You-Lung YEN

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic package and method of forming the same
- Patent number 12,283,537
- Issue date Apr 22, 2025
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package including a protection layer
- Patent number 12,198,999
- Issue date Jan 14, 2025
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 12,009,317
- Issue date Jun 11, 2024
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method of manufacturing the same
- Patent number 12,002,729
- Issue date Jun 4, 2024
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic carrier and method of manufacturing the same
- Patent number 12,002,743
- Issue date Jun 4, 2024
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package, semiconductor package structure, and method for...
- Patent number 11,961,831
- Issue date Apr 16, 2024
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having substrate with embedded elec...
- Patent number 11,881,448
- Issue date Jan 23, 2024
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 11,830,798
- Issue date Nov 28, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package, antenna device, and method for manufa...
- Patent number 11,830,799
- Issue date Nov 28, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for manufacturing the same
- Patent number 11,791,245
- Issue date Oct 17, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and method for manufacturing the same
- Patent number 11,791,281
- Issue date Oct 17, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and method for manufacturing the same
- Patent number 11,749,619
- Issue date Sep 5, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure, package structure and method for manufacturing...
- Patent number 11,735,433
- Issue date Aug 22, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,705,401
- Issue date Jul 18, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method for manufacturing the same
- Patent number 11,682,656
- Issue date Jun 20, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for manufacturing the same
- Patent number 11,664,339
- Issue date May 30, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 11,664,301
- Issue date May 30, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure, semiconductor package structure and method for...
- Patent number 11,631,633
- Issue date Apr 18, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package
- Patent number 11,616,007
- Issue date Mar 28, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe including conductive pillar over land of conductive layer
- Patent number 11,610,834
- Issue date Mar 21, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,574,856
- Issue date Feb 7, 2023
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl Appelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure, semiconductor package structure and method for...
- Patent number 11,545,406
- Issue date Jan 3, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate including an optically-cured dielecetric layer an...
- Patent number 11,482,480
- Issue date Oct 25, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with wettable flank and shielding layer and manu...
- Patent number 11,462,484
- Issue date Oct 4, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate and method for manufacturing the same
- Patent number 11,398,421
- Issue date Jul 26, 2022
- Advanced Semiconductor Engineering, Inc.
- Chun-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages and method of manufacturing the same
- Patent number 11,322,454
- Issue date May 3, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,322,428
- Issue date May 3, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including metal holder and method of manufactu...
- Patent number 11,322,468
- Issue date May 3, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,282,777
- Issue date Mar 22, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method for manufacturing the same
- Patent number 11,145,624
- Issue date Oct 12, 2021
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250029951
- Publication date Jan 23, 2025
- Advanced Semiconductor Engineering, Inc.
- Kay Stefan ESSIG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20230097299
- Publication date Mar 30, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE, SEMICONDUCTOR PACKAGE STRUCTURE, AND METHOD FOR...
- Publication number 20230058358
- Publication date Feb 23, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CARRIER AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230046889
- Publication date Feb 16, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230039430
- Publication date Feb 9, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20230042800
- Publication date Feb 9, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230037201
- Publication date Feb 2, 2023
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220367384
- Publication date Nov 17, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220359361
- Publication date Nov 10, 2022
- Advanced Semiconductor Engineering, Inc.
- Chun-Che Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220359363
- Publication date Nov 10, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE STRUCTURE, PACKAGE STRUCTURE AND METHOD FOR MANUFACTURIN...
- Publication number 20220336332
- Publication date Oct 20, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220328416
- Publication date Oct 13, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE, ANTENNA DEVICE, AND METHOD FOR MANUFA...
- Publication number 20220319972
- Publication date Oct 6, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE, PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING...
- Publication number 20220310410
- Publication date Sep 29, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE, SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR...
- Publication number 20220301989
- Publication date Sep 22, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20220302008
- Publication date Sep 22, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220302004
- Publication date Sep 22, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE, SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR...
- Publication number 20220115288
- Publication date Apr 14, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220115310
- Publication date Apr 14, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220115328
- Publication date Apr 14, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220037290
- Publication date Feb 3, 2022
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210335742
- Publication date Oct 28, 2021
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210327841
- Publication date Oct 21, 2021
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210296259
- Publication date Sep 23, 2021
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210296219
- Publication date Sep 23, 2021
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING PROCESS
- Publication number 20210225746
- Publication date Jul 22, 2021
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl APPELT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210202362
- Publication date Jul 1, 2021
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210183787
- Publication date Jun 17, 2021
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210166993
- Publication date Jun 3, 2021
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210118775
- Publication date Apr 22, 2021
- Advanced Semiconductor Engineering, Inc.
- You-Lung YEN
- H01 - BASIC ELECTRIC ELEMENTS

You-Lung YEN

Person

Patents Grantslast 30 patents

Electronic package and method of forming the same

Electronic package including a protection layer

Semiconductor package structure and method for manufacturing the same

Electronic package and method of manufacturing the same

Electronic carrier and method of manufacturing the same

Electronic package, semiconductor package structure, and method for...

Semiconductor package structure having substrate with embedded elec...

Semiconductor device package

Semiconductor device package, antenna device, and method for manufa...

Electronic package and method for manufacturing the same

Package substrate and method for manufacturing the same

Package substrate and method for manufacturing the same

Substrate structure, package structure and method for manufacturing...

Semiconductor package structure and method for manufacturing the same

Semiconductor device package and method for manufacturing the same

Package structure and method for manufacturing the same

Semiconductor device package

Substrate structure, semiconductor package structure and method for...

Electronic package

Leadframe including conductive pillar over land of conductive layer

Semiconductor package

Substrate structure, semiconductor package structure and method for...

Package substrate including an optically-cured dielecetric layer an...

Electronic package with wettable flank and shielding layer and manu...

Semiconductor substrate and method for manufacturing the same

Semiconductor device packages and method of manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor device including metal holder and method of manufactu...

Semiconductor package and method of manufacturing the same

Semiconductor device package and method for manufacturing the same

Patents Applicationslast 30 patents

ELECTRONIC DEVICE

ELECTRONIC PACKAGE

ELECTRONIC PACKAGE, SEMICONDUCTOR PACKAGE STRUCTURE, AND METHOD FOR...

ELECTRONIC CARRIER AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC PACKAGE AND METHOD OF FORMING THE SAME

ELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

CONDUCTIVE STRUCTURE, PACKAGE STRUCTURE AND METHOD FOR MANUFACTURIN...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE, ANTENNA DEVICE, AND METHOD FOR MANUFA...

SUBSTRATE STRUCTURE, PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING...

SUBSTRATE STRUCTURE, SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR...

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SUBSTRATE STRUCTURE, SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR...

ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME

ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING PROCESS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGES AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME