Yoshiyuki Arai

Person

Nagaokakyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic component integrated module
- Patent number 8,023,277
- Issue date Sep 20, 2011
- Panasonic Corporation
- Yoshiyuki Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module with embedded electronic components
- Patent number 7,876,570
- Issue date Jan 25, 2011
- Panasonic Corporation
- Masanori Minamio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module with embedded electronic components
- Patent number 7,606,047
- Issue date Oct 20, 2009
- Panasonic Corporation
- Masanori Minamio
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked chip semiconductor device and method for manufacturing the...
- Patent number 7,521,288
- Issue date Apr 21, 2009
- Panasonic Corporation
- Yoshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked chip semiconductor device and method for manufacturing the...
- Patent number 7,239,021
- Issue date Jul 3, 2007
- Matsushita Electric Industrial Co., Ltd.
- Yoshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 7,154,189
- Issue date Dec 26, 2006
- Matsushita Electric Industrial Co., Ltd.
- Kenji Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 7,138,706
- Issue date Nov 21, 2006
- Matsushita Electric Industrial Co., Ltd.
- Yoshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 6,992,396
- Issue date Jan 31, 2006
- Matsushita Electric Industrial Co., Ltd.
- Yoshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 6,905,912
- Issue date Jun 14, 2005
- Matsushita Electric Industrial Co., Ltd.
- Kenji Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 6,582,991
- Issue date Jun 24, 2003
- Matsushita Electric Industrial Co., Ltd.
- Kenji Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, IC card module using the same, and method for...
- Patent number 6,433,285
- Issue date Aug 13, 2002
- Matsushita Electronics Corporation
- Kenji Maeda
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
MODULE WITH EMBEDDED ELECTRONIC COMPONENTS
- Publication number 20100014262
- Publication date Jan 21, 2010
- PANASONIC CORPORATION
- Masanori MINAMIO
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic component integrated module and method for fabricating t...
- Publication number 20070216039
- Publication date Sep 20, 2007
- Yoshiyuki Arai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Stacked chip semiconductor device and method for manufacturing the...
- Publication number 20070187811
- Publication date Aug 16, 2007
- Matsushita Electric Industrial Co., Ltd.
- Yoshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module with embedded electronic components
- Publication number 20070086174
- Publication date Apr 19, 2007
- Masanori Minamio
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20060091563
- Publication date May 4, 2006
- Matsushita Electric Industrial Co., Ltd.
- Yoshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20050121761
- Publication date Jun 9, 2005
- Matsushita Electric Industrial Co., Ltd.
- Kenji Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacked chip semiconductor device and method for manufacturing the...
- Publication number 20050003580
- Publication date Jan 6, 2005
- Matsushita Electric Industrial Co., Ltd.
- Yoshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20040126926
- Publication date Jul 1, 2004
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Yoshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20040051168
- Publication date Mar 18, 2004
- Matsushita Electric Industrial Co., Ltd.
- Yoshiyuki Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating the same
- Publication number 20030207492
- Publication date Nov 6, 2003
- Matsushita Electric Industrial Co., Ltd.
- Kenji Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board, IC card module using the same, and method for...
- Publication number 20010025721
- Publication date Oct 4, 2001
- Kenji Maeda
- G06 - COMPUTING CALCULATING COUNTING

Yoshiyuki Arai

Person

Patents Grantslast 30 patents

Electronic component integrated module

Module with embedded electronic components

Module with embedded electronic components

Stacked chip semiconductor device and method for manufacturing the...

Stacked chip semiconductor device and method for manufacturing the...

Semiconductor device and method for fabricating the same

Semiconductor device and method for manufacturing the same

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Printed wiring board, IC card module using the same, and method for...

Patents Applicationslast 30 patents

MODULE WITH EMBEDDED ELECTRONIC COMPONENTS

Electronic component integrated module and method for fabricating t...

Stacked chip semiconductor device and method for manufacturing the...

Module with embedded electronic components

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Stacked chip semiconductor device and method for manufacturing the...

Semiconductor device and method for fabricating the same

Semiconductor device and method for manufacturing the same

Semiconductor device and method for fabricating the same

Printed wiring board, IC card module using the same, and method for...