Yoshitaka Fukuoka

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayer wiring board for an electronic device
- Patent number 10,104,785
- Issue date Oct 16, 2018
- Invensas Corporation
- Tomoo Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board for an electronic device
- Patent number 9,521,755
- Issue date Dec 13, 2016
- Invensas Corporation
- Tomoo Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component built-in wiring board and method for radiating...
- Patent number 8,198,541
- Issue date Jun 12, 2012
- Dai Nippon Printing Co., Ltd.
- Kenji Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and production method thereof
- Patent number 8,114,714
- Issue date Feb 14, 2012
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and production method thereof
- Patent number 7,772,684
- Issue date Aug 10, 2010
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating wiring board provided with passive element,...
- Patent number 7,679,925
- Issue date Mar 16, 2010
- Dai Nippon Printing Co., Ltd.
- Yoshitaka Fukuoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component built-in wiring board and manufacturing method of compone...
- Patent number 7,644,497
- Issue date Jan 12, 2010
- Dai Nippon Printing Co., Ltd.
- Tatsuro Imamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board for an electronic device
- Patent number 7,505,281
- Issue date Mar 17, 2009
- Tessera Interconnect Materials, Inc.
- Tomoo Iijima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component built-in wiring board and manufacturing method of compone...
- Patent number 7,345,888
- Issue date Mar 18, 2008
- Dai Nippon Printing Co., Ltd.
- Tatsuro Imamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board for an electronic device
- Patent number 7,342,802
- Issue date Mar 11, 2008
- Tessera Interconnect Materials, Inc.
- Tomoo Iijima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board incorporating components and process for producing the...
- Patent number 7,242,591
- Issue date Jul 10, 2007
- Dai Nippon Printing Co., Ltd.
- Tatsuro Imamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating wiring board provided with passive element
- Patent number 7,100,276
- Issue date Sep 5, 2006
- Dai Nippon Printing Co., Ltd.
- Yoshitaka Fukuoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board provided with passive element and cone shaped bumps
- Patent number 6,872,893
- Issue date Mar 29, 2005
- Dai Nippon Printing Co., Ltd.
- Yoshitaka Fukuoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board with plurality of interconnect patterns and co...
- Patent number 6,705,003
- Issue date Mar 16, 2004
- Kabushiki Kaisha Toshiba
- Tomohisa Motomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Anisotropic conductive film and resin filling gap between a flip-ch...
- Patent number 6,388,321
- Issue date May 14, 2002
- Kabushiki Kaisha Toshiba
- Hiroyuki Hirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, wiring board fabrication method, and semiconductor pa...
- Patent number 6,353,189
- Issue date Mar 5, 2002
- Kabushiki Kaisha Toshiba
- Osamu Shimada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for manufacturing multilayered wiring board an...
- Patent number 6,237,218
- Issue date May 29, 2001
- Kabushiki Kaisha Toshiba
- Akira Ogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-chip module, an electronic device, and production method thereof
- Patent number 5,949,654
- Issue date Sep 7, 1999
- Kabushiki Kaisha Toshiba
- Yoshitaka Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a high-density printed wiring board for mounting
- Patent number 5,915,753
- Issue date Jun 29, 1999
- Kabushiki Kaisha Toshiba
- Tomohisa Motomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module and production method thereof
- Patent number 5,818,699
- Issue date Oct 6, 1998
- Kabushiki Kaisha Toshiba
- Yoshitaka Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a high-density printed wiring board for mounting
- Patent number 5,737,833
- Issue date Apr 14, 1998
- Kabushiki Kaisha Toshiba
- Tomohisa Motomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate
- Patent number 5,532,906
- Issue date Jul 2, 1996
- Kabushiki Kaisha Toshiba
- Jun Hanari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a thick film resistor element
- Patent number 5,169,493
- Issue date Dec 8, 1992
- Kabushiki Kaisha Toshiba
- Minoru Nii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic apparatus
- Patent number 5,153,709
- Issue date Oct 6, 1992
- Kabushiki Kaisha Toshiba
- Yoshitaka Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device
- Patent number 4,639,830
- Issue date Jan 27, 1987
- Kabushiki Kaisha Toshiba
- Yoshitaka Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging electronic parts
- Patent number 4,517,738
- Issue date May 21, 1985
- Tokyo Shibaura Denki Kabushiki Kaisha
- Yoshitaka Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER WIRING BOARD FOR AN ELECTRONIC DEVICE
- Publication number 20170171986
- Publication date Jun 15, 2017
- Invensas Corporation
- Tomoo Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING BOARD FOR AN ELECTRONIC DEVICE
- Publication number 20140240934
- Publication date Aug 28, 2014
- Invensas Corporation
- Tomoo Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING BOARD FOR AN ELECTRONIC DEVICE
- Publication number 20130247372
- Publication date Sep 26, 2013
- Invensas Corporation
- Tomoo Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT BUILT-IN WIRING BOARD AND METHOD FOR RADIATING...
- Publication number 20100025082
- Publication date Feb 4, 2010
- Kenji Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer wiring board for an electronic device
- Publication number 20080296254
- Publication date Dec 4, 2008
- Tessera Interconnect Materials, Inc.
- Tomoo Iijima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component built-in wiring board and manufacturing method of compone...
- Publication number 20080163486
- Publication date Jul 10, 2008
- DAI NIPPON PRINTING CO., LTD.
- Tatsuro Imamura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC DEVICE AND PRODUCTION METHOD THEREOF
- Publication number 20070287230
- Publication date Dec 13, 2007
- DAI NIPPON PRINTING CO., LTD.
- Satoru Kuramochi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Component built-in wiring board and manufacturing method of compone...
- Publication number 20070195511
- Publication date Aug 23, 2007
- DAI NIPPON PRINTING CO., LTD.
- Tatsuro Imamura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Multilayer wiring board for an electronic device
- Publication number 20070121305
- Publication date May 31, 2007
- Tessera Interconnect Materials, Inc.
- Tomoo Iijima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for fabricating wiring board provided with passive element,...
- Publication number 20060254050
- Publication date Nov 16, 2006
- DAI NIPPON PRINTING CO., LTD.
- Yoshitaka Fukuoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wiring board incorporating components and process for producing the...
- Publication number 20060154496
- Publication date Jul 13, 2006
- Tatsuro Imamura
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic device and production method thereof
- Publication number 20050157477
- Publication date Jul 21, 2005
- DAI NIPPON PRINTING CO., LTD.
- Satoru Kuramochi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for fabricating wiring board provided with passive element,...
- Publication number 20050126820
- Publication date Jun 16, 2005
- DAI NIPPON PRINTING CO., LTD.
- Yoshitaka Fukuoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer wiring board for an electronic device
- Publication number 20050000729
- Publication date Jan 6, 2005
- NORTH CORPORATION
- Tomoo Iljima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for fabricating wiring board provided wiht passive element,...
- Publication number 20020179329
- Publication date Dec 5, 2002
- DAI NIPPON PRINTING CO. , LTD.
- Yoshitaka Fukuoka
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Printed wiring board and manufacturing method thereof
- Publication number 20020000328
- Publication date Jan 3, 2002
- Kabushiki Kaisha Toshiba
- Tomohisa Motomura
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Yoshitaka Fukuoka

Person

Patents Grantslast 30 patents

Multilayer wiring board for an electronic device

Multilayer wiring board for an electronic device

Electronic component built-in wiring board and method for radiating...

Electronic device and production method thereof

Electronic device and production method thereof

Method for fabricating wiring board provided with passive element,...

Component built-in wiring board and manufacturing method of compone...

Multilayer wiring board for an electronic device

Component built-in wiring board and manufacturing method of compone...

Multilayer wiring board for an electronic device

Wiring board incorporating components and process for producing the...

Method for fabricating wiring board provided with passive element

Wiring board provided with passive element and cone shaped bumps

Printed wiring board with plurality of interconnect patterns and co...

Anisotropic conductive film and resin filling gap between a flip-ch...

Wiring board, wiring board fabrication method, and semiconductor pa...

Method and apparatus for manufacturing multilayered wiring board an...

Multi-chip module, an electronic device, and production method thereof

Method of producing a high-density printed wiring board for mounting

Multi-chip module and production method thereof

Method of producing a high-density printed wiring board for mounting

Wiring substrate

Method of manufacturing a thick film resistor element

Electronic apparatus

Packaged electronic device

Method for packaging electronic parts

Patents Applicationslast 30 patents

MULTILAYER WIRING BOARD FOR AN ELECTRONIC DEVICE

MULTILAYER WIRING BOARD FOR AN ELECTRONIC DEVICE

MULTILAYER WIRING BOARD FOR AN ELECTRONIC DEVICE

ELECTRONIC COMPONENT BUILT-IN WIRING BOARD AND METHOD FOR RADIATING...

Multilayer wiring board for an electronic device

Component built-in wiring board and manufacturing method of compone...

ELECTRONIC DEVICE AND PRODUCTION METHOD THEREOF

Component built-in wiring board and manufacturing method of compone...

Multilayer wiring board for an electronic device

Method for fabricating wiring board provided with passive element,...

Wiring board incorporating components and process for producing the...

Electronic device and production method thereof

Method for fabricating wiring board provided with passive element,...

Multilayer wiring board for an electronic device

Method for fabricating wiring board provided wiht passive element,...

Printed wiring board and manufacturing method thereof