Yoshitsugu Matsuura

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Resin film for flexible printed circuit board, metal foil provided...
- Patent number 10,434,750
- Issue date Oct 8, 2019
- Hitachi Chemical Company, Ltd.
- Masaki Takeuchi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Flexible laminate board, process for manufacturing of the board, an...
- Patent number 8,501,279
- Issue date Aug 6, 2013
- Hitachi Chemical Company, Ltd.
- Masahiko Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Prepreg for printed wiring board, metal foil clad laminate and prin...
- Patent number 7,947,332
- Issue date May 24, 2011
- Hitachi Chemical Company, Ltd.
- Nozomu Takano
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
COMPOSITION, ADHESIVE, SINTERED BODY, JOINED BODY, AND METHOD OF PR...
- Publication number 20200071488
- Publication date Mar 5, 2020
- Hitachi Chemical Company, Ltd.
- Masaki TAKEUCHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD OF PRODUCING JOINED BODY, COMPOSITION FOR TRANSIENT LIQUID P...
- Publication number 20200071569
- Publication date Mar 5, 2020
- Hitachi Chemical Company, Ltd.
- Masaki TAKEUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
COMPOSITION, ADHESIVE, SINTERED BODY, JOINED BODY, AND METHOD OF PR...
- Publication number 20200063008
- Publication date Feb 27, 2020
- Hitachi Chemical Company, Ltd.
- Masaki TAKEUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
COMPOSITION, ADHESIVE, SINTERED BODY, JOINED BODY, AND METHOD OF PR...
- Publication number 20190300651
- Publication date Oct 3, 2019
- Hitachi Chemical Company, Ltd.
- Masaki TAKEUCHI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
RESIN FILM FOR FLEXIBLE PRINTED CIRCUIT BOARD, METAL FOIL PROVIDED...
- Publication number 20180009195
- Publication date Jan 11, 2018
- Hitachi Chemical Company, Ltd.
- Masaki TAKEUCHI
- B32 - LAYERED PRODUCTS
Information Patent Application
SUBSTRATE, METHOD FOR PRODUCING SAME, HEAT-RELEASING SUBSTRATE, AND...
- Publication number 20140093723
- Publication date Apr 3, 2014
- Masaki Takeuchi
- B32 - LAYERED PRODUCTS
Information Patent Application
FLEXIBLE LAMINATE BOARD, PROCESS FOR MANUFACTURE OF THE BOARD, AND...
- Publication number 20120244275
- Publication date Sep 27, 2012
- Masahiko SUZUKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE SHEET
- Publication number 20100196703
- Publication date Aug 5, 2010
- Yoshitsugu Matsuura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Prepreg for Printed Wiring Board, Metal Foil Clad Laminate and Prin...
- Publication number 20070277375
- Publication date Dec 6, 2007
- Nozomu Takano
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Yoshitsugu Matsuura

Person

Patents Grantslast 30 patents

Resin film for flexible printed circuit board, metal foil provided...

Flexible laminate board, process for manufacturing of the board, an...

Prepreg for printed wiring board, metal foil clad laminate and prin...

Patents Applicationslast 30 patents

COMPOSITION, ADHESIVE, SINTERED BODY, JOINED BODY, AND METHOD OF PR...

METHOD OF PRODUCING JOINED BODY, COMPOSITION FOR TRANSIENT LIQUID P...

COMPOSITION, ADHESIVE, SINTERED BODY, JOINED BODY, AND METHOD OF PR...

COMPOSITION, ADHESIVE, SINTERED BODY, JOINED BODY, AND METHOD OF PR...

RESIN FILM FOR FLEXIBLE PRINTED CIRCUIT BOARD, METAL FOIL PROVIDED...

SUBSTRATE, METHOD FOR PRODUCING SAME, HEAT-RELEASING SUBSTRATE, AND...

FLEXIBLE LAMINATE BOARD, PROCESS FOR MANUFACTURE OF THE BOARD, AND...

ADHESIVE SHEET

Prepreg for Printed Wiring Board, Metal Foil Clad Laminate and Prin...