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Yoshio Ohzeki
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Kawasaki, JP
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last 30 patents
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Patent Grant
Bonding wire for semiconductor element
Patent number
5,491,034
Issue date
Feb 13, 1996
Nippon Steel Corporation
Yasuhide Ohno
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
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Patent Grant
Composite lead frame and semiconductor device using the same
Patent number
5,227,662
Issue date
Jul 13, 1993
Nippon Steel Corporation
Yasuhide Ohno
H01 - BASIC ELECTRIC ELEMENTS