Yosuke Omori

Person

Koshi City, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bonding apparatus and bonding method
- Patent number 11,837,574
- Issue date Dec 5, 2023
- Tokyo Electron Limited
- Kenji Sugakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 11,735,465
- Issue date Aug 22, 2023
- Tokyo Electron Limited
- Kenji Sugakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method and recording medium
- Patent number 11,715,663
- Issue date Aug 1, 2023
- Tokyo Electron Limited
- Kenji Sugakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method, and recording me...
- Patent number 11,488,929
- Issue date Nov 1, 2022
- Tokyo Electron Limited
- Takashi Nakamitsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 11,482,431
- Issue date Oct 25, 2022
- Tokyo Electron Limited
- Kimio Motoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and bonding system
- Patent number 11,164,842
- Issue date Nov 2, 2021
- Tokyo Electron Limited
- Yosuke Omori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,985,132
- Issue date Apr 20, 2021
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,756,046
- Issue date Aug 25, 2020
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bonding apparatus, bonding system, bonding method and storage medium
- Patent number 10,438,920
- Issue date Oct 8, 2019
- Tokyo Electron Limited
- Yoshitaka Otsuka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bonding apparatus and bonding system
- Patent number 10,438,918
- Issue date Oct 8, 2019
- Tokyo Electron Limited
- Yosuke Omori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joining device and joining position adjustment method using joining...
- Patent number 9,263,312
- Issue date Feb 16, 2016
- Tokyo Electron Limited
- Michikazu Nakamura
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 8,434,538
- Issue date May 7, 2013
- Tokyo Electron Limited
- Naoki Akiyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND HOLDING METHOD OF SUBSTRATE
- Publication number 20240105497
- Publication date Mar 28, 2024
- TOKYO ELECTRON LIMITED
- Yosuke Omori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20240006207
- Publication date Jan 4, 2024
- TOKYO ELECTRON LIMITED
- Takashi Nakamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD, AND RECORDING ME...
- Publication number 20230026661
- Publication date Jan 26, 2023
- TOKYO ELECTRON LIMITED
- Takashi Nakamitsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20230014665
- Publication date Jan 19, 2023
- TOKYO ELECTRON LIMITED
- Kimio Motoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20210358879
- Publication date Nov 18, 2021
- TOKYO ELECTRON LIMITED
- Kenji Sugakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD AND RECORDING MEDIUM
- Publication number 20210272836
- Publication date Sep 2, 2021
- TOKYO ELECTRON LIMITED
- Kenji Sugakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20210035827
- Publication date Feb 4, 2021
- TOKYO ELECTRON LIMITED
- Kimio Motoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
- Publication number 20200365442
- Publication date Nov 19, 2020
- TOKYO ELECTRON LIMITED
- Kenji Sugakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Apparatus, Bonding System, Bonding Method and Storage Medium
- Publication number 20200343216
- Publication date Oct 29, 2020
- TOKYO ELECTRON LIMITED
- Yoshitaka OTSUKA
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDING APPARATUS AND BONDING SYSTEM
- Publication number 20190385971
- Publication date Dec 19, 2019
- TOKYO ELECTRON LIMITED
- Yosuke Omori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding Apparatus, Bonding System, Bonding Method and Storage Medium
- Publication number 20190385973
- Publication date Dec 19, 2019
- TOKYO ELECTRON LIMITED
- Yoshitaka OTSUKA
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD, AND RECORDING ME...
- Publication number 20190273063
- Publication date Sep 5, 2019
- TOKYO ELECTRON LIMITED
- Takashi Nakamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD AND STORAGE MEDIUM
- Publication number 20180158796
- Publication date Jun 7, 2018
- TOKYO ELECTRON LIMITED
- Yoshitaka OTSUKA
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDING APPARATUS AND BONDING SYSTEM
- Publication number 20180047699
- Publication date Feb 15, 2018
- TOKYO ELECTRON LIMITED
- Yosuke Omori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING DEVICE, BONDING SYSTEM, AND BONDING METHOD
- Publication number 20160001543
- Publication date Jan 7, 2016
- TOKYO ELECTRON LIMITED
- Naoki AKIYAMA
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDING DEVICE AND BONDING METHOD
- Publication number 20150017782
- Publication date Jan 15, 2015
- TOKYO ELECTRON LIMITED
- Naoki AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINING DEVICE AND JOINING POSITION ADJUSTMENT METHOD USING JOINING...
- Publication number 20140311653
- Publication date Oct 23, 2014
- TOKYO ELECTRON LIMITED
- Michikazu Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20120103533
- Publication date May 3, 2012
- TOKYO ELECTRON LIMITED
- Naoki AKIYAMA
- H01 - BASIC ELECTRIC ELEMENTS

Yosuke Omori

Person

Patents Grantslast 30 patents

Bonding apparatus and bonding method

Substrate processing apparatus and substrate processing method

Bonding apparatus, bonding system, bonding method and recording medium

Bonding apparatus, bonding system, bonding method, and recording me...

Substrate processing apparatus and substrate processing method

Bonding apparatus and bonding system

Bonding apparatus, bonding system, bonding method and storage medium

Bonding apparatus, bonding system, bonding method and storage medium

Bonding apparatus, bonding system, bonding method and storage medium

Bonding apparatus and bonding system

Joining device and joining position adjustment method using joining...

Bonding apparatus and bonding method

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING APPARATUS AND HOLDING METHOD OF SUBSTRATE

BONDING APPARATUS AND BONDING METHOD

BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD, AND RECORDING ME...

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

BONDING APPARATUS AND BONDING METHOD

BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD AND RECORDING MEDIUM

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Bonding Apparatus, Bonding System, Bonding Method and Storage Medium

BONDING APPARATUS AND BONDING SYSTEM

Bonding Apparatus, Bonding System, Bonding Method and Storage Medium

BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD, AND RECORDING ME...

BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD AND STORAGE MEDIUM

BONDING APPARATUS AND BONDING SYSTEM

BONDING DEVICE, BONDING SYSTEM, AND BONDING METHOD

BONDING DEVICE AND BONDING METHOD

JOINING DEVICE AND JOINING POSITION ADJUSTMENT METHOD USING JOINING...

BONDING APPARATUS AND BONDING METHOD