Yoshiyuki Iwata

Person

Ibigun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing printed wiring board
- Patent number 9,420,697
- Issue date Aug 16, 2016
- Ibiden Co., Ltd.
- Yoshiyuki Iwata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive pin attached to package substrate
- Patent number 8,536,696
- Issue date Sep 17, 2013
- Ibiden Co., Ltd.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating apparatus, plating method and multilayer printed circuit board
- Patent number 8,383,956
- Issue date Feb 26, 2013
- Ibiden Co., Ltd.
- Toru Nakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating apparatus, plating method and multilayer printed circuit board
- Patent number 8,197,659
- Issue date Jun 12, 2012
- Ibiden Co., Ltd.
- Toru Nakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate with a conductive connecting pin
- Patent number 8,110,917
- Issue date Feb 7, 2012
- Ibiden Co., Ltd.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive connecting pin for package substance
- Patent number 8,035,214
- Issue date Oct 11, 2011
- Ibiden Co., Ltd.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive connecting pin and package substrate
- Patent number 7,902,659
- Issue date Mar 8, 2011
- Ibiden Co., Ltd.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating apparatus, plating method and multilayer printed circuit board
- Patent number 7,897,027
- Issue date Mar 1, 2011
- Ibiden Co., Ltd.
- Toru Nakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive connecting pins for a package substrate
- Patent number 7,847,393
- Issue date Dec 7, 2010
- Ibiden Co., Ltd.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board manufacturing method
- Patent number 7,736,457
- Issue date Jun 15, 2010
- Ibiden Co., Ltd.
- Yoshiyuki Iwata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating apparatus, plating method and multilayer printed circuit board
- Patent number 7,481,909
- Issue date Jan 27, 2009
- Ibiden Co., Ltd.
- Toru Nakai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20130177714
- Publication date Jul 11, 2013
- National University Corporation Nagoya University
- Yoshiyuki IWATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLATING APPARATUS, PLATING METHOD AND MULTILAYER PRINTED CIRCUIT BOARD
- Publication number 20120005888
- Publication date Jan 12, 2012
- IBIDEN CO., LTD.
- Toru Nakai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE
- Publication number 20100032200
- Publication date Feb 11, 2010
- IBIDEN CO., LTD.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE
- Publication number 20090314537
- Publication date Dec 24, 2009
- IBIDEN CO., LTD.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE
- Publication number 20090154131
- Publication date Jun 18, 2009
- IBIDEN CO., LTD.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PLATING APPARATUS, PLATING METHOD AND MULTILAYER PRINTED CIRCUIT BOARD
- Publication number 20090107847
- Publication date Apr 30, 2009
- IBIDEN CO., LTD.
- Toru Nakai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING APPARATUS, PLATING METHOD AND MULTILAYER PRINTED CIRCUIT BOARD
- Publication number 20090107711
- Publication date Apr 30, 2009
- IBIDEN CO., LTD.
- Toru Nakai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE
- Publication number 20090053459
- Publication date Feb 26, 2009
- IBIDEN CO., LTD.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring board manufacturing method
- Publication number 20070193679
- Publication date Aug 23, 2007
- IBIDEN CO., LTD.
- Yoshiyuki IWATA
- B32 - LAYERED PRODUCTS
Information Patent Application
Plating apparatus, plating method and multilayer printed circuit board
- Publication number 20060065534
- Publication date Mar 30, 2006
- IBIDEN CO., LTD.
- Toru Nakai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Yoshiyuki Iwata

Person

Patents Grantslast 30 patents

Method for manufacturing printed wiring board

Conductive pin attached to package substrate

Plating apparatus, plating method and multilayer printed circuit board

Plating apparatus, plating method and multilayer printed circuit board

Package substrate with a conductive connecting pin

Conductive connecting pin for package substance

Conductive connecting pin and package substrate

Plating apparatus, plating method and multilayer printed circuit board

Conductive connecting pins for a package substrate

Printed wiring board manufacturing method

Plating apparatus, plating method and multilayer printed circuit board

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PLATING APPARATUS, PLATING METHOD AND MULTILAYER PRINTED CIRCUIT BOARD

CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE

CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE

CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE

PLATING APPARATUS, PLATING METHOD AND MULTILAYER PRINTED CIRCUIT BOARD

PLATING APPARATUS, PLATING METHOD AND MULTILAYER PRINTED CIRCUIT BOARD

CONDUCTIVE CONNECTING PIN AND PACKAGE SUBSTRATE

Printed wiring board manufacturing method

Plating apparatus, plating method and multilayer printed circuit board