Yoshiyuki Tanabe

Person

Chiba, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Thermoplastic resin composition for semiconductor, adhesion film, l...
- Patent number 7,843,045
- Issue date Nov 30, 2010
- Hitachi Chemical Co., Ltd.
- Kiyohide Tateoka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Punched adhesive tape for semiconductor, method of manufacturing le...
- Patent number 7,449,076
- Issue date Nov 11, 2008
- Hitachi Chemical Company, Ltd.
- Yoshiyuki Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Punched adhesive tape for semiconductor, method of manufacturing le...
- Patent number 7,273,654
- Issue date Sep 25, 2007
- Hitachi Chemical Company, Ltd.
- Yoshiyuki Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film for semiconductor, lead frame and semiconductor devic...
- Patent number 6,744,133
- Issue date Jun 1, 2004
- Hitachi Chemical Co., Ltd.
- Yoshiyuki Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive film for semiconductor, lead frame with adhesive film for...
- Patent number 6,733,880
- Issue date May 11, 2004
- Hitachi Chemical Co., Ltd.
- Yoshiyuki Tanabe
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Punched adhesive tape for semiconductor, method of manufacturing le...
- Patent number 6,523,446
- Issue date Feb 25, 2003
- Hitachi Chemical Company, Ltd.
- Yoshiyuki Tanabe
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMOPLASTIC RESIN COMPOSITION FOR SEMICONDUCTOR, ADHESION FILM, L...
- Publication number 20090091012
- Publication date Apr 9, 2009
- Kiyohide Tateoka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PUNCHED ADHESIVE TAPE FOR SEMICCONDUCTOR, METHOD OF MANUFACTURING L...
- Publication number 20090022893
- Publication date Jan 22, 2009
- Yoshiyuki Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Punched adhesive tape for semiconductor, method of manufacturing le...
- Publication number 20060027312
- Publication date Feb 9, 2006
- Yoshiyuki Tanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive film, lead frame with adhesive film, and semiconductor dev...
- Publication number 20050255278
- Publication date Nov 17, 2005
- Hidekazu Matsuura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Adhesive film for semiconductor, lead frame and semiconductor devic...
- Publication number 20030102573
- Publication date Jun 5, 2003
- Yoshiyuki Tanabe
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Punched adhesive tape for semiconductor, method of manufacturing le...
- Publication number 20030021990
- Publication date Jan 30, 2003
- Yoshiyuki Tanabe
- H01 - BASIC ELECTRIC ELEMENTS

Yoshiyuki Tanabe

Person

Patents Grantslast 30 patents

Thermoplastic resin composition for semiconductor, adhesion film, l...

Punched adhesive tape for semiconductor, method of manufacturing le...

Punched adhesive tape for semiconductor, method of manufacturing le...

Adhesive film for semiconductor, lead frame and semiconductor devic...

Adhesive film for semiconductor, lead frame with adhesive film for...

Punched adhesive tape for semiconductor, method of manufacturing le...

Patents Applicationslast 30 patents

THERMOPLASTIC RESIN COMPOSITION FOR SEMICONDUCTOR, ADHESION FILM, L...

PUNCHED ADHESIVE TAPE FOR SEMICCONDUCTOR, METHOD OF MANUFACTURING L...

Punched adhesive tape for semiconductor, method of manufacturing le...

Adhesive film, lead frame with adhesive film, and semiconductor dev...

Adhesive film for semiconductor, lead frame and semiconductor devic...

Punched adhesive tape for semiconductor, method of manufacturing le...