Yoshiyuki Morihiro

Person

Amagasaki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Flux for soldering and solder composition comprising the same and s...
- Patent number 5,443,659
- Issue date Aug 22, 1995
- Mitsubishi Denki Kabushiki Kaisha
- Mitsuhiro Nonogaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring panel including wiring having a surface-reforming layer and...
- Patent number 5,175,399
- Issue date Dec 29, 1992
- Mitsubishi Denki Kabushiki Kaisha
- Mitsumasa Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer interconnection circuit board
- Patent number 5,034,569
- Issue date Jul 23, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Eishi Gofuku
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing hybrid integrated circuits
- Patent number 4,914,815
- Issue date Apr 10, 1990
- Mitsubishi Denki Kabushiki Kaisha
- Mitsuyuki Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated circuit substrate and method of manufacturing the...
- Patent number 4,783,642
- Issue date Nov 8, 1988
- Mitsubishi Denki Kabushiki Kaisha
- Mitsuyuki Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing multilayer circuit board
- Patent number 4,752,555
- Issue date Jun 21, 1988
- Mitsubishi Denki Kabushiki Kaisha
- Mitsuyuki Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid integrated circuit substrate and method of manufacturing the...
- Patent number 4,685,203
- Issue date Aug 11, 1987
- Mitsubishi Denki Kabushiki Kaisha
- Mitsuyuki Takada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite and circuit board having conductive layer on resin layer...
- Patent number 4,643,798
- Issue date Feb 17, 1987
- Mitsubishi Denki Kabushiki Kaisha
- Mitsuyuki Takada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing multilayer circuit board
- Patent number 4,629,681
- Issue date Dec 16, 1986
- Mitsubishi Denki Kabushiki Kaisha
- Mitsuyuki Takada
- H01 - BASIC ELECTRIC ELEMENTS

Yoshiyuki Morihiro

Person

Patents Grantslast 30 patents

Flux for soldering and solder composition comprising the same and s...

Wiring panel including wiring having a surface-reforming layer and...

Multilayer interconnection circuit board

Method for manufacturing hybrid integrated circuits

Hybrid integrated circuit substrate and method of manufacturing the...

Method of manufacturing multilayer circuit board

Hybrid integrated circuit substrate and method of manufacturing the...

Composite and circuit board having conductive layer on resin layer...

Method of manufacturing multilayer circuit board