Yosuke NODA

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Tokushima-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Sn—Bi and copper powder conductive paste in through hole of insulat...
- Patent number 11,864,317
- Issue date Jan 2, 2024
- Nichia Corporation
- Masaaki Katsumata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate, component-mounted substrate, and methods of manu...
- Patent number 10,887,988
- Issue date Jan 5, 2021
- Nichia Corporation
- Masaaki Katsumata
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD, LIGHT EMITTING DEVICE, AND MANUFACTURING METHOD THER...
- Publication number 20230199964
- Publication date Jun 22, 2023
- Nichia Corporation.
- Yosuke NODA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF MANUFACTURING CIRCUIT SUBSTRATE AND COMPONENT-MOUNTED SU...
- Publication number 20210084763
- Publication date Mar 18, 2021
- Nichia Corporation.
- Masaaki KATSUMATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE, COMPONENT-MOUNTED SUBSTRATE, AND METHODS OF MANU...
- Publication number 20200100360
- Publication date Mar 26, 2020
- Nichia Corporation.
- Masaaki KATSUMATA
- H01 - BASIC ELECTRIC ELEMENTS