Yosuke KANAOKA

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Tsukuba, JP

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Patents Grantslast 30 patents

Information Patent Grant
Forming sacrificial composite materials for package-on-package arch...
- Patent number 9,793,233
- Issue date Oct 17, 2017
- Intel Corporation
- Rajasekaran Swaminathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming sacrificial composite materials for package-on-package arch...
- Patent number 9,472,519
- Issue date Oct 18, 2016
- Intel Corporation
- Rajasekaran Swaminathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming sacrificial composite materials for package-on-package arch...
- Patent number 9,006,887
- Issue date Apr 14, 2015
- Intel Corporation
- Rajasekaran Swaminathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package-on-package interconnect stiffener
- Patent number 8,513,792
- Issue date Aug 20, 2013
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FORMING SACRIFICIAL COMPOSITE MATERIALS FOR PACKAGE-ON-PACKAGE ARCH...
- Publication number 20160343680
- Publication date Nov 24, 2016
- Intel Corporation
- Rajasekaran SWAMINATHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING SACRIFICIAL COMPOSITE MATERIALS FOR PACKAGE-ON-PACKAGE ARCH...
- Publication number 20150194401
- Publication date Jul 9, 2015
- Intel Corporation
- Rajasekaran SWAMINATHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO IMPROVE LASER MARK CONTRAST ON DIE BACKSIDE FILM IN EMBE...
- Publication number 20140175657
- Publication date Jun 26, 2014
- Mihir A. Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE INTERCONNECT STIFFENER
- Publication number 20130292838
- Publication date Nov 7, 2013
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-on-package interconnect stiffener
- Publication number 20100258927
- Publication date Oct 14, 2010
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming sacrificial composite materials for package-on-package arch...
- Publication number 20100224993
- Publication date Sep 9, 2010
- Rajasekaran Swaminathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR