Yoshito ARAI

Person

Suita-shi, Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Adhesive tape, method for immobilizing electronic device component...
- Patent number 11,912,905
- Issue date Feb 27, 2024
- Sekisui Chemical Co., Ltd.
- Aya Adachi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive tape, method for fixing electronic device component or on-...
- Patent number 11,802,224
- Issue date Oct 31, 2023
- Sekisui Chemical Co., Ltd.
- Aya Adachi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
CHLORINATED VINYL-CHLORIDE-BASED RESIN, RESIN COMPOSITION FOR MOLDI...
- Publication number 20240368316
- Publication date Nov 7, 2024
- Sekisui Chemical Co., Ltd
- Kento MURAKAMI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE TAPE, METHOD FOR IMMOBILIZING ELECTRONIC DEVICE COMPONENT...
- Publication number 20230212441
- Publication date Jul 6, 2023
- Sekisui Chemical Co., Ltd
- Aya ADACHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE TAPE, METHOD FOR FIXING ELECTRONIC DEVICE COMPONENT OR ON-...
- Publication number 20230212442
- Publication date Jul 6, 2023
- Sekisui Chemical Co., Ltd
- Aya ADACHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLYVINYL ACETAL RESIN
- Publication number 20230002286
- Publication date Jan 5, 2023
- Sekisui Chemical Co., Ltd
- Kazuto NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDING RESIN COMPOSITION AND MOLDED ARTICLE
- Publication number 20220363887
- Publication date Nov 17, 2022
- Sekisui Chemical Co., Ltd
- Mitsuo MATSUMOTO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION FOR MOLDING AND MOLDED ARTICLE
- Publication number 20220348755
- Publication date Nov 3, 2022
- Sekisui Chemical Co., Ltd
- Tomohiro HORINOUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POLYOLEFIN RESIN FOAM SHEET
- Publication number 20210395476
- Publication date Dec 23, 2021
- SEKISUI CHEMICAL CO., LTD.
- Asami NAGAI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Yoshito ARAI

Person

Patents Grantslast 30 patents

Adhesive tape, method for immobilizing electronic device component...

Adhesive tape, method for fixing electronic device component or on-...

Patents Applicationslast 30 patents

CHLORINATED VINYL-CHLORIDE-BASED RESIN, RESIN COMPOSITION FOR MOLDI...

ADHESIVE TAPE, METHOD FOR IMMOBILIZING ELECTRONIC DEVICE COMPONENT...

ADHESIVE TAPE, METHOD FOR FIXING ELECTRONIC DEVICE COMPONENT OR ON-...

POLYVINYL ACETAL RESIN

MOLDING RESIN COMPOSITION AND MOLDED ARTICLE

RESIN COMPOSITION FOR MOLDING AND MOLDED ARTICLE

POLYOLEFIN RESIN FOAM SHEET