier and production method therefor

Carrier-containing metal foil and method for manufacturing millimet...

Ultra-thin copper foil, ultra-thin copper foil with carrier, and me...

Multilayer circuit board manufacturing method

Multilayer circuit board manufacturing method

Wiring board manufacturing method

Method for manufacturing multilayer wiring board

Copper foil with carrier, production method for same, production me...

Copper foil with carrier, coreless support with wiring layer, and m...

Production method for multilayer wiring board

Copper foil with carrier, copper foil with resin and method for man...

Surface-treated copper foil, manufacturing method therefor, printed...

Surface-treated copper foil, method for producing same, copper-clad...

Copper foil with carrier, coreless support with wiring layer, and m...

Copper foil with carrier, coreless support with wiring layer, and m...

Electrolytic copper foil and manufacturing method therefor

Electrolytic copper foil and electronic device

Metal foil and electronic device

Electrode foil and organic light-emitting device

Electrode foil and organic device

Electrode foil and electronic device

Electrode foil and organic device

Electrode foil and organic device

Electrode foil and organic device

Electrode foil and organic device

Anode structure for use in organic EL device, production method the...

Patents Applicationslast 30 patents

CIRCUIT BOARD MANUFACTURING METHOD

MULTILAYER SUBSTRATE MANUFACTURING METHOD AND WIRING SUBSTRATE

WIRING SUBSTRATE, METHOD OF TRIMMING SAME, AND MULTI-LAYERED WIRING...

CARRIER-ATTACHED METAL FOIL AND METHOD FOR PRODUCING SAME

METHOD FOR PRODUCING WIRING BOARD

METAL FOIL WITH CARRIER

METAL FOIL WITH CARRIER AND USE METHOD AND MANUFACTURING METHOD THE...

MULTILAYER BODY

CARRIER-CONTAINING METAL FOIL AND METHOD FOR MANUFACTURING MILLIMET...

LAMINATE SHEET AND METHOD OF USE THEREOF

MULTILAYER BODY

ULTRA-THIN COPPER FOIL, ULTRA-THIN COPPER FOIL WITH CARRIER, AND ME...

COPPER FOIL WITH CARRIER

COPPER FOIL WITH GLASS CARRIER AND PRODUCTION METHOD THEREFOR

WIRING BOARD MANUFACTURING METHOD

COPPER FOIL WITH CARRIER, CORELESS SUPPORT WITH WIRING LAYER, AND M...

PRODUCTION METHOD FOR MULTILAYER WIRING BOARD

PRODUCTION METHOD FOR MULTILAYER WIRING BOARD

MULTILAYER CIRCUIT BOARD MANUFACTURING METHOD

MULTILAYER CIRCUIT BOARD MANUFACTURING METHOD

METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD

COPPER FOIL WITH CARRIER, CORELESS SUPPORT WITH WIRING LAYER, AND M...

COPPER FOIL WITH CARRIER, CORELESS SUPPORT WITH WIRING LAYER, AND M...

COPPER FOIL WITH CARRIER, PRODUCTION METHOD FOR SAME, PRODUCTION ME...

COPPER FOIL WITH CARRIER, COPPER FOIL WITH RESIN AND METHOD FOR MAN...

SURFACE-TREATED COPPER FOIL, MANUFACTURING METHOD THEREFOR, PRINTED...

SURFACE-TREATED COPPER FOIL, METHOD FOR PRODUCING SAME, COPPER-CLAD...

ELECTROLYTIC COPPER FOIL AND MANUFACTURING METHOD THEREFOR

Electrolytic Copper Foil and Electronic Device

Electrode Foil and Organic Light-Emitting Device