Yoshizumi Sato

Person

Yokohama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus for manufacturing a wiring board
- Patent number 7,526,859
- Issue date May 5, 2009
- Dai Nippon Printing Co., Ltd.
- Kenji Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing a wiring board
- Patent number 7,134,193
- Issue date Nov 14, 2006
- Dai Nippon Printing Co., Ltd.
- Kenji Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for manufacturing a wiring board
- Patent number 6,865,801
- Issue date Mar 15, 2005
- Kabushiki Kaisha Toshiba
- Kenji Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and printed wiring board for semiconductor pa...
- Patent number 6,534,873
- Issue date Mar 18, 2003
- Kabushiki Kaisha Toshiba
- Yoshizumi Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for manufacturing a wiring substrate
- Patent number 6,507,995
- Issue date Jan 21, 2003
- Kabushiki Kaisha Toshiba
- Kenji Sasaoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Hybrid wiring board, semiconductor apparatus, flexible substrate, a...
- Patent number 6,329,610
- Issue date Dec 11, 2001
- Kabushiki Kaisha Toshiba
- Chiaki Takubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing printed wiring boards
- Patent number 5,865,934
- Issue date Feb 2, 1999
- Kabushiki Kaisha Toshiba
- Yuichi Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board having an interconnection penetrating an insul...
- Patent number 5,736,681
- Issue date Apr 7, 1998
- Kabushiki Kaisha Toshiba
- Yuichi Yamamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring boards and manufacturing methods thereof
- Patent number 5,407,557
- Issue date Apr 18, 1995
- Kabushiki Kaisha Toshiba
- Atsuko Iida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a three-dimensional wiring board
- Patent number 5,333,379
- Issue date Aug 2, 1994
- Kabushiki Kaisha Toshiba
- Hiroshi Odaira
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Wiring boards and manufacturing methods thereof
- Patent number 5,310,966
- Issue date May 10, 1994
- Kabushiki Kaisha Toshiba
- Atsuko Iida
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Apparatus for manufacturing a wiring board and method for manufactu...
- Publication number 20070044294
- Publication date Mar 1, 2007
- DAI NIPPON PRINTING CO., LTD.
- Kenji Sasaoka
- B32 - LAYERED PRODUCTS
Information Patent Application
Apparatus for manufacturing a wiring board and method for manufactu...
- Publication number 20050115068
- Publication date Jun 2, 2005
- Kabushiki Kaisha Toshiba
- Kenji Sasaoka
- B32 - LAYERED PRODUCTS
Information Patent Application
Hybrid wiring board, semiconductor apparatus, flexible substrate, a...
- Publication number 20020046880
- Publication date Apr 25, 2002
- Kabushiki Kaisha Toshiba
- Chiaki Takubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for manufacturing a wiring board and method for manufactu...
- Publication number 20010039720
- Publication date Nov 15, 2001
- Kabushiki Kaisha Toshiba
- Kenji Sasaoka
- B32 - LAYERED PRODUCTS

Yoshizumi Sato

Person

Patents Grantslast 30 patents

Apparatus for manufacturing a wiring board

Method for manufacturing a wiring board

Apparatus for manufacturing a wiring board

Semiconductor package and printed wiring board for semiconductor pa...

Apparatus for manufacturing a wiring substrate

Hybrid wiring board, semiconductor apparatus, flexible substrate, a...

Method of manufacturing printed wiring boards

Printed wiring board having an interconnection penetrating an insul...

Wiring boards and manufacturing methods thereof

Method of producing a three-dimensional wiring board

Wiring boards and manufacturing methods thereof

Patents Applicationslast 30 patents

Apparatus for manufacturing a wiring board and method for manufactu...

Apparatus for manufacturing a wiring board and method for manufactu...

Hybrid wiring board, semiconductor apparatus, flexible substrate, a...

Apparatus for manufacturing a wiring board and method for manufactu...