You-Ming Hsu

Person

Kaohsiung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,651,974
- Issue date May 16, 2023
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 9,000,569
- Issue date Apr 7, 2015
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 8,981,536
- Issue date Mar 17, 2015
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a carrier with a three dimensional inductor...
- Patent number 8,963,675
- Issue date Feb 24, 2015
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor structure
- Patent number 8,796,824
- Issue date Aug 5, 2014
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier with three-dimensional capacitor
- Patent number 8,772,644
- Issue date Jul 8, 2014
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating a three-dimensional inductor carrier with me...
- Patent number 8,513,772
- Issue date Aug 20, 2013
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a three-dimensional inductor carrier with me...
- Patent number 8,432,017
- Issue date Apr 30, 2013
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a carrier with a three dimensional inductor
- Patent number 8,347,490
- Issue date Jan 8, 2013
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230170301
- Publication date Jun 1, 2023
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220336233
- Publication date Oct 20, 2022
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220037166
- Publication date Feb 3, 2022
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20150091141
- Publication date Apr 2, 2015
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20150069584
- Publication date Mar 12, 2015
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER WITH THREE-DIMENSIONAL CAPACITOR
- Publication number 20140008111
- Publication date Jan 9, 2014
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A THREE-DIMENSIONAL INDUCTOR CARRIER WITH ME...
- Publication number 20130127578
- Publication date May 23, 2013
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A THREE-DIMENSIONAL INDUCTOR CARRIER WITH ME...
- Publication number 20130075860
- Publication date Mar 28, 2013
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A CARRIER WITH A THREE DIMENSIONAL INDUCTOR...
- Publication number 20130027172
- Publication date Jan 31, 2013
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A CARRIER WITH A THREE DIMENSIONAL INDUCTOR...
- Publication number 20130002387
- Publication date Jan 3, 2013
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS

You-Ming Hsu

Person

Patents Grantslast 30 patents

Semiconductor package and method of fabricating the same

Semiconductor structure

Semiconductor structure

Method for fabricating a carrier with a three dimensional inductor...

Semiconductor structure

Carrier with three-dimensional capacitor

Method for fabricating a three-dimensional inductor carrier with me...

Method for fabricating a three-dimensional inductor carrier with me...

Method for fabricating a carrier with a three dimensional inductor

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR STRUCTURE

CARRIER WITH THREE-DIMENSIONAL CAPACITOR

METHOD FOR FABRICATING A THREE-DIMENSIONAL INDUCTOR CARRIER WITH ME...

METHOD FOR FABRICATING A THREE-DIMENSIONAL INDUCTOR CARRIER WITH ME...

METHOD FOR FABRICATING A CARRIER WITH A THREE DIMENSIONAL INDUCTOR...

METHOD FOR FABRICATING A CARRIER WITH A THREE DIMENSIONAL INDUCTOR...