Yoshio Sakai

Person

Shiga, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Liquid solder resist composition and covered-printed wiring board
- Patent number 10,527,937
- Issue date Jan 7, 2020
- Goo Chemical Co., Ltd.
- Yoshio Sakai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Solder resist composition and covered printed wiring board
- Patent number 10,317,796
- Issue date Jun 11, 2019
- Goo Chemical Co., Ltd.
- Michiya Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid solder resist composition and printed wiring board
- Patent number 10,261,414
- Issue date Apr 16, 2019
- Goo Chemical Co., Ltd.
- Yoshio Sakai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Liquid solder resist composition and printed wiring board
- Patent number 10,254,647
- Issue date Apr 9, 2019
- Goo Chemical Co., Ltd.
- Yoshio Sakai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Liquid solder resist composition and covered-printed wiring board
- Patent number 10,234,758
- Issue date Mar 19, 2019
- Goo Chemical Co., Ltd.
- Yoshio Sakai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Solder resist composition, and covered-printed wiring board
- Patent number 10,151,976
- Issue date Dec 11, 2018
- Goo Chemical Co., Ltd.
- Yoshio Sakai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Liquid solder resist composition and covered-printed wiring board
- Patent number 9,835,944
- Issue date Dec 5, 2017
- Goo Chemical Co., Ltd.
- Yoshio Sakai
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Carboxyl-containing resin, resin composition for solder mask, and m...
- Patent number 9,458,284
- Issue date Oct 4, 2016
- Goo Chemical Co., Ltd.
- Michiya Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition for masks
- Patent number 9,128,375
- Issue date Sep 8, 2015
- Goo Chemical Co., Ltd.
- Michiya Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LIQUID SOLDER RESIST COMPOSITION AND COVERED-PRINTED WIRING BOARD
- Publication number 20180210336
- Publication date Jul 26, 2018
- Goo Chemical Co., Ltd.
- Yoshio Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID SOLDER RESIST COMPOSITION AND PRINTED WIRING BOARD
- Publication number 20180136559
- Publication date May 17, 2018
- Yoshio Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID SOLDER RESIST COMPOSITION AND PRINTED WIRING BOARD
- Publication number 20180129135
- Publication date May 10, 2018
- Yoshio Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID SOLDER RESIST COMPOSITION AND COVERED-PRINTED WIRING BOARD
- Publication number 20180059544
- Publication date Mar 1, 2018
- Goo Chemical Co., Ltd.
- Yoshio Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER RESIST COMPOSITION, AND COVERED-PRINTED WIRING BOARD
- Publication number 20170336708
- Publication date Nov 23, 2017
- Goo Chemical Co., Ltd.
- Yoshio Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID SOLDER RESIST COMPOSITION AND COVERED-PRINTED WIRING BOARD
- Publication number 20170315443
- Publication date Nov 2, 2017
- Goo Chemical Co., Ltd.
- Nobuhito Hamada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER RESIST COMPOSITION AND COVERED PRINTED WIRING BOARD
- Publication number 20170269477
- Publication date Sep 21, 2017
- Goo Chemical Co., Ltd.
- Michiya Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, SOLDER RESIST COMPOSITION, AND CO...
- Publication number 20170017152
- Publication date Jan 19, 2017
- Goo Chemical Co., Ltd.
- Yoshio SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID SOLDER RESIST COMPOSITION AND COVERED-PRINTED WIRING BOARD
- Publication number 20160342085
- Publication date Nov 24, 2016
- Goo Chemical Co., Ltd.
- Yoshio Sakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARBOXYL-CONTAINING RESIN, RESIN COMPOSITION FOR SOLDER MASK, AND M...
- Publication number 20140308613
- Publication date Oct 16, 2014
- Goo Chemical Co., Ltd.
- Michiya Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION FOR MASKS
- Publication number 20140186766
- Publication date Jul 3, 2014
- Michiya Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Yoshio Sakai

Person

Patents Grantslast 30 patents

Liquid solder resist composition and covered-printed wiring board

Solder resist composition and covered printed wiring board

Liquid solder resist composition and printed wiring board

Liquid solder resist composition and printed wiring board

Liquid solder resist composition and covered-printed wiring board

Solder resist composition, and covered-printed wiring board

Liquid solder resist composition and covered-printed wiring board

Carboxyl-containing resin, resin composition for solder mask, and m...

Resin composition for masks

Patents Applicationslast 30 patents

LIQUID SOLDER RESIST COMPOSITION AND COVERED-PRINTED WIRING BOARD

LIQUID SOLDER RESIST COMPOSITION AND PRINTED WIRING BOARD

LIQUID SOLDER RESIST COMPOSITION AND PRINTED WIRING BOARD

LIQUID SOLDER RESIST COMPOSITION AND COVERED-PRINTED WIRING BOARD

SOLDER RESIST COMPOSITION, AND COVERED-PRINTED WIRING BOARD

LIQUID SOLDER RESIST COMPOSITION AND COVERED-PRINTED WIRING BOARD

SOLDER RESIST COMPOSITION AND COVERED PRINTED WIRING BOARD

PHOTOSENSITIVE RESIN COMPOSITION, SOLDER RESIST COMPOSITION, AND CO...

LIQUID SOLDER RESIST COMPOSITION AND COVERED-PRINTED WIRING BOARD

CARBOXYL-CONTAINING RESIN, RESIN COMPOSITION FOR SOLDER MASK, AND M...

RESIN COMPOSITION FOR MASKS