Yoshitsugu Sakamoto

Person

Kariya-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Terminal member made of plurality of metal layers between two heat...
- Patent number 11,710,709
- Issue date Jul 25, 2023
- Denso Corporation
- Ryoichi Kaizu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder preform and a process for its manufacture
- Patent number 10,081,852
- Issue date Sep 25, 2018
- Senju Metal Industry Co., Ltd.
- Naohiko Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding material for semiconductor devices
- Patent number 8,896,119
- Issue date Nov 25, 2014
- Senju Metal Industry Co., Ltd.
- Yoshitsugu Sakamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Brazing method and brazed structure
- Patent number 8,029,918
- Issue date Oct 4, 2011
- Neomax Materials Co., Ltd.
- Tsuyoshi Hasegawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder preform and electronic component
- Patent number 7,800,230
- Issue date Sep 21, 2010
- Denso Corporation
- Naohiko Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder preform and a process for its manufacture
- Patent number 7,793,820
- Issue date Sep 14, 2010
- Senju Metal Industry Co., Ltd.
- Naohiko Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing semiconductor device having solder layer
- Patent number 7,601,625
- Issue date Oct 13, 2009
- Denso Corporation
- Chikage Noritake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing mold type semiconductor device
- Patent number 7,468,318
- Issue date Dec 23, 2008
- Denso Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having metallic plate with groove
- Patent number 7,235,876
- Issue date Jun 26, 2007
- Denso Corporation
- Tomomi Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having metal plates and semiconductor chip
- Patent number 7,215,020
- Issue date May 8, 2007
- Denso Corporation
- Yoshimi Nakase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold type semiconductor device
- Patent number 7,193,326
- Issue date Mar 20, 2007
- Denso Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Commutator and method of manufacturing the same
- Patent number 6,242,838
- Issue date Jun 5, 2001
- Denso Corporation
- Kenzo Kiyose
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Ceramic-metal junction structure and a method for manufacturing the...
- Patent number 6,121,590
- Issue date Sep 19, 2000
- Denso Corporation
- Masayuki Kobayashi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Ceramic-metal junction structure and a method for manufacturing the...
- Patent number 6,118,110
- Issue date Sep 12, 2000
- Denso Corporation
- Masayuki Kobayashi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Carbon electrode for secondary cells, a method for making the same,...
- Patent number 6,087,044
- Issue date Jul 11, 2000
- Denso Corporation
- Atsushi Iwase
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 5,614,291
- Issue date Mar 25, 1997
- Nippondenso Co., Ltd.
- Ichiharu Kondo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250118623
- Publication date Apr 10, 2025
- DENSO CORPORATION
- Ryo KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240071861
- Publication date Feb 29, 2024
- Denso Corporation
- Ryo KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230130647
- Publication date Apr 27, 2023
- DENSO CORPORATION
- Tetsuto YAMAGISHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210233871
- Publication date Jul 29, 2021
- DENSO CORPORATION
- RYOICHI KAIZU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Paste
- Publication number 20150027589
- Publication date Jan 29, 2015
- SENJU METAL INDUSTRY CO., LTD.
- Sakie Okada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding Material for Semiconductor Devices
- Publication number 20130134591
- Publication date May 30, 2013
- Yoshitsugu Sakamoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Solder preform and a process for its manufacture
- Publication number 20110068149
- Publication date Mar 24, 2011
- Senju Metal Industry Co., Ltd.
- Naohiko Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BRAZING METHOD AND BRAZED STRUCTURE
- Publication number 20100273025
- Publication date Oct 28, 2010
- NEOMAX MATERIALS CO., LTD
- Tsuyoshi Hasegawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder Preform and Electronic Component
- Publication number 20090236725
- Publication date Sep 24, 2009
- DENSO Corporation
- Naohiko Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder preform and a process for its manufacture
- Publication number 20080237301
- Publication date Oct 2, 2008
- Naohiko Hirano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing mold type semiconductor device
- Publication number 20070158850
- Publication date Jul 12, 2007
- DENSO CORPORATION
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Brazing method and brazed structure
- Publication number 20070148490
- Publication date Jun 28, 2007
- Neomax Materials Co., Ltd.
- Tsuyoshi Hasegawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device having metallic plate with groove
- Publication number 20070057373
- Publication date Mar 15, 2007
- DENSO CORPORATION
- Tomomi Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing semiconductor device having solder layer
- Publication number 20050233568
- Publication date Oct 20, 2005
- Chikage Noritake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having metal plates and semiconductor chip
- Publication number 20050093131
- Publication date May 5, 2005
- Yoshimi Nakase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mold type semiconductor device and method for manufacturing the same
- Publication number 20040256730
- Publication date Dec 23, 2004
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Brazing method, brazement, method of production of corrosion-resist...
- Publication number 20010047861
- Publication date Dec 6, 2001
- Akihiro Maeda
- F28 - HEAT EXCHANGE IN GENERAL

Yoshitsugu Sakamoto

Person

Patents Grantslast 30 patents

Terminal member made of plurality of metal layers between two heat...

Solder preform and a process for its manufacture

Bonding material for semiconductor devices

Brazing method and brazed structure

Solder preform and electronic component

Solder preform and a process for its manufacture

Method for manufacturing semiconductor device having solder layer

Method for manufacturing mold type semiconductor device

Semiconductor device having metallic plate with groove

Semiconductor device having metal plates and semiconductor chip

Mold type semiconductor device

Commutator and method of manufacturing the same

Ceramic-metal junction structure and a method for manufacturing the...

Ceramic-metal junction structure and a method for manufacturing the...

Carbon electrode for secondary cells, a method for making the same,...

Semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Solder Paste

Bonding Material for Semiconductor Devices

Solder preform and a process for its manufacture

BRAZING METHOD AND BRAZED STRUCTURE

Solder Preform and Electronic Component

Solder preform and a process for its manufacture

Method for manufacturing mold type semiconductor device

Brazing method and brazed structure

Semiconductor device having metallic plate with groove

Method for manufacturing semiconductor device having solder layer

Semiconductor device having metal plates and semiconductor chip

Mold type semiconductor device and method for manufacturing the same

Brazing method, brazement, method of production of corrosion-resist...