Yoshiyuki Ogata

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Fussa-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Die bonding method and apparatus
- Patent number 7,087,457
- Issue date Aug 8, 2006
- Kabushiki Kaisha Shinkawa
- Yoshiyuki Ogata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball detection method and apparatus for wire-bonded parts
- Patent number 5,870,489
- Issue date Feb 9, 1999
- Kabushiki Kaisha Shinkawa
- Nobuto Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece conveying apparatus used with workpiece inspection device
- Patent number 5,772,040
- Issue date Jun 30, 1998
- Kabushiki Kaisha Shinkawa
- Hiromi Tomiyama
- B07 - SEPARATING SOLIDS FROM SOLIDS SORTING

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE AND MANUFACTURING M...
- Publication number 20240127423
- Publication date Apr 18, 2024
- SHINKAWA LTD.
- Yoshiyuki OGATA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Die bonding method and apparatus
- Publication number 20040157368
- Publication date Aug 12, 2004
- KABUSHIKI KAISHA SHINKAWA
- Yoshiyuki Ogata
- H01 - BASIC ELECTRIC ELEMENTS