Yoshiyuki Mukoyama

Person

Hitachi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Epoxy-modified polyamide resin
- Patent number 5,874,518
- Issue date Feb 23, 1999
- Hitachi Chemical Company, Ltd.
- Kenji Suzuki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Amid group-containing diisocyanates and amide group-containing epox...
- Patent number 5,625,026
- Issue date Apr 29, 1997
- Hitachi Chemical Company, Ltd.
- Kenji Suzuki
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Amide group-containing diisocyanates and amide group-containing epo...
- Patent number 5,591,813
- Issue date Jan 7, 1997
- Hitachi Chemical Company, Ltd.
- Kenji Suzuki
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Integrated circuit device produced with a resin layer produced from...
- Patent number 5,164,816
- Issue date Nov 17, 1992
- Hitachi Chemical Co., Ltd.
- Hiroshi Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-resistant resin paste and integrated circuit device produced b...
- Patent number 5,087,658
- Issue date Feb 11, 1992
- Hitachi Chemical Company, Ltd.
- Hiroshi Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for the production of high molecular weight polyamide-imide...
- Patent number 5,047,499
- Issue date Sep 10, 1991
- Hitachi Chemical Co., Ltd.
- Toichi Sakata
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyamide-imide resin pastes
- Patent number 5,037,862
- Issue date Aug 6, 1991
- Hitachi Chemical Company, Ltd.
- Hiroshi Nishizawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition and electrical laminate obtained therefrom
- Patent number 5,009,949
- Issue date Apr 23, 1991
- Hitachi Chemical Company, Ltd.
- Kazuyuki Tanaka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Solvent-soluble polyimide and production thereof
- Patent number 4,954,612
- Issue date Sep 4, 1990
- Hitachi Chemical Co., Ltd.
- Yoshihiro Nomura
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Polyetheramide-imide polymer composition
- Patent number 4,791,157
- Issue date Dec 13, 1988
- Hitachi Chemical Co.
- Hiroshi Nishizawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Heat resistant resin composition
- Patent number 4,614,782
- Issue date Sep 30, 1986
- Hitachi Chemical Company, Ltd.
- Hiroshi Nishizawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyamide-imide resin composition
- Patent number 4,530,975
- Issue date Jul 23, 1985
- Hitachi Chemical Company, Ltd.
- Yoshiyuki Mukoyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Liquid chromatographic column packing material
- Patent number 4,505,818
- Issue date Mar 19, 1985
- Hitachi Chemical Co., Ltd.
- Yoshiyuki Mukoyama
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Insulated wire
- Patent number 4,505,980
- Issue date Mar 19, 1985
- Hitachi Chemical Co., Ltd.
- Hiroshi Nishizawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for producing polyamide-imide resin
- Patent number 4,497,944
- Issue date Feb 5, 1985
- Hitachi Chemical Company, Ltd.
- Hiroshi Nishizawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Column packing material and production thereof
- Patent number 4,486,308
- Issue date Dec 4, 1984
- Hitachi Chemical Company, Ltd.
- Osamu Hirai
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Heat resistant resin and process for producing the same
- Patent number 4,448,844
- Issue date May 15, 1984
- Hitachi Chemical Co., Ltd.
- Yuichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for preparing polyamide-imide resin
- Patent number 4,447,589
- Issue date May 8, 1984
- Hitachi Chemical Co., Ltd.
- Hiroshi Nishizawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Heat resistant resin composition comprising reaction product of pol...
- Patent number 4,431,758
- Issue date Feb 14, 1984
- Hitachi Chemical Company, Ltd.
- Yuichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for producing particulate polymer having imide groups
- Patent number 4,427,822
- Issue date Jan 24, 1984
- Hitachi Chemical Co., Ltd.
- Hiroshi Nishizawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Special solvent column for GPC and GPC method using the same
- Patent number 4,353,801
- Issue date Oct 12, 1982
- Hitachi Chemical Company, Ltd.
- Yoshiyuki Mukoyama
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Expandable styrene series resin composition and process for product...
- Patent number 4,351,910
- Issue date Sep 28, 1982
- Hitachi Chemical Company, Ltd.
- Hatuo Sugitani
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for producing granular polymer having uniform fine particle...
- Patent number 4,323,664
- Issue date Apr 6, 1982
- Hitachi Chemical Company, Ltd.
- Yoshiyuki Mukoyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Polyamide-imide resin and its production
- Patent number 4,294,952
- Issue date Oct 13, 1981
- Hitachi Chemical Company, Ltd.
- Yoshiyuki Mukoyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Yoshiyuki Mukoyama

Person

Patents Grantslast 30 patents

Epoxy-modified polyamide resin

Amid group-containing diisocyanates and amide group-containing epox...

Amide group-containing diisocyanates and amide group-containing epo...

Integrated circuit device produced with a resin layer produced from...

Heat-resistant resin paste and integrated circuit device produced b...

Process for the production of high molecular weight polyamide-imide...

Polyamide-imide resin pastes

Resin composition and electrical laminate obtained therefrom

Solvent-soluble polyimide and production thereof

Polyetheramide-imide polymer composition

Heat resistant resin composition

Polyamide-imide resin composition

Liquid chromatographic column packing material

Insulated wire

Process for producing polyamide-imide resin

Column packing material and production thereof

Heat resistant resin and process for producing the same

Method for preparing polyamide-imide resin

Heat resistant resin composition comprising reaction product of pol...

Process for producing particulate polymer having imide groups

Special solvent column for GPC and GPC method using the same

Expandable styrene series resin composition and process for product...

Process for producing granular polymer having uniform fine particle...

Polyamide-imide resin and its production