Yoshitaka Otsuka

Person

Kumamoto-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bonding system
- Patent number 12,198,963
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding system and bonding method
- Patent number 11,817,338
- Issue date Nov 14, 2023
- Tokyo Electron Limited
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 11,417,543
- Issue date Aug 16, 2022
- Tokyo Electron Limited
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,985,132
- Issue date Apr 20, 2021
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Foreign substance removal apparatus and foreign substance detection...
- Patent number 10,946,419
- Issue date Mar 16, 2021
- Tokyo Electron Limited
- Osamu Hirakawa
- B08 - CLEANING
Information Patent Grant
Substrate processing apparatus and manufacturing method of substrat...
- Patent number 10,833,045
- Issue date Nov 10, 2020
- Tokyo Electron Limited
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,756,046
- Issue date Aug 25, 2020
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,438,920
- Issue date Oct 8, 2019
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Foreign substance removal apparatus and foreign substance detection...
- Patent number 10,160,015
- Issue date Dec 25, 2018
- Tokyo Electron Limited
- Osamu Hirakawa
- B08 - CLEANING
Information Patent Grant
Coating method and coating unit
- Patent number 8,307,778
- Issue date Nov 13, 2012
- Tokyo Electron Limited
- Toshifumi Inamasu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING SYSTEM
- Publication number 20240047257
- Publication date Feb 8, 2024
- TOKYO ELECTRON LIMITED
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20230086738
- Publication date Mar 23, 2023
- TOKYO ELECTRON LIMITED
- Tokutarou HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING SYSTEM AND INSPECTION METHOD OF INSPECTING COMBINED SUBSTRATE
- Publication number 20220415673
- Publication date Dec 29, 2022
- TOKYO ELECTRON LIMITED
- Yoshitaka Otsuka
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BONDING SYSTEM AND BONDING METHOD
- Publication number 20210050243
- Publication date Feb 18, 2021
- TOKYO ELECTRON LIMITED
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Apparatus, Bonding System, Bonding Method and Storage Medium
- Publication number 20200343216
- Publication date Oct 29, 2020
- TOKYO ELECTRON LIMITED
- Yoshitaka OTSUKA
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20200020553
- Publication date Jan 16, 2020
- TOKYO ELECTRON LIMITED
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Apparatus, Bonding System, Bonding Method and Storage Medium
- Publication number 20190385973
- Publication date Dec 19, 2019
- TOKYO ELECTRON LIMITED
- Yoshitaka OTSUKA
- B32 - LAYERED PRODUCTS
Information Patent Application
FOREIGN SUBSTANCE REMOVAL APPARATUS AND FOREIGN SUBSTANCE DETECTION...
- Publication number 20190105691
- Publication date Apr 11, 2019
- TOKYO ELECTRON LIMITED
- Osamu HIRAKAWA
- B08 - CLEANING
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND MANUFACTURING METHOD OF SUBSTRAT...
- Publication number 20180342479
- Publication date Nov 29, 2018
- TOKYO ELECTRON LIMITED
- Yoshitaka Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD AND STORAGE MEDIUM
- Publication number 20180158796
- Publication date Jun 7, 2018
- TOKYO ELECTRON LIMITED
- Yoshitaka OTSUKA
- B32 - LAYERED PRODUCTS
Information Patent Application
FOREIGN SUBSTANCE REMOVAL APPARATUS AND FOREIGN SUBSTANCE DETECTION...
- Publication number 20160296982
- Publication date Oct 13, 2016
- TOKYO ELECTRON LIMITED
- Osamu HIRAKAWA
- B08 - CLEANING
Information Patent Application
COATING METHOD AND COATING UNIT
- Publication number 20090311434
- Publication date Dec 17, 2009
- TOKYO ELECTRON LIMITED
- Toshifumi Inamasu
- H01 - BASIC ELECTRIC ELEMENTS

Yoshitaka Otsuka

Person

Patents Grantslast 30 patents

Bonding system

Bonding system and bonding method

Bonding apparatus and bonding method

Bonding apparatus, bonding system, bonding method and storage medium

Foreign substance removal apparatus and foreign substance detection...

Substrate processing apparatus and manufacturing method of substrat...

Bonding apparatus, bonding system, bonding method and storage medium

Bonding apparatus, bonding system, bonding method and storage medium

Foreign substance removal apparatus and foreign substance detection...

Coating method and coating unit

Patents Applicationslast 30 patents

BONDING SYSTEM

BONDING APPARATUS AND BONDING METHOD

BONDING SYSTEM AND INSPECTION METHOD OF INSPECTING COMBINED SUBSTRATE

BONDING SYSTEM AND BONDING METHOD

Bonding Apparatus, Bonding System, Bonding Method and Storage Medium

BONDING APPARATUS AND BONDING METHOD

Bonding Apparatus, Bonding System, Bonding Method and Storage Medium

FOREIGN SUBSTANCE REMOVAL APPARATUS AND FOREIGN SUBSTANCE DETECTION...

SUBSTRATE PROCESSING APPARATUS AND MANUFACTURING METHOD OF SUBSTRAT...

BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD AND STORAGE MEDIUM

FOREIGN SUBSTANCE REMOVAL APPARATUS AND FOREIGN SUBSTANCE DETECTION...

COATING METHOD AND COATING UNIT