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Yoshitaka Toyoda

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  • Saitama, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Lead-free solder paste
    • Patent number 9,770,786
    • Issue date Sep 26, 2017
    • Senju Metal Industry Co., Ltd.
    • Yoshitaka Toyoda
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder alloy
    • Patent number 8,216,395
    • Issue date Jul 10, 2012
    • Senju Metal Industry Co., Ltd.
    • Osamu Munekata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder paste and printed circuit board
    • Patent number 7,681,777
    • Issue date Mar 23, 2010
    • Senju Metal Industry Co., Ltd.
    • Masahiko Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder alloy
    • Patent number 7,682,468
    • Issue date Mar 23, 2010
    • Senju Metal Industry Co., Ltd.
    • Osamu Munekata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder alloy
    • Patent number 7,338,567
    • Issue date Mar 4, 2008
    • Senju Metal Industry Co., Ltd.
    • Osamu Munekata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder and soldered article
    • Patent number 7,282,174
    • Issue date Oct 16, 2007
    • Senju Metal Industry Co., Ltd.
    • Masahiko Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder
    • Patent number 7,282,175
    • Issue date Oct 16, 2007
    • Senju Metal Industry Co., Ltd.
    • Masazumi Amagai
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder alloy
    • Patent number 7,029,542
    • Issue date Apr 18, 2006
    • Senju Metal Industry Co., Ltd.
    • Masazumi Amagai
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder paste
    • Patent number 6,554,180
    • Issue date Apr 29, 2003
    • Senju Metal Industry Co., Ltd.
    • Rikiya Katoh
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Lead-free solder alloys
    • Patent number 6,503,338
    • Issue date Jan 7, 2003
    • Senju Metal Industry Co., Ltd.
    • Toshihiko Taguchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Solder paste for chip components
    • Patent number 6,050,480
    • Issue date Apr 18, 2000
    • Senju Metal Industry, Co., Ltd.
    • Toshihiko Taguchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    LEAD-FREE SOLDER PASTE
    • Publication number 20130098506
    • Publication date Apr 25, 2013
    • Yoshitaka Toyoda
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    Lead-free solder alloy
    • Publication number 20100297470
    • Publication date Nov 25, 2010
    • Senju Metal Industry Co., Ltd.
    • Osamu Munekata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead-free solder alloy
    • Publication number 20080061117
    • Publication date Mar 13, 2008
    • Senju Metal Industry Co., Ltd.
    • Osamu Munekata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Solder paste and printed board
    • Publication number 20060261131
    • Publication date Nov 23, 2006
    • Masahiko Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead-free solder and soldered article
    • Publication number 20060102690
    • Publication date May 18, 2006
    • Masahiko Hirata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead-free solder alloy
    • Publication number 20050036902
    • Publication date Feb 17, 2005
    • Masazumi Amagai
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead-free solder
    • Publication number 20040262779
    • Publication date Dec 30, 2004
    • Masazumi Amagai
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead-free solder alloy
    • Publication number 20040062679
    • Publication date Apr 1, 2004
    • Senju Metal Industry Co., Ltd.
    • Osamu Munekata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead-free solder alloys
    • Publication number 20030021719
    • Publication date Jan 30, 2003
    • Senju Metal Industry Co., Ltd.
    • Toshihiko Taguchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Lead-free solder alloy
    • Publication number 20030021718
    • Publication date Jan 30, 2003
    • Osamu Munekata
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...