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Yoshio Kamoshita
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Mitaka, JP
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last 30 patents
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Patent Grant
Method of chamfering semiconductor wafer
Patent number
5,295,331
Issue date
Mar 22, 1994
Tokyo Seimitsu Co., Ltd.
Katsuo Honda
B24 - GRINDING POLISHING
Information
Patent Grant
Slicing machine employing an axial force to provide rigidity to a r...
Patent number
5,287,843
Issue date
Feb 22, 1994
Tokyo Seimitsu Co., Ltd.
Ichiro Katayama
B28 - WORKING CEMENT, CLAY, OR STONE
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Patent Grant
Slicing machine and a slicing method by the same
Patent number
5,174,270
Issue date
Dec 29, 1992
Tokyo Seimitsu Co., Ltd.
Ichiro Katayama
B28 - WORKING CEMENT, CLAY, OR STONE