Yosuke KUWATA

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Toyama-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device, method of managing pa...
- Patent number 11,535,931
- Issue date Dec 27, 2022
- Kokusai Electric Corporation
- Masaya Nishida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heating part, substrate processing apparatus, and method of manufac...
- Patent number 11,198,935
- Issue date Dec 14, 2021
- Kokusai Electric Corporation
- Shinobu Sugiura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING APPARATUS, METHOD OF PROCESSING SUBSTRATE, MET...
- Publication number 20230392257
- Publication date Dec 7, 2023
- Kokusai Electric Corporation
- Masaya NISHIDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF MANAGING PA...
- Publication number 20230144886
- Publication date May 11, 2023
- Kokusai Electric Corporation
- Masaya NISHIDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, METHOD OF MANAGING PA...
- Publication number 20190390333
- Publication date Dec 26, 2019
- Kokusai Electric Corporation
- Masaya NISHIDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HEATING PART, SUBSTRATE PROCESSING APPARATUS, AND METHOD OF MANUFAC...
- Publication number 20170107620
- Publication date Apr 20, 2017
- Hitachi Kokusai Electric Inc.
- Shinobu SUGIURA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...