Yoshio Imamura

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Ayase-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Component-embedded substrate manufacturing method
- Patent number 9,526,182
- Issue date Dec 20, 2016
- MEIKO ELECTRONICS CO., LTD.
- Ryoichi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a component-embedded substrate
- Patent number 9,320,185
- Issue date Apr 19, 2016
- MEIKO ELECTRONICS CO., LTD.
- Yoshio Imamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component-embedded substrate, and method of manufacturing the compo...
- Patent number 8,921,706
- Issue date Dec 30, 2014
- Meiko Electronics Co., Ltd.
- Mitsuaki Toda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COMPONENT-EMBEDDED SUBSTRATE MANUFACTURING METHOD AND COMPONENT-EMB...
- Publication number 20140347835
- Publication date Nov 27, 2014
- Meiko Electronics Co., Ltd.
- Ryoichi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component-Embedded Substrate Manufacturing Method and Component-Emb...
- Publication number 20140299367
- Publication date Oct 9, 2014
- Meiko Electronics Co., Ltd.
- Yoshio Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING COMPONENT-EMBEDDED SUBSTRATE AND COMPONENT-...
- Publication number 20140216801
- Publication date Aug 7, 2014
- Meiko Electronics Co., Ltd.
- Tohru Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of Manufacturing Component-Embedded Substrate, and Component...
- Publication number 20130242516
- Publication date Sep 19, 2013
- MEIKO ELECTRONICS CO., LTD.
- Yoshio Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT-EMBEDDED SUBSTRATE, AND METHOD OF MANUFACTURING THE COMPO...
- Publication number 20130176701
- Publication date Jul 11, 2013
- Meiko Electronics Co., Ltd.
- Mitsuaki Toda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR