Yoshiyuki Kitagawa

Person

Yamanashi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Component mounting device and component mounting method
- Patent number 8,950,064
- Issue date Feb 10, 2015
- Panasonic Corporation
- Yoshiyuki Kitagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting device and component mounting method
- Patent number 8,881,384
- Issue date Nov 11, 2014
- Panasonic Corporation
- Yoshiyuki Kitagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting device and component mounting method
- Patent number 8,881,383
- Issue date Nov 11, 2014
- Panasonic Corporation
- Yoshiyuki Kitagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting apparatus and substrate conveyance method in com...
- Patent number 8,782,875
- Issue date Jul 22, 2014
- Panasonic Corporation
- Takeyuki Kawase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component mounting apparatus and substrate conveyance method in com...
- Patent number 8,510,937
- Issue date Aug 20, 2013
- Panasonic Corporation
- Takeyuki Kawase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting device
- Patent number 8,464,421
- Issue date Jun 18, 2013
- Panasonic Corporation
- Shuzo Yagi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD
- Publication number 20130000114
- Publication date Jan 3, 2013
- PANASONIC CORPORATION
- Yoshiyuki Kitagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD
- Publication number 20120324725
- Publication date Dec 27, 2012
- PANASONIC CORPORATION
- Yoshiyuki Kitagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD
- Publication number 20120317803
- Publication date Dec 20, 2012
- PANASONIC CORPORATION
- Yoshiyuki Kitagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT MOUNTING DEVICE
- Publication number 20120317798
- Publication date Dec 20, 2012
- PANASONIC CORPORATION
- Yoshiyuki Kitagawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT MOUNTING APPARATUS AND SUBSTRATE CONVEYANCE METHOD IN COM...
- Publication number 20120285012
- Publication date Nov 15, 2012
- PANASONIC CORPORATION
- Takeyuki Kawase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT MOUNTING APPARATUS AND SUBSTRATE CONVEYANCE METHOD IN COM...
- Publication number 20120272511
- Publication date Nov 1, 2012
- PANASONIC CORPORATION
- Takeyuki Kawase
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING DEVICE AND ELECTRONIC COMPONENT MOUNT...
- Publication number 20120151761
- Publication date Jun 21, 2012
- PANASONIC CORPORATION
- Shuzo Yagi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Yoshiyuki Kitagawa

Person

Patents Grantslast 30 patents

Component mounting device and component mounting method

Component mounting device and component mounting method

Component mounting device and component mounting method

Component mounting apparatus and substrate conveyance method in com...

Component mounting apparatus and substrate conveyance method in com...

Electronic component mounting device

Patents Applicationslast 30 patents

COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD

COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD

COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD

COMPONENT MOUNTING DEVICE

COMPONENT MOUNTING APPARATUS AND SUBSTRATE CONVEYANCE METHOD IN COM...

COMPONENT MOUNTING APPARATUS AND SUBSTRATE CONVEYANCE METHOD IN COM...

ELECTRONIC COMPONENT MOUNTING DEVICE AND ELECTRONIC COMPONENT MOUNT...