Yosuke ISHIHARA

Person

Omuta-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Package accommodating heat dissipation substrate and packing box
- Patent number 11,912,489
- Issue date Feb 27, 2024
- DENKA COMPANY LIMITED
- Hiroaki Ota
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Heat dissipation member
- Patent number 11,903,168
- Issue date Feb 13, 2024
- DENKA COMPANY LIMITED
- Yosuke Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipation component and method for manufacturing same
- Patent number 11,682,604
- Issue date Jun 20, 2023
- DENKA COMPANY LIMITED
- Daisuke Goto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Aluminum-diamond-based composite and method for producing same
- Patent number 10,751,912
- Issue date Aug 25, 2020
- DENKA COMPANY LIMITED
- Hiroaki Ota
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Aluminum-diamond-based composite and heat dissipation component
- Patent number 10,640,853
- Issue date May 5, 2020
- DENKA COMPANY LIMITED
- Yosuke Ishihara
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Heat dissipation component and method for manufacturing same
- Patent number 10,636,723
- Issue date Apr 28, 2020
- DENKA COMPANY LIMITED
- Daisuke Goto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Heat dissipation component for semiconductor element
- Patent number 10,539,379
- Issue date Jan 21, 2020
- DENKA COMPANY LIMITED
- Yosuke Ishihara
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Heat dissipation component for semiconductor element
- Patent number 10,541,189
- Issue date Jan 21, 2020
- DENKA COMPANY LIMITED
- Yosuke Ishihara
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Composite body and method for manufacturing same
- Patent number 10,358,704
- Issue date Jul 23, 2019
- DENKA COMPANY LIMITED
- Yosuke Ishihara
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Aluminum-diamond composite, and heat dissipating component using same
- Patent number 10,302,375
- Issue date May 28, 2019
- DENKA COMPANY LIMITED
- Yosuke Ishihara
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Heat dissipating component for semiconductor element
- Patent number 9,524,918
- Issue date Dec 20, 2016
- DENKA COMPANY LIMITED
- Hideki Hirotsuru
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Composite substrate for LED light emitting element, method of produ...
- Patent number 9,387,532
- Issue date Jul 12, 2016
- DENKA COMPANY LIMITED
- Hideki Hirotsuru
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Clad material for LED light-emitting element holding substrate, and...
- Patent number 9,299,888
- Issue date Mar 29, 2016
- DENKA COMPANY LIMITED
- Yosuke Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer for LED mounting, method for manufacturing same, and LED-moun...
- Patent number 8,890,189
- Issue date Nov 18, 2014
- Denki Kagaku Kogyo Kabushiki Kaisha
- Hideki Hirotsuru
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
PRODUCTION METHOD FOR ALUMINUM-DIAMOND COMPOSITE
- Publication number 20240226997
- Publication date Jul 11, 2024
- DENKA COMPANY LIMITED
- Hiroaki OTA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
HEAT DISSIPATION MEMBER
- Publication number 20220124936
- Publication date Apr 21, 2022
- DENKA COMPANY LIMITED
- Yosuke ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE ACCOMMODATING HEAT DISSIPATION SUBSTRATE AND PACKING BOX
- Publication number 20220017282
- Publication date Jan 20, 2022
- DENKA COMPANY LIMITED
- Hiroaki OTA
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
HEAT DISSIPATION COMPONENT AND METHOD FOR MANUFACTURING SAME
- Publication number 20200335415
- Publication date Oct 22, 2020
- DENKA COMPANY LIMITED
- Daisuke GOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION COMPONENT FOR SEMICONDUCTOR ELEMENT
- Publication number 20190341330
- Publication date Nov 7, 2019
- DENKA COMPANY LIMITED
- Yosuke ISHIHARA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ALUMINUM-DIAMOND-BASED COMPOSITE AND HEAT DISSIPATION COMPONENT
- Publication number 20190093201
- Publication date Mar 28, 2019
- DENKA COMPANY LIMITED
- Yosuke ISHIHARA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ALUMINUM-DIAMOND-BASED COMPOSITE AND METHOD FOR PRODUCING SAME
- Publication number 20180281230
- Publication date Oct 4, 2018
- DENKA COMPANY LIMITED
- Hiroaki OTA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
HEAT DISSIPATION COMPONENT AND METHOD FOR MANUFACTURING SAME
- Publication number 20170317007
- Publication date Nov 2, 2017
- DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- Daisuke GOTO
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
HEAT DISSIPATION COMPONENT FOR SEMICONDUCTOR ELEMENT
- Publication number 20170268834
- Publication date Sep 21, 2017
- DENKA COMPANY LIMITED
- Yosuke ISHIHARA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COMPOSITE BODY AND METHOD FOR MANUFACTURING SAME
- Publication number 20170130300
- Publication date May 11, 2017
- DENKA COMPANY LIMITED
- Yosuke ISHIHARA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME
- Publication number 20170092560
- Publication date Mar 30, 2017
- DENKA COMPANY LIMITED
- Takeshi MIYAKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ALUMINUM-DIAMOND COMPOSITE, AND HEAT DISSIPATING COMPONENT USING SAME
- Publication number 20170045314
- Publication date Feb 16, 2017
- DENKA COMPANY LIMITED
- Yosuke ISHIHARA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CLAD MATERIAL FOR LED LIGHT-EMITTING ELEMENT HOLDING SUBSTRATE, AND...
- Publication number 20140339596
- Publication date Nov 20, 2014
- DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- Yosuke Ishihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATING COMPONENT FOR SEMICONDUCTOR ELEMENT
- Publication number 20140182824
- Publication date Jul 3, 2014
- DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- Hideki Hirotsuru
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WAFER FOR LED MOUNTING, METHOD FOR MANUFACTURING SAME, AND LED-MOUN...
- Publication number 20120168802
- Publication date Jul 5, 2012
- Denki Kagaku Kogyo Kabushiki Kaisha
- Hideki Hirotsuru
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COMPOSITE SUBSTRATE FOR LED LIGHT EMITTING ELEMENT, METHOD OF PRODU...
- Publication number 20110316040
- Publication date Dec 29, 2011
- DENKI KAGAKU KOGYO KABUSHIKI KAISHA
- Hideki Hirotsuru
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Yosuke ISHIHARA

Person

Patents Grantslast 30 patents

Package accommodating heat dissipation substrate and packing box

Heat dissipation member

Heat dissipation component and method for manufacturing same

Aluminum-diamond-based composite and method for producing same

Aluminum-diamond-based composite and heat dissipation component

Heat dissipation component and method for manufacturing same

Heat dissipation component for semiconductor element

Heat dissipation component for semiconductor element

Composite body and method for manufacturing same

Aluminum-diamond composite, and heat dissipating component using same

Heat dissipating component for semiconductor element

Composite substrate for LED light emitting element, method of produ...

Clad material for LED light-emitting element holding substrate, and...

Wafer for LED mounting, method for manufacturing same, and LED-moun...

Patents Applicationslast 30 patents

PRODUCTION METHOD FOR ALUMINUM-DIAMOND COMPOSITE

HEAT DISSIPATION MEMBER

PACKAGE ACCOMMODATING HEAT DISSIPATION SUBSTRATE AND PACKING BOX

HEAT DISSIPATION COMPONENT AND METHOD FOR MANUFACTURING SAME

HEAT DISSIPATION COMPONENT FOR SEMICONDUCTOR ELEMENT

ALUMINUM-DIAMOND-BASED COMPOSITE AND HEAT DISSIPATION COMPONENT

ALUMINUM-DIAMOND-BASED COMPOSITE AND METHOD FOR PRODUCING SAME

HEAT DISSIPATION COMPONENT AND METHOD FOR MANUFACTURING SAME

HEAT DISSIPATION COMPONENT FOR SEMICONDUCTOR ELEMENT

COMPOSITE BODY AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SAME

ALUMINUM-DIAMOND COMPOSITE, AND HEAT DISSIPATING COMPONENT USING SAME

CLAD MATERIAL FOR LED LIGHT-EMITTING ELEMENT HOLDING SUBSTRATE, AND...

HEAT DISSIPATING COMPONENT FOR SEMICONDUCTOR ELEMENT

WAFER FOR LED MOUNTING, METHOD FOR MANUFACTURING SAME, AND LED-MOUN...

COMPOSITE SUBSTRATE FOR LED LIGHT EMITTING ELEMENT, METHOD OF PRODU...