Yoshitaka Nakamura

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 12,015,080
- Issue date Jun 18, 2024
- Micron Technology, Inc.
- Yoshitaka Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,848,360
- Issue date Dec 19, 2023
- Micron Technology, Inc.
- Yoshitaka Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device
- Patent number 11,488,963
- Issue date Nov 1, 2022
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor contact formation
- Patent number 11,393,688
- Issue date Jul 19, 2022
- Micron Technology, Inc.
- Jerome A. Imonigie
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VERTICALLY-ARRANGED GATE ALL AROUND TRANSISTORS HAVING UNIFORM CELL...
- Publication number 20250056828
- Publication date Feb 13, 2025
- Micron Technology, Inc.
- Si-Woo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CAPACITORS FOR THREE-DIMENSIONAL MEMORY SYSTEMS
- Publication number 20250040121
- Publication date Jan 30, 2025
- Micron Technology, Inc.
- Yuanzhi Ma
Information Patent Application
SEMICONDUCTOR DEVICE WITH LINED CAPACITOR AND METHODS FOR MANUFACTU...
- Publication number 20240431095
- Publication date Dec 26, 2024
- Micron Technology, Inc.
- Yoshitaka Nakamura
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20240282856
- Publication date Aug 22, 2024
- Micron Technology, Inc.
- Yoshitaka Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL DIGIT LINES WITH ALTERNATING EPITAXIAL SILICON FOR HORIZON...
- Publication number 20240098970
- Publication date Mar 21, 2024
- Micron Technology, Inc.
- Scott E. Sills
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT PILLARS WITH MULTIPLE, ALTERNATING EPITAXIAL SILICON FOR HO...
- Publication number 20240098969
- Publication date Mar 21, 2024
- Micron Technology, Inc.
- David K. Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF A LATERAL 3D MEMORY DEVICE
- Publication number 20240074141
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Yoshitaka Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT STRUCTURE FOR MULTIPLE, ALTERNATING EPITAXIAL SILICON
- Publication number 20230397391
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Si-Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE, ALTERNATING EPITAXIAL SILICON FOR HORIZONTAL ACCESS DEVIC...
- Publication number 20230397390
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- David K. Hwang
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20220406899
- Publication date Dec 22, 2022
- Micron Technology, Inc.
- Yoshitaka Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20220059693
- Publication date Feb 24, 2022
- Micron Technology, Inc.
- Yoshitaka Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR DEVICE
- Publication number 20220059545
- Publication date Feb 24, 2022
- Micron Technology, Inc.
- Mitsunari Sukekawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONTACT FORMATION
- Publication number 20220045195
- Publication date Feb 10, 2022
- Micron Technology, Inc.
- Jerome A. Imonigie
- H01 - BASIC ELECTRIC ELEMENTS

Yoshitaka Nakamura

Person

Patents Grantslast 30 patents

Integrated assemblies and methods of forming integrated assemblies

Integrated assemblies and methods of forming integrated assemblies

Method of forming a semiconductor device

Semiconductor contact formation

Patents Applicationslast 30 patents

VERTICALLY-ARRANGED GATE ALL AROUND TRANSISTORS HAVING UNIFORM CELL...

MULTI-LAYER CAPACITORS FOR THREE-DIMENSIONAL MEMORY SYSTEMS

SEMICONDUCTOR DEVICE WITH LINED CAPACITOR AND METHODS FOR MANUFACTU...

Integrated Assemblies and Methods of Forming Integrated Assemblies

VERTICAL DIGIT LINES WITH ALTERNATING EPITAXIAL SILICON FOR HORIZON...

SUPPORT PILLARS WITH MULTIPLE, ALTERNATING EPITAXIAL SILICON FOR HO...

FABRICATION METHOD OF A LATERAL 3D MEMORY DEVICE

SUPPORT STRUCTURE FOR MULTIPLE, ALTERNATING EPITAXIAL SILICON

MULTIPLE, ALTERNATING EPITAXIAL SILICON FOR HORIZONTAL ACCESS DEVIC...

Integrated Assemblies and Methods of Forming Integrated Assemblies

Integrated Assemblies and Methods of Forming Integrated Assemblies

METHOD OF FORMING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR CONTACT FORMATION