Yoshiyuki Wada

Person

Onojo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Plasma processing apparatus and method for using plasma processing...
- Patent number 12,165,845
- Issue date Dec 10, 2024
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shogo Okita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting method
- Patent number 9,609,760
- Issue date Mar 28, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Tsubasa Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component-mounted structure, IC card and COF package
- Patent number 9,516,749
- Issue date Dec 6, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshiyuki Wada
- G02 - OPTICS
Information Patent Grant
Image decoding device
- Patent number 9,020,047
- Issue date Apr 28, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takashi Hashimoto
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic component mounting structure
- Patent number 8,759,688
- Issue date Jun 24, 2014
- Panasonic Corporation
- Seiichi Yoshinaga
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component built-in circuit substrate and method of producing the same
- Patent number 8,499,998
- Issue date Aug 6, 2013
- Panasonic Corporation
- Yoshiyuki Wada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board with built-in component and method for manufacturing w...
- Patent number 8,418,358
- Issue date Apr 16, 2013
- Panasonic Corporation
- Yoshiyuki Wada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Components joining method and components joining structure
- Patent number 8,188,605
- Issue date May 29, 2012
- Panasonic Corporation
- Tadahiko Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Components joining method and components joining structure
- Patent number 8,018,074
- Issue date Sep 13, 2011
- Panasonic Corporation
- Tadahiko Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component mounting method and electronic component mount...
- Patent number 7,966,721
- Issue date Jun 28, 2011
- Panasonic Corporation
- Yoshiyuki Wada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Variable length code decoding apparatus and method with variation i...
- Patent number 7,728,745
- Issue date Jun 1, 2010
- Panasonic Corporation
- Yuya Shigenobu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device and method for assembling the same
- Patent number 7,446,423
- Issue date Nov 4, 2008
- Matsushita Electric Industrial Co., Ltd.
- Tadahiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and resin binder for assembling semiconductor...
- Patent number 7,071,577
- Issue date Jul 4, 2006
- Matshushita Electric Industrial Co., Ltd.
- Yoshiyuki Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor device assembly
- Patent number 6,617,675
- Issue date Sep 9, 2003
- Matsushita Electric Industrial Co., Ltd.
- Tadahiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting electronic devices
- Patent number 5,505,366
- Issue date Apr 9, 1996
- Matsushita Electric Industrial Co., Ltd.
- Toshio Nishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting an electronic part with bumps on a circuit board
- Patent number 5,489,750
- Issue date Feb 6, 1996
- Matsushita Electric Industrial Co., Ltd.
- Shoji Sakemi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PLASMA PROCESSING APPARATUS
- Publication number 20250022682
- Publication date Jan 16, 2025
- Panasonic Intellectual Property Management Co., Ltd.
- Shogo OKITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS AND METHOD FOR USING PLASMA PROCESSING...
- Publication number 20230170186
- Publication date Jun 1, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Shogo OKITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE AND METHOD OF MANUFACT...
- Publication number 20150373845
- Publication date Dec 24, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Yoshiyuki WADA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT-MOUNTED STRUCTURE, IC CARD AND COF PACKAGE
- Publication number 20150163903
- Publication date Jun 11, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Yoshiyuki Wada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...
- Publication number 20140231492
- Publication date Aug 21, 2014
- PANASONIC CORPORATION
- Tsubasa Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...
- Publication number 20140096379
- Publication date Apr 10, 2014
- PANASONIC CORPORATION
- Tsubasa Saeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING METHOD
- Publication number 20120309133
- Publication date Dec 6, 2012
- PANASONIC CORPORATION
- Yoshiyuki Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENTS JOINING METHOD AND COMPONENTS JOINING STRUCTURE
- Publication number 20110284265
- Publication date Nov 24, 2011
- PANASONIC CORPORATION
- Tadahiko Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMAGE DECODING DEVICE
- Publication number 20100266049
- Publication date Oct 21, 2010
- Takashi Hashimoto
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
WIRING BOARD WITH BUILT-IN COMPONENT AND METHOD FOR MANUFACTURING W...
- Publication number 20100206621
- Publication date Aug 19, 2010
- PANASONIC CORPORATION
- Yoshiyuki Wada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CODING RATE CONVERSION APPARATUS, CODING RATE CONVERSION METHOD, AN...
- Publication number 20100091842
- Publication date Apr 15, 2010
- Hiroshi Ikeda
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
COMPONENT BUILT-IN CIRCUIT SUBSTRATE AND METHOD OF PRODUCING THE SAME
- Publication number 20100089628
- Publication date Apr 15, 2010
- PANASONIC CORPORATION
- Yoshiyuki WADA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC COMPONENT MOUNTING STRUCTURE
- Publication number 20100000773
- Publication date Jan 7, 2010
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Yoshinaga
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
COMPONENTS JOINING METHOD AND COMPONENTS JOINING STRUCTURE
- Publication number 20090047534
- Publication date Feb 19, 2009
- Matsushita Electric Industrial Co., Ltd.
- Tadahiko Sakai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
VARIABLE LENGTH CODE DECODING APPARATUS
- Publication number 20080266147
- Publication date Oct 30, 2008
- Matsushita Electric Industrial Co., Ltd.
- Yuya SHIGENOBU
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CODING RATE CONVERTING APPARATUS, INTEGRATED CIRCUIT, AND METHOD, A...
- Publication number 20080260025
- Publication date Oct 23, 2008
- Yoshiyuki Wada
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method of Packaging Electronic Component
- Publication number 20070221711
- Publication date Sep 27, 2007
- Yoshiyuki Wada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic component mounting method and electronic component mount...
- Publication number 20070175969
- Publication date Aug 2, 2007
- Yoshiyuki Wada
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Solder composition, connecting process with soldering, and connecti...
- Publication number 20060043543
- Publication date Mar 2, 2006
- Yoshiyuki Wada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder composition, connecting process with soldering, and connecti...
- Publication number 20060043597
- Publication date Mar 2, 2006
- Yoshiyuki Wada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method for assembling the same
- Publication number 20050116323
- Publication date Jun 2, 2005
- Tadahiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and resin binder for assembling semiconductor...
- Publication number 20040080047
- Publication date Apr 29, 2004
- Yoshiyuki Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and semiconductor device assembly
- Publication number 20020084470
- Publication date Jul 4, 2002
- Tadahiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS

Yoshiyuki Wada

Person

Patents Grantslast 30 patents

Plasma processing apparatus and method for using plasma processing...

Electronic component mounting method

Electronic component-mounted structure, IC card and COF package

Image decoding device

Electronic component mounting structure

Component built-in circuit substrate and method of producing the same

Wiring board with built-in component and method for manufacturing w...

Components joining method and components joining structure

Components joining method and components joining structure

Electronic component mounting method and electronic component mount...

Variable length code decoding apparatus and method with variation i...

Semiconductor device and method for assembling the same

Semiconductor device and resin binder for assembling semiconductor...

Semiconductor device and semiconductor device assembly

Method for mounting electronic devices

Method of mounting an electronic part with bumps on a circuit board

Patents Applicationslast 30 patents

PLASMA PROCESSING APPARATUS

PLASMA PROCESSING APPARATUS AND METHOD FOR USING PLASMA PROCESSING...

ELECTRONIC COMPONENT MOUNTING STRUCTURE AND METHOD OF MANUFACT...

ELECTRONIC COMPONENT-MOUNTED STRUCTURE, IC CARD AND COF PACKAGE

ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...

ELECTRONIC COMPONENT MOUNTING METHOD, ELECTRONIC COMPONENT PLACEMEN...

ELECTRONIC COMPONENT MOUNTING METHOD

COMPONENTS JOINING METHOD AND COMPONENTS JOINING STRUCTURE

IMAGE DECODING DEVICE

WIRING BOARD WITH BUILT-IN COMPONENT AND METHOD FOR MANUFACTURING W...

CODING RATE CONVERSION APPARATUS, CODING RATE CONVERSION METHOD, AN...

COMPONENT BUILT-IN CIRCUIT SUBSTRATE AND METHOD OF PRODUCING THE SAME

ELECTRONIC COMPONENT MOUNTING STRUCTURE

COMPONENTS JOINING METHOD AND COMPONENTS JOINING STRUCTURE

VARIABLE LENGTH CODE DECODING APPARATUS

CODING RATE CONVERTING APPARATUS, INTEGRATED CIRCUIT, AND METHOD, A...

Method of Packaging Electronic Component

Electronic component mounting method and electronic component mount...

Solder composition, connecting process with soldering, and connecti...

Solder composition, connecting process with soldering, and connecti...

Semiconductor device and method for assembling the same

Semiconductor device and resin binder for assembling semiconductor...

Semiconductor device and semiconductor device assembly