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Yosuke Sagami
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Yokohama, JP
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last 30 patents
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Patent Grant
Resin composition to seal electronic device
Patent number
4,703,338
Issue date
Oct 27, 1987
Daicel Chemical Industries, Ltd.
Yosuke Sagami
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...