Yoshinori Shizuno

Person

Gifu, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayer wiring board having wiring structure for mounting multip...
- Patent number 9,893,016
- Issue date Feb 13, 2018
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,480,157
- Issue date Oct 25, 2016
- Ibiden Co., Ltd.
- Yoshinori Shizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,431,347
- Issue date Aug 30, 2016
- Ibiden Co., Ltd.
- Masatoshi Kunieda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, method for manufacturing the same and method...
- Patent number 9,433,085
- Issue date Aug 30, 2016
- Ibiden Co., Ltd.
- Yoshinori Shizuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,425,159
- Issue date Aug 23, 2016
- Ibiden Co., Ltd.
- Makoto Terui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,035,463
- Issue date May 19, 2015
- Ibiden Co., Ltd.
- Yoshinori Shizuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 8,759,691
- Issue date Jun 24, 2014
- Ibiden Co., Ltd.
- Shinji Ouchi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 8,755,196
- Issue date Jun 17, 2014
- Ibiden Co., Ltd.
- Shinji Ouchi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor module
- Patent number 8,742,323
- Issue date Jun 3, 2014
- Lapis Semiconductor Co., Ltd.
- Yoshinori Shizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,659,019
- Issue date Feb 25, 2014
- Lapis Semiconductor Co., Ltd.
- Yoshinori Shizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with embedded component and method of manufacturing same
- Patent number 8,381,394
- Issue date Feb 26, 2013
- Oki Semiconductor Co., Ltd.
- Yoshinori Shizuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication method for semiconductor device
- Patent number 8,101,435
- Issue date Jan 24, 2012
- Lapis Semiconductor Co., Ltd.
- Yoshinori Shizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with embedded component and method of manufacturing same
- Patent number 7,989,706
- Issue date Aug 2, 2011
- Oki Semiconductor Co., Ltd.
- Yoshinori Shizuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication method for semiconductor device
- Patent number 7,919,336
- Issue date Apr 5, 2011
- Oki Semiconductor Co., Ltd.
- Yoshinori Shizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor acceleration sensor device and method for manufacturi...
- Patent number 7,788,976
- Issue date Sep 7, 2010
- Oki Semiconductor Co., Ltd.
- Yoshinori Shizuno
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device with improved design freedom of external terminal
- Patent number 7,736,944
- Issue date Jun 15, 2010
- Oki Semiconductor Co., Ltd.
- Yoshinori Shizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor acceleration sensor device and method for manufacturi...
- Patent number 7,568,390
- Issue date Aug 4, 2009
- Oki Semiconductor Co., Ltd.
- Yoshinori Shizuno
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing semiconductor device that includes mountin...
- Patent number 7,569,419
- Issue date Aug 4, 2009
- Oki Semiconductor Co., Ltd.
- Yoshinori Shizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dicing a semiconductor device into plural chips
- Patent number 7,566,638
- Issue date Jul 28, 2009
- Oki Semiconductor Co., Ltd.
- Yoshinori Shizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with simplified constitution
- Patent number 7,525,167
- Issue date Apr 28, 2009
- Oki Semiconductor Co., Ltd.
- Yoshinori Shizuno
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor device with inclined through holes
- Patent number 7,521,807
- Issue date Apr 21, 2009
- Oki Semiconductor Co., Ltd.
- Yoshinori Shizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an SOI structure and method for manufac...
- Patent number 7,375,397
- Issue date May 20, 2008
- Oki Electric Industry Co., Ltd.
- Yoshinori Shizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 7,329,598
- Issue date Feb 12, 2008
- Oki Electric Industry Co., Ltd.
- Yoshinori Shizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved design freedom of external terminal
- Patent number 7,323,778
- Issue date Jan 29, 2008
- Oki Electric Industry Co., Ltd.
- Yoshinori Shizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,227,243
- Issue date Jun 5, 2007
- Oki Electric Industry Co., Ltd.
- Yoshinori Shizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved design freedom of external terminal
- Patent number 7,193,330
- Issue date Mar 20, 2007
- Oki Electric Industry Co., Ltd.
- Yoshinori Shizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved design freedom of external terminal
- Patent number 7,151,320
- Issue date Dec 19, 2006
- Oki Electric Industry Co., Ltd.
- Yoshinori Shizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate having built-in semiconductor apparatus and manufacturing...
- Patent number 7,087,514
- Issue date Aug 8, 2006
- Oki Electric Industry Co., Ltd.
- Yoshinori Shizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with improved design freedom of external terminal
- Patent number 7,053,486
- Issue date May 30, 2006
- Oki Electric Industry Co., Ltd.
- Yoshinori Shizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of electronic components embedded substrate
- Patent number 7,049,224
- Issue date May 23, 2006
- Oki Electric Industry Co., Ltd.
- Yoshinori Shizuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160105960
- Publication date Apr 14, 2016
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150216049
- Publication date Jul 30, 2015
- IBIDEN CO., LTD.
- Yoshinori SHIZUNO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINED PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150060124
- Publication date Mar 5, 2015
- IBIDEN CO., LTD.
- Makoto TERUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINED PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150060127
- Publication date Mar 5, 2015
- IBIDEN CO., LTD.
- Makoto TERUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140360767
- Publication date Dec 11, 2014
- IBIDEN CO., LTD.
- Makoto TERUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140360759
- Publication date Dec 11, 2014
- IBIDEN CO., LTD.
- Masatoshi KUNIEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140347837
- Publication date Nov 27, 2014
- IBIDEN CO., LTD.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING THE SAME AND METHOD...
- Publication number 20140311780
- Publication date Oct 23, 2014
- IBIDEN CO., LTD.
- Yoshinori SHIZUNO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20140231947
- Publication date Aug 21, 2014
- LAPIS SEMICONDUCTOR CO., LTD.
- Yoshinori SHIZUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140231990
- Publication date Aug 21, 2014
- IBIDEN CO., LTD.
- Shinji Ouchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140102768
- Publication date Apr 17, 2014
- IBIDEN CO., LTD.
- Yoshinori SHIZUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130307162
- Publication date Nov 21, 2013
- IBIDEN CO., LTD.
- Yoshinori Shizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120006592
- Publication date Jan 12, 2012
- IBIDEN CO., LTD.
- Shinji Ouchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120008295
- Publication date Jan 12, 2012
- IBIDEN CO., LTD.
- Shinji Ouchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD WITH EMBEDDED COMPONENT AND METHOD OF MANUFACTURING SAME
- Publication number 20110247211
- Publication date Oct 13, 2011
- Oki Semiconductor Co., Ltd.
- Yoshinori Shizuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fabrication method for semiconductor device
- Publication number 20110151595
- Publication date Jun 23, 2011
- Yoshinori Shizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module
- Publication number 20100117175
- Publication date May 13, 2010
- OKI SEMICONDUCTOR., LTD.
- Yoshinori Shizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20090267209
- Publication date Oct 29, 2009
- Oki Semiconductor Co., Ltd.
- Yoshinori Shizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ACCELERATION SENSOR DEVICE AND METHOD FOR MANUFACTURI...
- Publication number 20090255340
- Publication date Oct 15, 2009
- Oki Semiconductor Co., Ltd.
- Yoshinori SHIZUNO
- G01 - MEASURING TESTING
Information Patent Application
Fabrication method for semiconductor device
- Publication number 20080305565
- Publication date Dec 11, 2008
- Oki Electric Industry Co., Ltd.
- Yoshinori Shizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20080081401
- Publication date Apr 3, 2008
- Oki Electric Industry Co., Ltd.
- Yoshinori Shizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with inclined through holes
- Publication number 20070096330
- Publication date May 3, 2007
- Oki Electric Industry Co., Ltd.
- Yoshinori Shizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with improved design freedom of external terminal
- Publication number 20070070229
- Publication date Mar 29, 2007
- Oki Electric Industry Co., Ltd.
- Yoshinori Shizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20060255408
- Publication date Nov 16, 2006
- Yoshinori Shizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board with embedded component and method of manufacturing same
- Publication number 20060108144
- Publication date May 25, 2006
- Yoshinori Shizuno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of dicing a semiconductor device into plural chips
- Publication number 20060082003
- Publication date Apr 20, 2006
- Yoshinori Shizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device
- Publication number 20060051900
- Publication date Mar 9, 2006
- Oki Electric Industry Co., Ltd
- Yoshinori Shizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with simplified constitution
- Publication number 20060043514
- Publication date Mar 2, 2006
- Yoshinori Shizuno
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Substrate having built-in semiconductor apparatus and manufacturing...
- Publication number 20060008944
- Publication date Jan 12, 2006
- Yoshinori Shizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor acceleration sensor device and method for manufacturi...
- Publication number 20050279166
- Publication date Dec 22, 2005
- Oki Electric Industry Co., Ltd.
- Yoshinori Shizuno
- G01 - MEASURING TESTING

Yoshinori Shizuno

Person

Patents Grantslast 30 patents

Multilayer wiring board having wiring structure for mounting multip...

Wiring board and method for manufacturing the same

Wiring board and method for manufacturing the same

Electronic component, method for manufacturing the same and method...

Wiring board and method for manufacturing the same

Wiring board and method for manufacturing the same

Wiring board and method for manufacturing the same

Wiring board and method for manufacturing the same

Semiconductor module

Semiconductor device

Circuit board with embedded component and method of manufacturing same

Fabrication method for semiconductor device

Circuit board with embedded component and method of manufacturing same

Fabrication method for semiconductor device

Semiconductor acceleration sensor device and method for manufacturi...

Semiconductor device with improved design freedom of external terminal

Semiconductor acceleration sensor device and method for manufacturi...

Method for manufacturing semiconductor device that includes mountin...

Method of dicing a semiconductor device into plural chips

Semiconductor device with simplified constitution

Semiconductor device with inclined through holes

Semiconductor device having an SOI structure and method for manufac...

Method of manufacturing a semiconductor device

Semiconductor device with improved design freedom of external terminal

Semiconductor device

Semiconductor device with improved design freedom of external terminal

Semiconductor device with improved design freedom of external terminal

Substrate having built-in semiconductor apparatus and manufacturing...

Semiconductor device with improved design freedom of external terminal

Manufacturing method of electronic components embedded substrate

Patents Applicationslast 30 patents

MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

COMBINED PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

COMBINED PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC COMPONENT, METHOD FOR MANUFACTURING THE SAME AND METHOD...

SEMICONDUCTOR MODULE

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

CIRCUIT BOARD WITH EMBEDDED COMPONENT AND METHOD OF MANUFACTURING SAME

Fabrication method for semiconductor device

Semiconductor module

Semiconductor device

SEMICONDUCTOR ACCELERATION SENSOR DEVICE AND METHOD FOR MANUFACTURI...

Fabrication method for semiconductor device

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor device with inclined through holes

Semiconductor device with improved design freedom of external terminal

Semiconductor device and method for manufacturing the same

Circuit board with embedded component and method of manufacturing same

Method of dicing a semiconductor device into plural chips

Method of manufacturing a semiconductor device

Semiconductor device with simplified constitution

Substrate having built-in semiconductor apparatus and manufacturing...

Semiconductor acceleration sensor device and method for manufacturi...