Yoshitaka Otsu

Person

Yokkaichi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional memory device with dielectric isolated via struct...
- Patent number 12,068,249
- Issue date Aug 20, 2024
- SanDisk Technologies LLC
- Yoshiyuki Kuroko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing a capped isolation trenc...
- Patent number 12,009,306
- Issue date Jun 11, 2024
- SanDisk Technologies LLC
- Yoshitaka Otsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with via structures surrounded by p...
- Patent number 11,756,877
- Issue date Sep 12, 2023
- SanDisk Technologies LLC
- Kazuto Ohsawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-tier three-dimensional memory device with dielectric support...
- Patent number 11,495,616
- Issue date Nov 8, 2022
- SanDisk Technologies LLC
- Takuya Sakurai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including multi-tier moat isolation...
- Patent number 11,404,427
- Issue date Aug 2, 2022
- SanDisk Technologies LLC
- Yoshitaka Otsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including through-memory-level via...
- Patent number 11,398,488
- Issue date Jul 26, 2022
- SanDisk Technologies LLC
- Takaaki Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including locally thickened electri...
- Patent number 11,355,515
- Issue date Jun 7, 2022
- SanDisk Technologies LLC
- Naoto Hojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device with via structures surrounded by p...
- Patent number 11,282,783
- Issue date Mar 22, 2022
- SanDisk Technologies LLC
- Yoshitaka Otsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing width-modulated connecti...
- Patent number 11,114,459
- Issue date Sep 7, 2021
- SanDisk Technologies LLC
- Takaaki Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing eye-shaped contact via s...
- Patent number 10,985,176
- Issue date Apr 20, 2021
- SanDisk Technologies LLC
- Takaaki Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-tier three-dimensional memory device with dielectric support...
- Patent number 10,971,514
- Issue date Apr 6, 2021
- SanDisk Technologies LLC
- Yoshitaka Otsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-tier three-dimensional memory device with dielectric support...
- Patent number 10,957,706
- Issue date Mar 23, 2021
- SanDisk Technologies LLC
- Yoshitaka Otsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing a polygonal lattice of s...
- Patent number 10,937,801
- Issue date Mar 2, 2021
- SanDisk Technologies LLC
- Yoshitaka Otsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing direct source contact st...
- Patent number 10,923,498
- Issue date Feb 16, 2021
- SanDisk Technologies LLC
- Yoshitaka Otsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing eye-shaped contact via s...
- Patent number 10,879,262
- Issue date Dec 29, 2020
- SanDisk Technologies LLC
- Takaaki Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing through-array contact vi...
- Patent number 10,879,264
- Issue date Dec 29, 2020
- SanDisk Technologies LLC
- Yoshitaka Otsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device containing through-array contact vi...
- Patent number 10,872,857
- Issue date Dec 22, 2020
- SanDisk Technologies LLC
- Yoshitaka Otsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having double-width staircase regio...
- Patent number 10,847,524
- Issue date Nov 24, 2020
- SanDisk Technologies LLC
- Yoshitaka Otsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device including locally thickened electri...
- Patent number 10,700,089
- Issue date Jun 30, 2020
- SanDisk Technologies LLC
- Naoto Hojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional memory device having double-width staircase regio...
- Patent number 10,615,172
- Issue date Apr 7, 2020
- SanDisk Technologies LLC
- Koichiro Nagata
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING INVERTED STAIRCASE AND M...
- Publication number 20240260268
- Publication date Aug 1, 2024
- SANDISK TECHNOLOGIES LLC
- Takayuki MAEKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING A CAPPED ISOLATION TRENC...
- Publication number 20230013984
- Publication date Jan 19, 2023
- SANDISK TECHNOLOGIES LLC
- Yoshitaka OTSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH DIELECTRIC ISOLATED VIA STRUCT...
- Publication number 20220051979
- Publication date Feb 17, 2022
- SANDISK TECHNOLOGIES LLC
- Yoshiyuki KUROKO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING MULTI-TIER MOAT ISOLATION...
- Publication number 20210391345
- Publication date Dec 16, 2021
- SANDISK TECHNOLOGIES LLC
- Yoshitaka OTSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING THROUGH-MEMORY-LEVEL VIA...
- Publication number 20210384206
- Publication date Dec 9, 2021
- SANDISK TECHNOLOGIES LLC
- Takaaki IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH DIELECTRIC ISOLATED VIA STRUCT...
- Publication number 20210210503
- Publication date Jul 8, 2021
- SANDISK TECHNOLOGIES LLC
- Koichi MATSUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH VIA STRUCTURES SURROUNDED BY P...
- Publication number 20210210424
- Publication date Jul 8, 2021
- SANDISK TECHNOLOGIES LLC
- Yoshitaka OTSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH VIA STRUCTURES SURROUNDED BY P...
- Publication number 20210210504
- Publication date Jul 8, 2021
- SANDISK TECHNOLOGIES LLC
- Yoshitaka OTSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE WITH VIA STRUCTURES SURROUNDED BY P...
- Publication number 20210210428
- Publication date Jul 8, 2021
- SANDISK TECHNOLOGIES LLC
- Kazuto OHSAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING WIDTH-MODULATED CONNECTI...
- Publication number 20210134827
- Publication date May 6, 2021
- SANDISK TECHNOLOGIES LLC
- Takaaki IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING THROUGH-ARRAY CONTACT VI...
- Publication number 20200402992
- Publication date Dec 24, 2020
- SANDISK TECHNOLOGIES LLC
- Yoshitaka OTSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING THROUGH-ARRAY CONTACT VI...
- Publication number 20200402905
- Publication date Dec 24, 2020
- SANDISK TECHNOLOGIES LLC
- Yoshitaka OTSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-TIER THREE-DIMENSIONAL MEMORY DEVICE WITH DIELECTRIC SUPPORT...
- Publication number 20200403005
- Publication date Dec 24, 2020
- SANDISK TECHNOLOGIES LLC
- Takuya SAKURAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING DIRECT SOURCE CONTACT ST...
- Publication number 20200343258
- Publication date Oct 29, 2020
- SANDISK TECHNOLOGIES LLC
- Yoshitaka OTSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING EYE-SHAPED CONTACT VIA S...
- Publication number 20200312864
- Publication date Oct 1, 2020
- SANDISK TECHNOLOGIES LLC
- Takaaki IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE HAVING DOUBLE-WIDTH STAIRCASE REGIO...
- Publication number 20200312859
- Publication date Oct 1, 2020
- SANDISK TECHNOLOGIES LLC
- Yoshitaka Otsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING EYE-SHAPED CONTACT VIA S...
- Publication number 20200312863
- Publication date Oct 1, 2020
- SANDISK TECHNOLOGIES LLC
- Takaaki IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING A POLYGONAL LATTICE OF S...
- Publication number 20200303398
- Publication date Sep 24, 2020
- SANDISK TECHNOLOGIES LLC
- Yoshitaka OTSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE INCLUDING LOCALLY THICKENED ELECTRI...
- Publication number 20200286916
- Publication date Sep 10, 2020
- SANDISK TECHNOLOGIES LLC
- Naoto Hojo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-TIER THREE-DIMENSIONAL MEMORY DEVICE WITH DIELECTRIC SUPPORT...
- Publication number 20200127005
- Publication date Apr 23, 2020
- SANDISK TECHNOLOGIES LLC
- Yoshitaka OTSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-TIER THREE-DIMENSIONAL MEMORY DEVICE WITH DIELECTRIC SUPPORT...
- Publication number 20200127006
- Publication date Apr 23, 2020
- SANDISK TECHNOLOGIES LLC
- Yoshitaka OTSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL MEMORY DEVICE HAVING DOUBLE-WIDTH STAIRCASE REGIO...
- Publication number 20190348435
- Publication date Nov 14, 2019
- SANDISK TECHNOLOGIES LLC
- Koichiro Nagata
- H01 - BASIC ELECTRIC ELEMENTS

Yoshitaka Otsu

Person

Patents Grantslast 30 patents

Three-dimensional memory device with dielectric isolated via struct...

Three-dimensional memory device containing a capped isolation trenc...

Three-dimensional memory device with via structures surrounded by p...

Multi-tier three-dimensional memory device with dielectric support...

Three-dimensional memory device including multi-tier moat isolation...

Three-dimensional memory device including through-memory-level via...

Three-dimensional memory device including locally thickened electri...

Three-dimensional memory device with via structures surrounded by p...

Three-dimensional memory device containing width-modulated connecti...

Three-dimensional memory device containing eye-shaped contact via s...

Multi-tier three-dimensional memory device with dielectric support...

Multi-tier three-dimensional memory device with dielectric support...

Three-dimensional memory device containing a polygonal lattice of s...

Three-dimensional memory device containing direct source contact st...

Three-dimensional memory device containing eye-shaped contact via s...

Three-dimensional memory device containing through-array contact vi...

Three-dimensional memory device containing through-array contact vi...

Three-dimensional memory device having double-width staircase regio...

Three-dimensional memory device including locally thickened electri...

Three-dimensional memory device having double-width staircase regio...

Patents Applicationslast 30 patents

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING INVERTED STAIRCASE AND M...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING A CAPPED ISOLATION TRENC...

THREE-DIMENSIONAL MEMORY DEVICE WITH DIELECTRIC ISOLATED VIA STRUCT...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING MULTI-TIER MOAT ISOLATION...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING THROUGH-MEMORY-LEVEL VIA...

THREE-DIMENSIONAL MEMORY DEVICE WITH DIELECTRIC ISOLATED VIA STRUCT...

THREE-DIMENSIONAL MEMORY DEVICE WITH VIA STRUCTURES SURROUNDED BY P...

THREE-DIMENSIONAL MEMORY DEVICE WITH VIA STRUCTURES SURROUNDED BY P...

THREE-DIMENSIONAL MEMORY DEVICE WITH VIA STRUCTURES SURROUNDED BY P...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING WIDTH-MODULATED CONNECTI...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING THROUGH-ARRAY CONTACT VI...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING THROUGH-ARRAY CONTACT VI...

MULTI-TIER THREE-DIMENSIONAL MEMORY DEVICE WITH DIELECTRIC SUPPORT...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING DIRECT SOURCE CONTACT ST...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING EYE-SHAPED CONTACT VIA S...

THREE-DIMENSIONAL MEMORY DEVICE HAVING DOUBLE-WIDTH STAIRCASE REGIO...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING EYE-SHAPED CONTACT VIA S...

THREE-DIMENSIONAL MEMORY DEVICE CONTAINING A POLYGONAL LATTICE OF S...

THREE-DIMENSIONAL MEMORY DEVICE INCLUDING LOCALLY THICKENED ELECTRI...

MULTI-TIER THREE-DIMENSIONAL MEMORY DEVICE WITH DIELECTRIC SUPPORT...

MULTI-TIER THREE-DIMENSIONAL MEMORY DEVICE WITH DIELECTRIC SUPPORT...

THREE-DIMENSIONAL MEMORY DEVICE HAVING DOUBLE-WIDTH STAIRCASE REGIO...