Yoshio Watanabe

Person

  • Hitachi, JP

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    WAFER PROCESSING METHOD

    • Publication number 20220102215
    • Publication date Mar 31, 2022
    • Disco Corporation
    • Susumu YOKOO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROCESSING METHOD OF WORKPIECE

    • Publication number 20210090926
    • Publication date Mar 25, 2021
    • Disco Corporation
    • Yoshio WATANABE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROCESSING METHOD OF WAFER

    • Publication number 20210028022
    • Publication date Jan 28, 2021
    • Disco Corporation
    • Hiroyuki TAKAHASHI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF PROCESSING WAFER

    • Publication number 20180269068
    • Publication date Sep 20, 2018
    • Disco Corporation
    • Yoshio Watanabe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LINEAR ENCODER

    • Publication number 20170199060
    • Publication date Jul 13, 2017
    • Dr. Johannes Heidenhain Gmbh
    • Daisuke Shimoda
    • G01 - MEASURING TESTING
  • Information Patent Application

    PLASMA ETCHING APPARATUS

    • Publication number 20160343544
    • Publication date Nov 24, 2016
    • Disco Corporation
    • Yoshio Watanabe
    • H01 - BASIC ELECTRIC ELEMENTS