Yoshio Okayama

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device with through hole
- Patent number 9,165,898
- Issue date Oct 20, 2015
- Semiconductor Components Industries, LLC
- Kojiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 8,278,213
- Issue date Oct 2, 2012
- Sanyo Electric Co., Ltd.
- Koujiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device with a barrier layer a...
- Patent number 7,759,247
- Issue date Jul 20, 2010
- Sanyo Electric Co., LTD
- Kojiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with via hole of uneven width
- Patent number 7,750,478
- Issue date Jul 6, 2010
- Sanyo Electric Co., LTD
- Koujiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,732,925
- Issue date Jun 8, 2010
- Sanyo Electric Co., LTD
- Yoshio Okayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chucking method and processing method using the same
- Patent number 7,495,881
- Issue date Feb 24, 2009
- Sanyo Electric Co., LTD
- Kojiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with via hole for electric connection
- Patent number 7,485,967
- Issue date Feb 3, 2009
- Sanyo Electric Co., LTD
- Kojiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 7,416,963
- Issue date Aug 26, 2008
- Mitsuo Umemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a barrier layer and a metal layer
- Patent number 7,256,497
- Issue date Aug 14, 2007
- Sanyo Electric Co., LTD
- Koujiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,241,679
- Issue date Jul 10, 2007
- Sanyo Electric Co., LTD
- Koujiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH THROUGH HOLE
- Publication number 20090124078
- Publication date May 14, 2009
- SANYO ELECTRIC CO., LTD.
- Kojiro KAMEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with a barrier layer and a metal layer
- Publication number 20070254475
- Publication date Nov 1, 2007
- SANYO ELECTRIC CO., LTD.
- Koujiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20070249158
- Publication date Oct 25, 2007
- SANYO ELECTRIC CO., LTD.
- Yoshio Okayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20060202348
- Publication date Sep 14, 2006
- Sanyo Electric Co., Ltd.
- Kojiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chucking method and processing method using the same
- Publication number 20060120010
- Publication date Jun 8, 2006
- Sanyo Electric Co., Ltd.
- Kojiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of semiconductor device
- Publication number 20060033168
- Publication date Feb 16, 2006
- SANYO ELECTRIC CO., LTD.
- Mitsuo Umemoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of the same
- Publication number 20050269704
- Publication date Dec 8, 2005
- Sanyo Electric Co., Ltd.
- Koujiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device manufacturing method thereof
- Publication number 20050196957
- Publication date Sep 8, 2005
- Sanyo Electric Co., Ltd.
- Koujiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of the same
- Publication number 20050194670
- Publication date Sep 8, 2005
- Sanyo Electric Co., Ltd.
- Koujiro Kameyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20050189637
- Publication date Sep 1, 2005
- Sanyo Electric Co., Ltd.
- Yoshio Okayama
- H01 - BASIC ELECTRIC ELEMENTS

Yoshio Okayama

Person

Patents Grantslast 30 patents

Method of manufacturing semiconductor device with through hole

Semiconductor device and manufacturing method of the same

Manufacturing method of semiconductor device with a barrier layer a...

Semiconductor device with via hole of uneven width

Semiconductor device and manufacturing method thereof

Chucking method and processing method using the same

Semiconductor device with via hole for electric connection

Manufacturing method of semiconductor device

Semiconductor device with a barrier layer and a metal layer

Method of manufacturing semiconductor device

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH THROUGH HOLE

Semiconductor device with a barrier layer and a metal layer

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Chucking method and processing method using the same

Manufacturing method of semiconductor device

Semiconductor device and manufacturing method of the same

Semiconductor device manufacturing method thereof

Semiconductor device and manufacturing method of the same

Semiconductor device and manufacturing method thereof