Yoshirou Nakata

Person

Nara, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Probe card and semiconductor wafer inspection method using the same
- Patent number 8,659,312
- Issue date Feb 25, 2014
- Panasonic Corporation
- Yoshirou Nakata
- G01 - MEASURING TESTING
Information Patent Grant
Wafer inspection device
- Patent number 8,638,118
- Issue date Jan 28, 2014
- Panasonic Corporation
- Yoshirou Nakata
- G01 - MEASURING TESTING
Information Patent Grant
Probe, electronic device test apparatus, and method of producing th...
- Patent number 8,598,902
- Issue date Dec 3, 2013
- Advantest Corporation
- Yoshiharu Umemura
- G01 - MEASURING TESTING
Information Patent Grant
Wafer inspection device and semiconductor wafer inspection method u...
- Patent number 8,400,182
- Issue date Mar 19, 2013
- Panasonic Corporation
- Yoshirou Nakata
- G01 - MEASURING TESTING
Information Patent Grant
Probe card, method of manufacturing the probe card and alignment me...
- Patent number 7,982,482
- Issue date Jul 19, 2011
- Panasonic Corporation
- Kenji Yamada
- G01 - MEASURING TESTING
Information Patent Grant
Probe card for semiconductor IC test and method of manufacturing th...
- Patent number 7,768,285
- Issue date Aug 3, 2010
- Panasonic Corporation
- Minoru Sanada
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor IC and testing method thereof
- Patent number 7,673,205
- Issue date Mar 2, 2010
- Panasonic Corporation
- Naomi Miyake
- G01 - MEASURING TESTING
Information Patent Grant
Probe card having a conductive thin film on the surface of an insul...
- Patent number 7,589,543
- Issue date Sep 15, 2009
- Matsushita Electric Industrial Co., Ltd.
- Kenji Yamada
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor wafer and testing method therefor
- Patent number 7,170,189
- Issue date Jan 30, 2007
- Matsushita Electric Industrial Co., Ltd.
- Masao Takahashi
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor wafer package, method and apparatus for connecting te...
- Patent number 6,323,663
- Issue date Nov 27, 2001
- Matsushita Electric Industrial Co., Ltd.
- Yoshirou Nakata
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor wafer package, method and apparatus for connecting te...
- Patent number 6,005,401
- Issue date Dec 21, 1999
- Matsushita Electric Industrial Co., Ltd.
- Yoshirou Nakata
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor wafer package, method and apparatus for connecting te...
- Patent number 5,945,834
- Issue date Aug 31, 1999
- Matsushita Electric Industrial Co., Ltd.
- Yoshirou Nakata
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
WAFER INSPECTION DEVICE
- Publication number 20130147504
- Publication date Jun 13, 2013
- PANASONIC CORPORATION
- Yoshirou NAKATA
- G01 - MEASURING TESTING
Information Patent Application
WAFER INSPECTION DEVICE AND SEMICONDUCTOR WAFER INSPECTION METHOD U...
- Publication number 20110095780
- Publication date Apr 28, 2011
- Yoshirou NAKATA
- G01 - MEASURING TESTING
Information Patent Application
PROBE CARD AND SEMICONDUCTOR WAFER INSPECTION METHOD USING THE SAME
- Publication number 20110074455
- Publication date Mar 31, 2011
- Yoshirou NAKATA
- G01 - MEASURING TESTING
Information Patent Application
PROBE CARD, METHOD OF MANUFACTURING THE PROBE CARD AND ALIGNMENT ME...
- Publication number 20090183363
- Publication date Jul 23, 2009
- Panasonic Corporation
- Kenji Yamada
- G01 - MEASURING TESTING
Information Patent Application
Probe card for semiconductor IC test and method of manufacturing th...
- Publication number 20080150563
- Publication date Jun 26, 2008
- Matsushita Electric Industrial Co., Ltd.
- Minoru Sanada
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor IC and testing method thereof
- Publication number 20080098267
- Publication date Apr 24, 2008
- Matsushita Electric Industrial Co., Ltd.
- Naomi Miyake
- G01 - MEASURING TESTING
Information Patent Application
Probe card, method of manufacturing the probe card and alignment me...
- Publication number 20060132155
- Publication date Jun 22, 2006
- Matsushita Electric Industrial Co., Ltd.
- Kenji Yamada
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor wafer and testing method therefor
- Publication number 20060103408
- Publication date May 18, 2006
- Matsushita Electric Industrial Co., Ltd.
- Masao Takahashi
- G01 - MEASURING TESTING

Yoshirou Nakata

Person

Patents Grantslast 30 patents

Probe card and semiconductor wafer inspection method using the same

Wafer inspection device

Probe, electronic device test apparatus, and method of producing th...

Wafer inspection device and semiconductor wafer inspection method u...

Probe card, method of manufacturing the probe card and alignment me...

Probe card for semiconductor IC test and method of manufacturing th...

Semiconductor IC and testing method thereof

Probe card having a conductive thin film on the surface of an insul...

Semiconductor wafer and testing method therefor

Semiconductor wafer package, method and apparatus for connecting te...

Semiconductor wafer package, method and apparatus for connecting te...

Semiconductor wafer package, method and apparatus for connecting te...

Patents Applicationslast 30 patents

WAFER INSPECTION DEVICE

WAFER INSPECTION DEVICE AND SEMICONDUCTOR WAFER INSPECTION METHOD U...

PROBE CARD AND SEMICONDUCTOR WAFER INSPECTION METHOD USING THE SAME

PROBE CARD, METHOD OF MANUFACTURING THE PROBE CARD AND ALIGNMENT ME...

Probe card for semiconductor IC test and method of manufacturing th...

Semiconductor IC and testing method thereof

Probe card, method of manufacturing the probe card and alignment me...

Semiconductor wafer and testing method therefor