Yoshitsugu Abe

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Patents Grantslast 30 patents

Information Patent Grant
Method of etching silicon wafer and silicon wafer
- Patent number 6,284,670
- Issue date Sep 4, 2001
- Denso Corporation
- Yoshitsugu Abe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electrochemical etching method for silicon substrate having PN junc...
- Patent number 6,194,236
- Issue date Feb 27, 2001
- Denso Corporation
- Minekazu Sakai
- G01 - MEASURING TESTING
Information Patent Grant
Etchant, etching method using the same, and related etching apparatus
- Patent number 5,972,236
- Issue date Oct 26, 1999
- Denso Corporation
- Hiroshi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method for silicon substrates and semiconductor sensor
- Patent number 5,949,118
- Issue date Sep 7, 1999
- Nippondenso Co., Ltd.
- Minekazu Sakai
- G01 - MEASURING TESTING
Information Patent Grant
Fine processing method
- Patent number 5,899,750
- Issue date May 4, 1999
- Denso Corporation
- Hiroshi Tanaka
- H01 - BASIC ELECTRIC ELEMENTS