Yota OTANI

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Patents Applicationslast 30 patents

Information Patent Application
ADHESIVE COMPOSITION, FILM ADHESIVE, AND SEMICONDUCTOR PACKAGE USIN...
- Publication number 20240084172
- Publication date Mar 14, 2024
- FURUKAWA ELECTRIC CO., LTD.
- Minoru MORITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING DIE ATTACH FILM AND METHOD OF PRODUCING THE SAME, AND SEMICO...
- Publication number 20220367234
- Publication date Nov 17, 2022
- FURUKAWA ELECTRIC CO., LTD.
- Yota OTANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING DIE ATTACH FILM AND METHOD OF PRODUCING THE SAME, AND SEMICO...
- Publication number 20220310547
- Publication date Sep 29, 2022
- FURUKAWA ELECTRIC CO., LTD.
- Minoru MORITA
- H01 - BASIC ELECTRIC ELEMENTS