You Yang Ong

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Stacked integrated circuit package system
- Patent number 8,803,299
- Issue date Aug 12, 2014
- Stats Chippac Ltd.
- You Yang Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded integrated circuit package-on-package system
- Patent number 8,546,929
- Issue date Oct 1, 2013
- Stats Chippac Ltd.
- You Yang Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally enhanced semiconductor package system
- Patent number 8,415,786
- Issue date Apr 9, 2013
- Stats Chippac Ltd.
- You Yang Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded integrated circuit package system and method of manufactur...
- Patent number 8,067,832
- Issue date Nov 29, 2011
- Stats Chippac Ltd.
- You Yang Ong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package-on-package stacking system
- Patent number 7,868,434
- Issue date Jan 11, 2011
- Stats Chippac Ltd.
- Dioscoro A. Merilo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded integrated circuit package system
- Patent number 7,859,098
- Issue date Dec 28, 2010
- Stats Chippac Ltd.
- You Yang Ong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package-on-package stacking system and method of...
- Patent number 7,718,472
- Issue date May 18, 2010
- Stats Chippac Ltd.
- Dioscoro A. Merilo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package-on-package stacking system
- Patent number 7,535,086
- Issue date May 19, 2009
- Stats Chippac Ltd.
- Dioscoro A. Merilo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system including ribbon bond interconnect
- Patent number 7,443,018
- Issue date Oct 28, 2008
- Stats Chippac Ltd.
- You Yang Ong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMALLY ENHANCED SEMICONDUCTOR PACKAGE SYSTEM
- Publication number 20120187555
- Publication date Jul 26, 2012
- You Yang Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD OF MANUFACTUR...
- Publication number 20110079899
- Publication date Apr 7, 2011
- You Yang Ong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM
- Publication number 20100176497
- Publication date Jul 15, 2010
- Dioscoro A. Merilo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM
- Publication number 20090179312
- Publication date Jul 16, 2009
- Dioscoro A. Merilo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM
- Publication number 20080029858
- Publication date Feb 7, 2008
- STATS ChipPAC Ltd.
- Dioscoro A. Merilo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED INTEGRATED CIRCUIT PACKAGE SYSTEM
- Publication number 20070246806
- Publication date Oct 25, 2007
- STATS ChipPAC Ltd.
- You Yang Ong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDED INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE SYSTEM
- Publication number 20070246813
- Publication date Oct 25, 2007
- STATS ChipPAC Ltd.
- You Yang Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM
- Publication number 20070200248
- Publication date Aug 30, 2007
- STATS ChipPAC Ltd.
- You Yang Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING RIBBON BOND INTERCONNECT
- Publication number 20070108601
- Publication date May 17, 2007
- STATS ChipPAC Ltd.
- You Yang Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKABLE POWER SEMICONDUCTOR PACKAGE SYSTEM
- Publication number 20070108560
- Publication date May 17, 2007
- STATS ChipPAC Ltd.
- Wai Kwong Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY ENHANCED POWER SEMICONDUCTOR PACKAGE SYSTEM
- Publication number 20070108564
- Publication date May 17, 2007
- Wai Kwong Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM USING ETCHED LEADFRAME
- Publication number 20070085199
- Publication date Apr 19, 2007
- STATS ChipPAC Ltd.
- You Yang Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INDEXING SYSTEM
- Publication number 20070071583
- Publication date Mar 29, 2007
- STATS ChipPAC Ltd.
- You Yang Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-LEADED INTEGRATED CIRCUIT PACKAGE SYSTEM
- Publication number 20060180904
- Publication date Aug 17, 2006
- STATS ChipPAC Ltd.
- You Yang Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYPER THERMALLY ENHANCED SEMICONDUCTOR PACKAGE SYSTEM
- Publication number 20060131735
- Publication date Jun 22, 2006
- STATS ChipPAC Ltd.
- You Yang Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYPER THERMALLY ENHANCED SEMICONDUCTOR PACKAGE SYSTEM
- Publication number 20060103008
- Publication date May 18, 2006
- STATS ChipPAC Ltd.
- You Yang Ong
- H01 - BASIC ELECTRIC ELEMENTS

You Yang Ong

Person

Patents Grantslast 30 patents

Stacked integrated circuit package system

Embedded integrated circuit package-on-package system

Thermally enhanced semiconductor package system

Embedded integrated circuit package system and method of manufactur...

Integrated circuit package-on-package stacking system

Embedded integrated circuit package system

Integrated circuit package-on-package stacking system and method of...

Integrated circuit package-on-package stacking system

Integrated circuit package system including ribbon bond interconnect

Patents Applicationslast 30 patents

THERMALLY ENHANCED SEMICONDUCTOR PACKAGE SYSTEM

EMBEDDED INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD OF MANUFACTUR...

INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM

INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM

INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM

EMBEDDED INTEGRATED CIRCUIT PACKAGE SYSTEM

EMBEDDED INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE SYSTEM

STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM

INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING RIBBON BOND INTERCONNECT

STACKABLE POWER SEMICONDUCTOR PACKAGE SYSTEM

THERMALLY ENHANCED POWER SEMICONDUCTOR PACKAGE SYSTEM

INTEGRATED CIRCUIT PACKAGE SYSTEM USING ETCHED LEADFRAME

SUBSTRATE INDEXING SYSTEM

NON-LEADED INTEGRATED CIRCUIT PACKAGE SYSTEM

HYPER THERMALLY ENHANCED SEMICONDUCTOR PACKAGE SYSTEM

HYPER THERMALLY ENHANCED SEMICONDUCTOR PACKAGE SYSTEM