Yoshirou Nishinaka

Person

Itami, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Lead frame including frame-cutting slit for lead-on-chip (LOC) semi...
- Patent number 5,900,582
- Issue date May 4, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe including frame-cutting slit for lead-on-chip (LOC) semic...
- Patent number 5,763,829
- Issue date Jun 9, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making leadframe for lead-on-chip (LOC) semiconductor device
- Patent number 5,724,726
- Issue date Mar 10, 1998
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material, junctioning method, junction material, and semicon...
- Patent number 5,609,287
- Issue date Mar 11, 1997
- Mitsubishi Denki Kabushiki Kaisha
- Goro Izuta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a lead on chip (LOC) semiconductor device
- Patent number 5,535,509
- Issue date Jul 16, 1996
- Mitsubishi Denki Kabushiki Kaisha
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material, junctioning method, junction material, and semicon...
- Patent number 5,372,295
- Issue date Dec 13, 1994
- Ryoden Semiconductor System Engineering Corporation
- Shunichi Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Yoshirou Nishinaka

Person

Patents Grantslast 30 patents

Lead frame including frame-cutting slit for lead-on-chip (LOC) semi...

Leadframe including frame-cutting slit for lead-on-chip (LOC) semic...

Method of making leadframe for lead-on-chip (LOC) semiconductor device

Solder material, junctioning method, junction material, and semicon...

Method of making a lead on chip (LOC) semiconductor device

Solder material, junctioning method, junction material, and semicon...