Yoshitaka NISHIMURA

Person

Azumino-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Solder material for semiconductor device
- Patent number 11,145,615
- Issue date Oct 12, 2021
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 10,896,892
- Issue date Jan 19, 2021
- Fuji Electric Co., Ltd.
- Fumihiko Momose
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder material for semiconductor device
- Patent number 10,727,194
- Issue date Jul 28, 2020
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 10,446,460
- Issue date Oct 15, 2019
- Fuji Electric Co., Ltd.
- Hiromichi Gohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,297,527
- Issue date May 21, 2019
- Fuji Electric Co., Ltd.
- Takashi Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,276,474
- Issue date Apr 30, 2019
- Fuji Electric Co., Ltd.
- Takashi Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of semiconductor device
- Patent number 10,157,877
- Issue date Dec 18, 2018
- Fuji Electric Co., Ltd.
- Kazumasa Kido
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Semiconductor module and manufacturing method of semiconductor module
- Patent number 10,128,167
- Issue date Nov 13, 2018
- Fuji Electric Co., Ltd.
- Akira Morozumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,128,345
- Issue date Nov 13, 2018
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 10,128,166
- Issue date Nov 13, 2018
- Fuji Electric Co., Ltd.
- Motohito Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing same
- Patent number 10,090,223
- Issue date Oct 2, 2018
- Fuji Electric Co., Ltd.
- Fumihiko Momose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,978,701
- Issue date May 22, 2018
- Fuji Electric Co., Ltd.
- Takashi Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 9,888,611
- Issue date Feb 6, 2018
- Fuji Electric Co., Ltd.
- Takafumi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the semiconductor...
- Patent number 9,748,186
- Issue date Aug 29, 2017
- Fuji Electric Co., Ltd.
- Fumihiko Momose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,673,129
- Issue date Jun 6, 2017
- Fuji Electric Co., Ltd.
- Motohito Hori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module and electrically-driven vehicle
- Patent number 9,412,680
- Issue date Aug 9, 2016
- Fuji Electric Co., Ltd.
- Hiromichi Gohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor device
- Patent number 9,269,644
- Issue date Feb 23, 2016
- Fuji Electric Co., Ltd.
- Yoshitaka Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,860,220
- Issue date Oct 14, 2014
- Fuji Electric Co., Ltd.
- Fumihiko Momose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 8,395,262
- Issue date Mar 12, 2013
- Fuji Electric Co., Ltd.
- Fumihiko Momose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering method and method of manufacturing semiconductor device i...
- Patent number 8,273,644
- Issue date Sep 25, 2012
- Fuji Electric Co., Ltd.
- Kazunaga Onishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,038,313
- Issue date May 2, 2006
- Fuji Electric Device Technology Co., Ltd.
- Eiji Mochizuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of relaxing thermal stress
- Patent number 6,844,621
- Issue date Jan 18, 2005
- Fuji Electric Co., Ltd.
- Akira Morozumi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE
- Publication number 20210407953
- Publication date Dec 30, 2021
- Fuji Electric Co., Ltd.
- Hirohiko WATANABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE
- Publication number 20200303337
- Publication date Sep 24, 2020
- Fuji Electric Co., Ltd.
- Hirohiko WATANABE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180315676
- Publication date Nov 1, 2018
- Fuji Electric Co., Ltd.
- Hiromichi GOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20180166549
- Publication date Jun 14, 2018
- Fuji Electric Co., Ltd.
- Ryoichi KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE
- Publication number 20180033761
- Publication date Feb 1, 2018
- Fuji Electric Co., Ltd.
- Hirohiko WATANABE
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20170317008
- Publication date Nov 2, 2017
- Fuji Electric Co., Ltd.
- Fumihiko MOMOSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND MANUFACTURING METHOD OF SEMICONDUCTOR MODULE
- Publication number 20170271239
- Publication date Sep 21, 2017
- Fuji Electric Co., Ltd.
- Akira MOROZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170077009
- Publication date Mar 16, 2017
- Fuji Electric Co., Ltd.
- Takashi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20160343641
- Publication date Nov 24, 2016
- Fuji Electric Co., Ltd.
- Motohito HORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20160225688
- Publication date Aug 4, 2016
- Fuji Electric Co., Ltd.
- Takashi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND ELECTRICALLY-DRIVEN VEHICLE
- Publication number 20160099194
- Publication date Apr 7, 2016
- Fuji Electric Co., Ltd.
- Hiromichi GOHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20160035690
- Publication date Feb 4, 2016
- Fuji Electric Co., Ltd.
- Kazumasa KIDO
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160035683
- Publication date Feb 4, 2016
- Fuji Electric Co., Ltd.
- Takashi SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20150380368
- Publication date Dec 31, 2015
- Fuji Electric Co., Ltd.
- Fumihiko MOMOSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150380338
- Publication date Dec 31, 2015
- Fuji Electric Co., Ltd.
- Motohito HORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20150382506
- Publication date Dec 31, 2015
- Fuji Electric Co., Ltd.
- Takafumi YAMADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150303166
- Publication date Oct 22, 2015
- Fuji Electric Co., Ltd.
- Fumihiko MOMOSE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING THE SAME
- Publication number 20140080262
- Publication date Mar 20, 2014
- Fuji Electric Co., Ltd.
- Yoshitaka NISHIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130244380
- Publication date Sep 19, 2013
- Fuji Electric Co., Ltd.
- Fumihiko MOMOSE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20110186999
- Publication date Aug 4, 2011
- Fuji Electric Systems Co., Ltd.
- Fumihiko Momose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE I...
- Publication number 20080206928
- Publication date Aug 28, 2008
- Fuji Electric Device Technology Co., LTD.
- Kazunaga ONISHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method for producing the same
- Publication number 20060157862
- Publication date Jul 20, 2006
- Fuji Electric Device Technology, Co., Ltd.
- Yoshitaka Nishimura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20040232544
- Publication date Nov 25, 2004
- Eiji Mochizuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of relaxing thermal stress
- Publication number 20040102023
- Publication date May 27, 2004
- Fuji Electric Co., Ltd.
- Akira Morozumi
- H01 - BASIC ELECTRIC ELEMENTS

Yoshitaka NISHIMURA

Person

Patents Grantslast 30 patents

Solder material for semiconductor device

Wire bonding apparatus

Solder material for semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device and manufacturing method of semiconductor device

Semiconductor module and manufacturing method of semiconductor module

Semiconductor device

Power semiconductor module

Semiconductor device and method of manufacturing same

Semiconductor device

Power semiconductor module

Semiconductor device and method for manufacturing the semiconductor...

Semiconductor device

Semiconductor module and electrically-driven vehicle

Method for producing semiconductor device

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Soldering method and method of manufacturing semiconductor device i...

Semiconductor device and method of manufacturing the same

Semiconductor device and method of relaxing thermal stress

Patents Applicationslast 30 patents

SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE

SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

SEMICONDUCTOR MODULE AND MANUFACTURING METHOD OF SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR MODULE AND ELECTRICALLY-DRIVEN VEHICLE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE

POWER SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

METHOD FOR PRODUCING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SOLDERING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE I...

Semiconductor device and method for producing the same

Semiconductor device and method of manufacturing the same

Semiconductor device and method of relaxing thermal stress