Yoshiyuki Mishima

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Mold for resin-sealing of semiconductor devices
- Patent number 6,530,764
- Issue date Mar 11, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Yoshiyuki Mishima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
Method for manufacturing a semiconductor device and a resin sealing...
- Publication number 20030180985
- Publication date Sep 25, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Kiyoharu Katou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mold for resin-sealing of semiconductor devices
- Publication number 20020012716
- Publication date Jan 31, 2002
- Yoshiyuki Mishima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL