Yosuke Serizawa

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Yamanashi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Film forming method, method for manufacturing semiconductor device,...
- Patent number 12,119,219
- Issue date Oct 15, 2024
- Tokyo Electron Limited
- Hiroaki Ashizawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor film forming method using hydrazine-based compound gas
- Patent number 11,348,794
- Issue date May 31, 2022
- Tokyo Electron Limited
- Hideo Nakamura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
FILM FORMING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE,...
- Publication number 20220157600
- Publication date May 19, 2022
- Tokyo Electron Limited
- Hiroaki ASHIZAWA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
FILM FORMING METHOD AND FILM FORMING APPARATUS
- Publication number 20190378723
- Publication date Dec 12, 2019
- TOKYO ELECTRON LIMITED
- Hideo Nakamura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...